JPH0241875A - Cutter - Google Patents
CutterInfo
- Publication number
- JPH0241875A JPH0241875A JP19404888A JP19404888A JPH0241875A JP H0241875 A JPH0241875 A JP H0241875A JP 19404888 A JP19404888 A JP 19404888A JP 19404888 A JP19404888 A JP 19404888A JP H0241875 A JPH0241875 A JP H0241875A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- metal plate
- cutter
- welded
- metal plates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002184 metal Substances 0.000 claims abstract description 57
- 229910052751 metal Inorganic materials 0.000 claims abstract description 57
- 239000000758 substrate Substances 0.000 claims abstract description 38
- 239000004575 stone Substances 0.000 abstract description 6
- 238000000151 deposition Methods 0.000 abstract 4
- 230000008021 deposition Effects 0.000 abstract 3
- 230000002950 deficient Effects 0.000 abstract 1
- 239000006061 abrasive grain Substances 0.000 description 4
- 229910003460 diamond Inorganic materials 0.000 description 4
- 239000010432 diamond Substances 0.000 description 4
- 239000002245 particle Substances 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910001315 Tool steel Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/02—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing
- B28D1/12—Saw-blades or saw-discs specially adapted for working stone
- B28D1/121—Circular saw blades
Landscapes
- Engineering & Computer Science (AREA)
- Mining & Mineral Resources (AREA)
- Mechanical Engineering (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
この発明はカッターに関し、特にたとえば石材などを切
断するのに用いられるカッターに関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a cutter, and particularly to a cutter used for cutting, for example, stone.
（従来技術）
第２Ａ図は、この発明の背景となる従来のカッターの一
例を示す平面図であり、第２Ｂ図は、第２Ａ図に示すカ
ッターの線■Ｂ−ＩＩＢにおける断面図である。このカ
ッター１は１枚の金属板で形成されるリング状の基板２
を含む。この基板２は、その硬度を上げるために全体に
焼入れ処理が施されている。基板２の外周側端縁には、
リング状の切削体４が形成される。この切削体４は、た
とえばダイヤモンド微粉粒などの砥粒を含む金属粉末を
焼結することによって形成される。また、この基板２の
中央部には、カッター１を保持するための軸（図示せず
）を貫通するための孔６が形成される。(Prior Art) FIG. 2A is a plan view showing an example of a conventional cutter that is the background of the present invention, and FIG. 2B is a sectional view of the cutter taken along line 2B-IIB shown in FIG. 2A. This cutter 1 has a ring-shaped substrate 2 made of a single metal plate.
including. The entire substrate 2 is hardened to increase its hardness. At the outer edge of the board 2,
A ring-shaped cutting body 4 is formed. This cutting body 4 is formed by, for example, sintering metal powder containing abrasive grains such as fine diamond particles. Further, in the center of the substrate 2, a hole 6 is formed through which a shaft (not shown) for holding the cutter 1 passes.
このようなカッターを使用する場合、カッター１を回転
させながら切削体４を被切断物に当てることによって、
被切断物が切断される。When using such a cutter, by applying the cutting body 4 to the object to be cut while rotating the cutter 1,
The object to be cut is cut.
（発明が解決しようとする課題）
しかしながら、このような従来のカッターでは、リング
状の基板全体に焼入れ処理を施すため、基板全体が均一
な硬度を有する。そのため、カッターに力が加わると基
板が歪む可能性があった。このように基板が歪むと、被
切断物をうまく切断することができなくなってしまう。(Problems to be Solved by the Invention) However, in such a conventional cutter, since the entire ring-shaped substrate is hardened, the entire substrate has uniform hardness. Therefore, when force is applied to the cutter, there is a possibility that the board may be distorted. If the substrate is distorted in this way, the object to be cut cannot be cut properly.
それゆえに、この発明の主たる目的は、力が加わっても
基板が歪みにくいカッターを提供することである。Therefore, the main object of the present invention is to provide a cutter whose substrate is less likely to be distorted even when force is applied.
（課題を解決するための手段）
この発明は、その表面に複数の突起部を有する２枚の金
属板を貼り合わせることによって形成されるリング状の
基板と、基板の外周縁に形成される切削体とを含むカッ
ターであって、基板は、方の金属板の突起部と他方の金
属板の平面部分とが溶着され、かつ他方の金属板の突起
部と一方の金属板の平面部分とが溶着されると同時に２
枚の金属板の溶着部分近傍が焼入れされた、カッターで
ある。(Means for Solving the Problems) The present invention provides a ring-shaped substrate formed by bonding together two metal plates each having a plurality of protrusions on the surface thereof, and a ring-shaped substrate formed on the outer periphery of the substrate. A cutter including a substrate, the protrusion of one metal plate and the flat part of the other metal plate are welded together, and the protrusion of the other metal plate and the flat part of the one metal plate are welded together. 2 at the same time as welding
This cutter has two metal plates that are hardened near the welded part.
（作用）
その表面に複数の突起部を有する２枚の金属板が貼り合
わせられる。この場合、一方の金属板の突起部と他方の
金属板の平面部分とが溶着され、かつ他方の金属板の突
起部分と一方の金属板の平面部分とが溶着される。この
とき、同時に溶着部分近傍に焼きが入る。これらの金属
板の溶着部分と焼入れ部分とが、基板を補強する。(Function) Two metal plates having a plurality of protrusions on their surfaces are bonded together. In this case, the protruding portion of one metal plate and the flat portion of the other metal plate are welded, and the protruding portion of the other metal plate and the flat portion of one metal plate are welded. At this time, burning occurs near the welded portion at the same time. The welded portions and hardened portions of these metal plates reinforce the substrate.
（発明の効果）
この発明によれば、２枚の金属板が溶着されると同時に
、溶着部分近傍に焼きが入る。そのため、硬度が高くな
り、かつ強度の大きい基板を得ることができる。したが
って、この発明のカッターを使用すれば、基板の歪みを
防ぐことができ、石材などの被切断物をきれいに切断す
ることができる。(Effects of the Invention) According to the present invention, at the same time as two metal plates are welded, the vicinity of the welded portion is burned. Therefore, a substrate with high hardness and high strength can be obtained. Therefore, by using the cutter of the present invention, distortion of the substrate can be prevented and objects to be cut, such as stones, can be cut cleanly.
この発明の上述の目的、その他の目的、特徴および利点
は、図面を参照して行う以下の実施例の詳細な説明から
一層明らかとなろう。The above objects, other objects, features and advantages of the present invention will become more apparent from the following detailed description of embodiments with reference to the drawings.
（実施例）
第１Ａ図は、この発明の一実施例を示す平面図であり、
第１Ｂ図は、第１Ａ図実施例の線［１３ＩＢおける切断
部端面図である。(Example) FIG. 1A is a plan view showing an example of the present invention,
FIG. 1B is an end view of the section taken along line [13IB] of the embodiment of FIG. 1A.
このカッター１０は、基板１２を含む。基板１２は、リ
ング状に形成された２枚の金属板１４および１６を貼り
合わせること延よって形成される。This cutter 10 includes a substrate 12. The substrate 12 is formed by bonding two ring-shaped metal plates 14 and 16 together.
これらの金属板１４および１６は、たとえば炭素工具鋼
やステンレス鋼などで形成される。なお、この実施例で
は、２枚の金属板１４および１６の１７みは、それぞれ
たとえば０．６−−に形成され、その直径は、たとえば
９６鰭に形成される。この基板１２の中央部には、カッ
ターＩＯを保持するための軸（図示せず）を挿通するた
めの挿通孔１８が、たとえば直径２０龍の大きさに形成
される。These metal plates 14 and 16 are made of, for example, carbon tool steel or stainless steel. In this embodiment, each of the two metal plates 14 and 16 is formed to have a diameter of, for example, 0.6 mm, and its diameter is, for example, 96 fins. An insertion hole 18 having a diameter of, for example, 20 mm is formed in the center of the substrate 12, through which a shaft (not shown) for holding the cutter IO is inserted.
この金属板１４および１６の表面には、それぞれ複数の
たとえば断面円形の突起部ｉ４ａおよび１６ａが形成さ
れる。すなわち、金属板１４の中心からたとえば１８鰭
離れた円周上に、４つの突起部１４ａが形成される。な
お、この４つの突起部１４ａは、円周を４等分した位置
にそれぞれ形成される。さらに、同様にして、金属板１
４の中心からたとえば３０ｍ１離れた円周上に、４つの
突起部１４ａがそれぞれ形成される。さらに、また、金
属板１４の中心からたとえば４２關離れた円周上に、４
つの突起部１４ａがそれぞれ形成される。A plurality of protrusions i4a and 16a each having a circular cross section, for example, are formed on the surfaces of the metal plates 14 and 16, respectively. That is, four protrusions 14a are formed on the circumference, for example, 18 fins away from the center of the metal plate 14. Note that the four protrusions 14a are formed at positions where the circumference is divided into four equal parts. Furthermore, in the same manner, metal plate 1
Four protrusions 14a are formed on the circumference, for example, 30 m1 away from the center of the four protrusions 14a. Furthermore, on the circumference, for example, 42 degrees away from the center of the metal plate 14, 4
Two protrusions 14a are formed, respectively.
したがって、この金属１４の表面には、１２個の突起部
１４ａが形成されることになる。これらの突起部１４ａ
は、たとえばその直径が３ｍｍ、金属板１４の平面部分
からの高さがＱ、５ｍｍになるように形成される。Therefore, twelve protrusions 14a are formed on the surface of the metal 14. These projections 14a
is formed so that its diameter is, for example, 3 mm, and its height from the flat part of the metal plate 14 is Q, 5 mm.
また、他方の金属板１６の表面にも、前述の金属板１４
と同様に、１２個の突起部１６ａが形成される。これら
の突起部１６ａも、金属板１４の突起部１４ａと同じ形
状、同じ大きさで、かつ同じ配列になるように形成され
る。Further, the surface of the other metal plate 16 is also coated with the metal plate 14 described above.
Similarly, 12 protrusions 16a are formed. These protrusions 16a are also formed to have the same shape, the same size, and the same arrangement as the protrusions 14a of the metal plate 14.
そして、この金属板１４と金属板１６とが貼り合わされ
る。この場合、金属板１４と金属板１６とは同心円上で
、かつ、金属板１４の円周方向にたとえば４５度回転し
た位置に、金属板１６が貼り合わされる。このとき、抵
抗溶接などで大電流を流すと、金属板１４の突起部１４
ａと金属板１６の平面部１６ｂが溶着され、かつ、金属
板１６の突起部１６ａと金属板１４の平面部１４ｂとが
溶着され、溶着部近傍に焼きが入る。このようにして基
板１２が得られる。Then, the metal plate 14 and the metal plate 16 are bonded together. In this case, the metal plate 14 and the metal plate 16 are attached to each other on a concentric circle, and the metal plate 16 is attached to a position rotated by, for example, 45 degrees in the circumferential direction of the metal plate 14. At this time, if a large current is applied during resistance welding or the like, the protrusion 14 of the metal plate 14
a and the flat part 16b of the metal plate 16 are welded, and the protruding part 16a of the metal plate 16 and the flat part 14b of the metal plate 14 are welded, and the vicinity of the welded part is hardened. In this way, the substrate 12 is obtained.
さらに、この基板１２の外周縁には、切削体２２が形成
される。この切削体２２は、たとえばダイヤモンド微粉
粒などの砥粒を電着法や粉末や合法などを用いて固着す
ることによって形成される。Furthermore, a cutting body 22 is formed on the outer peripheral edge of this substrate 12. This cutting body 22 is formed by fixing abrasive grains such as fine diamond particles using an electrodeposition method, a powder method, or the like.
この切削体２２によって被切断物が切断される。The object to be cut is cut by this cutting body 22 .
なお、切削体２２は、体積比で１〜５０％のダイヤモン
ド微粉粒、３０〜５０％の銅粉末、３０〜５０％の鉄粉
末および５〜１０％の錫粉末などの混合物を加圧してリ
ング状の圧粉体を形成し、この圧粉体を基板１２の外周
縁に配置して焼結することによって形成してもよい。The cutting body 22 is made into a ring by pressing a mixture of 1 to 50% diamond fine powder, 30 to 50% copper powder, 30 to 50% iron powder, and 5 to 10% tin powder by volume. It may be formed by forming a green compact in the form of a shape, arranging the green compact on the outer peripheral edge of the substrate 12, and sintering the green compact.
このカッター１０を使用する場合、カッターｌＯが回転
させられながら石材などの被切断物に当てられる。こう
することによって、被切断物は切削体２２によって切断
される。When using this cutter 10, the cutter 10 is rotated and applied to an object to be cut, such as stone. By doing so, the object to be cut is cut by the cutting body 22.
このカッター１０の基板１２は、金属板１４の突起部１
４ａと金属板１６の平面部１６ｂとが溶着され、かつ、
金属板１６の突起部１６ａと金属板１４の平面部１４ｂ
とが溶着される。このとき、溶着部分近傍に焼きが入り
硬度が高くなる。そのため、この溶着部分とその近傍に
よって基板１２が補強される。したがって、従来のよう
な均一な硬度を有するカッターに比べて、カッター１０
に力が加わっても基板１２が歪にくい。しがも、このカ
ッターｌＯでは、２枚の金属板を貼り合わせて基板が形
成されるので、従来の１枚の金属板からなる基板に比べ
て、強度の優れた基板を得ることができる。The substrate 12 of this cutter 10 has a projection 1 of a metal plate 14.
4a and the flat part 16b of the metal plate 16 are welded, and
Projection portion 16a of metal plate 16 and flat portion 14b of metal plate 14
and are welded together. At this time, hardening occurs near the welded part and hardness increases. Therefore, the substrate 12 is reinforced by this welded portion and its vicinity. Therefore, compared to a conventional cutter having uniform hardness, the cutter 10
The substrate 12 is not easily distorted even if force is applied to it. However, in this cutter IO, since the substrate is formed by bonding two metal plates together, it is possible to obtain a substrate with superior strength compared to a conventional substrate made of one metal plate.
したがって、このようなカッター１０を用いれば、この
カッター１０を高速に回転させ、被切断物を切断する際
に、基板１２と被切断物がこすれても基板１２が歪みに
くく、このような歪みによる切断不良が起こりにくくな
る。Therefore, if such a cutter 10 is used, even if the substrate 12 and the object to be cut rub against each other when the cutter 10 is rotated at high speed and the object to be cut is rubbed, the substrate 12 will not be easily distorted, and the substrate 12 will not be easily distorted due to such distortion. Cutting defects are less likely to occur.
なお、上述の実施例では、金属板■４および１６の表面
にそれぞれ１２個の突起部１４ａおよび１６ａを形成し
たが、これらの突起部の数や配列は任意に変更可能であ
る。In the above embodiment, 12 protrusions 14a and 16a were formed on the surfaces of metal plates 4 and 16, respectively, but the number and arrangement of these protrusions can be changed as desired.
また、上述の実施例では、切削体２２に用いられる砥粒
としてダイヤモンド微粉粒が採用されているが、それ以
外にも立方晶窒化硼素（ＣＢ Ｎ）などの砥粒を用いて
もよい。Further, in the above-described embodiment, fine diamond particles are used as the abrasive grains used in the cutting body 22, but other abrasive grains such as cubic boron nitride (CBN) may also be used.
第１Ａ図は、この発明の一実施例を示す平面図であり、
第１Ｂ図は、第１Ａ図実施例の線ＩＢ−ＩＢにおける切
断部端面図である。
第２Ａ図および第２Ｂ図は、この発明の背景となる従来
のカッターの一例を示し、第２Ａ図はその平面図であり
、第２Ｂ図は第２Ａ図に示す従来のカッター〇線１１Ｂ
−ＩＩＢにおける断面図である。
図において、１０はカッター １２は基板、１４および
１６は金属板、１４ａおよび１６ａは突起部、１４ｂお
よび１６ｂは平面部、１８は挿通孔、２２は切削体を示
す。FIG. 1A is a plan view showing an embodiment of the present invention,
FIG. 1B is an end view of the embodiment of FIG. 1A cut along line IB--IB. 2A and 2B show an example of a conventional cutter that is the background of the present invention, FIG. 2A is a plan view thereof, and FIG. 2B is a conventional cutter shown in FIG. 2A.
- It is a sectional view at IIB. In the figure, 10 is a cutter, 12 is a substrate, 14 and 16 are metal plates, 14a and 16a are protrusions, 14b and 16b are flat parts, 18 is an insertion hole, and 22 is a cutting body.
Claims (1)
わせることによって形成されるリング状の基板と、前記
基板の外周縁に形成される切削体とを含むカッターであ
って、 前記基板は、一方の前記金属板の前記突起部と他方の前
記金属板の平面部分とが溶着され、かつ他方の前記金属
板の前記突起部と一方の前記金属板の平面部分とが溶着
されると同時に２枚の前記金属板の溶着部分近傍が焼入
れされた、カッター。[Claims] A cutter including a ring-shaped substrate formed by bonding two metal plates having a plurality of protrusions on the surfaces thereof, and a cutting body formed on the outer periphery of the substrate. In the substrate, the protruding portion of one of the metal plates and the flat portion of the other metal plate are welded together, and the protruding portion of the other metal plate and the flat portion of one of the metal plates are welded together. A cutter in which the vicinity of the welded portion of the two metal plates is hardened at the same time as the two metal plates are welded.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19404888A JPH0673816B2 (en) | 1988-08-02 | 1988-08-02 | cutter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19404888A JPH0673816B2 (en) | 1988-08-02 | 1988-08-02 | cutter |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0241875A true JPH0241875A (en) | 1990-02-13 |
| JPH0673816B2 JPH0673816B2 (en) | 1994-09-21 |
Family
ID=16318076
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19404888A Expired - Lifetime JPH0673816B2 (en) | 1988-08-02 | 1988-08-02 | cutter |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0673816B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06277943A (en) * | 1993-03-30 | 1994-10-04 | Tenryu Seikiyo Kk | Manufacture of rotary saw |
| JP2008105137A (en) * | 2006-10-26 | 2008-05-08 | Hitachi Koki Co Ltd | Cutter and cutting machine equipped with the same |
-
1988
- 1988-08-02 JP JP19404888A patent/JPH0673816B2/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06277943A (en) * | 1993-03-30 | 1994-10-04 | Tenryu Seikiyo Kk | Manufacture of rotary saw |
| JP2008105137A (en) * | 2006-10-26 | 2008-05-08 | Hitachi Koki Co Ltd | Cutter and cutting machine equipped with the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0673816B2 (en) | 1994-09-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0019461B1 (en) | Abrasive bodies | |
| US3440773A (en) | Abrasive cutting device | |
| JPH06210571A (en) | Disc-shaped grinding tool | |
| JPS603523B2 (en) | Round blade tool for cutting lead wire | |
| US5058562A (en) | Rotary diamond tool for truing grinding wheel | |
| JPH0241875A (en) | Cutter | |
| KR100542160B1 (en) | Grinding wheels with a layered polishing surface | |
| JPWO2006019062A1 (en) | Rotary diamond dresser | |
| US20020178890A1 (en) | Cutting tool | |
| US5014678A (en) | Cutter | |
| JP2002326166A (en) | Electrodeposition thin blade grinding wheel, and method for manufacturing the same | |
| JPH02237759A (en) | Cutter and manufacture thereof | |
| JPH11156714A (en) | Diamond rotary dresser and manufacture thereof | |
| KR920005304Y1 (en) | Grinding type cutting wheel | |
| JPH01301072A (en) | Cutter | |
| JPH10151570A (en) | Stone polishing tool | |
| JPS62264869A (en) | Grindstone for precision processing | |
| JP3065987U (en) | Super abrasive grinding surface plate | |
| JPH01310905A (en) | Cutter | |
| JPS618278A (en) | Manufacture of grinding wheel for precise cutting | |
| JPH10329030A (en) | Manufacturing method of thin blade whetstone | |
| JP2649019B2 (en) | Super abrasive blade | |
| JPS643645Y2 (en) | ||
| JP2005288633A (en) | Cutting tool and its manufacturing method | |
| JPH04210382A (en) | Rotary cutter |