JPH01301072A - Cutter - Google Patents

Abstract

PURPOSE:To keep off any deflection in a substrate in service as well as to cut a stone or the like neatly by performing hardening treatment linearly in plural numbers of spots on the ring-form substrate in a cutter. CONSTITUTION:On a substrate 12 of a cutter 10, hardening treatment is applied radially to it from a hole 14 in the central part, and hardness in a hardened part 12a of this substrate 12 is made larger than an unhardened part 12b, making this part 12a function as a beam. In consequence, even if force is added to the cutter 10 when a stone is cut by the cutter 10, deflection in the substrate 12 is abated, so that this stone is neatly cut off by a cutting body 16 formed in an outer peripheral edge of the substrate 12.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a cutter, and particularly to a cutter used for cutting, for example, stone.

(Prior Art) As a conventional cutter, there is one in which, for example, a cutting body containing abrasive grains such as fine diamond particles is formed on the outer peripheral edge of a ring-shaped substrate. The entire substrate used here is hardened to increase its hardness.

When using such a cutter, the object to be cut is cut by applying the cutting body to the object while rotating the cutter.

(Problem to be solved by the invention) However, in such a conventional cutter, since the entire ring body has uniform hardness, there is a possibility that the substrate may bend when force is applied to the cutter. .

When the substrate is bent in this way, the object to be cut cannot be cut properly.

Therefore, the main object of the present invention is to provide a cutter that does not easily bend even when force is applied.

(Means for Solving the Problems) The present invention provides a cutter including a ring-shaped substrate and a cutting body formed on the outer peripheral edge of the substrate. It's a cutter.

(effect) The linearly hardened portion of the substrate acts as a beam.

(Effects of the Invention) According to the present invention, even if force is applied to the cutter, the substrate is less likely to bend compared to conventional cutters. Therefore, by using the cutter of the present invention, it is possible to prevent the substrate from being bent, and it is possible to cleanly cut the object to be cut, such as stone.

The above objects, other objects, features and advantages of the present invention will become more apparent from the following detailed description of embodiments with reference to the drawings.

(Embodiment) FIG. 1 is a plan view showing an embodiment of the present invention, and FIG.
The figure is a sectional view taken along line nn of the embodiment of FIG. This cutter 10 includes a substrate 12.

A hole 14 is formed in the center of the substrate 12, through which a shaft (not shown) for holding the cutter 10 is inserted. A linear hardened portion 12a is formed on this substrate 12. The hardened portion 12a is, for example, the hole 1 of the substrate 12.
It is formed so as to be arranged radially from 4. Therefore, the hardened portion 12a of the substrate 12 has a greater hardness than the unhardened portion 12b of the substrate 12. The hardened portion 12a of the substrate 12 is formed using, for example, a laser. Note that the outer peripheral edge of the substrate 12 is formed to be thin in order to securely attach a cutting body to be described later.

A cutting body 16 is formed on the outer peripheral edge of this substrate 12.

The cutting body 16 is formed by fixing abrasive grains such as fine diamond particles using an electrodeposition method or the like. The object to be cut is cut by this cutting body 16 .

The cutting body 16 is made into a ring by pressurizing a mixture of 1 to 50% by volume of fine diamond particles, 30 to 50% of copper powder, 30 to 50% of iron powder, and 5 to 10% of tin powder. It may be formed by forming a green compact in the form of a shape, arranging the green compact on the outer peripheral edge of the substrate 12, and sintering the green compact.

When using this cutter IO, the cutter 10 is rotated and applied to an object to be cut, such as stone. By doing so, the object to be cut is cut by the cutting body 16.

The substrate 12 of this cutter 10 is hardened radially from the central hole 4. Therefore, the hardened portion 12a of the substrate 12 has a greater hardness than the unhardened portion 12b, and this portion acts as a beam. Therefore, even if force is applied to the cutter 10, the substrate 12 is not easily bent, and cutting defects due to such bending are less likely to occur.

In the above embodiment, the hardening process was performed radially from the hole 14 in the center of the substrate 12, but the hardening process may be applied to the substrate 12 in a grid pattern as shown in FIG.

In this way, even if the lattice-shaped hardened portions 12a are formed on the substrate 12, the substrate 12 can be prevented from being bent due to external force. That is, by forming the linear hardened portions 12a at multiple locations on the substrate 12, it is possible to prevent the substrate 12 from being bent due to external force.

Further, in the above-described embodiment, fine diamond particles are used as the abrasive grains used in the cutting body 16, but other abrasive grains such as cubic boron nitride (CBN) may also be used.

[Brief explanation of the drawing]

FIG. 1 is a plan view showing an embodiment of the present invention. FIG. 2 is a sectional view taken along line 1l-ff of the embodiment in FIG. FIG. 3 is a plan view showing another embodiment of the cutter shown in FIG. 1. In the figure, 10 is a cutter, 12 is a substrate, 12a is a hardened portion of the substrate, and 16 is a cutting body.

Claims (1)

[Scope of Claim] A cutter including a ring-shaped substrate and a cutting body formed on an outer peripheral edge of the substrate, the cutter having a plurality of locations on the substrate subjected to linear hardening treatment.