JPH01303701A - Electronic components and their manufacturing method - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a housing for electronic components and a method for manufacturing the same.

[Conventional technology]

Conventionally, rotary code switches, sliding code switches, rotary variable resistors, and sliding variable resistors that can be used in electronic devices have a board and a casing on which various patterns have been formed, and contacts that make sliding contact with the patterns on the board. A substrate is fixed to the bottom of the casing, and the slider is rotatably or slidably supported on the substrate. Each of these components, such as the board, case, and sliding type, is manufactured as a separate component, and these components are assembled in a later assembly process to complete the electronic component.

In addition, in recent years, as electronic components have become smaller and thinner, the housings of rotary code switches, sliding code switches, rotary variable resistors, and sliding variable resistors have also become smaller and thinner. .

[Problem to be solved by the invention]

However, in the conventional rotary electronic components and sliding electronic components described above, each component is manufactured separately and these components are assembled, so there is a limit to miniaturization and thinning.

Furthermore, as devices become smaller and thinner, there is a problem in that it becomes difficult to assemble each component.

In addition, in recent years, a conductive pattern for an electrode is formed on a synthetic resin film, and a resistor pattern is formed by connecting to the conductive pattern for an electrode, and a metal terminal is fixed, and the fixed metal terminal part and the back side of the synthetic resin film are formed. Electronic parts whose parts are molded with synthetic resin have been developed (for example, in Japanese Unexamined Patent Publication No. 6
2-49601).

Synthesis like this #! By manufacturing a housing for a rotary electronic component or a housing for a sliding electronic component using the technology of molding a 4-fat film with a synthetic resin, it is possible to improve the miniaturization and thinning of electronic components. Therefore, there are various problems that need to be solved. For example, when inserting a synthetic resin film with a conductive pattern on which the contacts of the slider of an electronic component slide into a resin molded case, a gap of the same shape as the resin molded case is usually formed in the opposing parts, and a gap is formed between the upper and lower parts. A pair of molds that can be separated into two molds is prepared, a synthetic resin film is inserted between the upper and lower molds, and molten resin is press-fitted into the gap. The problem is that the conductor pattern surface is covered with molten resin, making it impossible to expose the conductor pattern surface inside the resin mold case, and the terminal structure connected to the ends of various patterns formed on the top surface of the film to make it thinner. For example, should the configuration be configured like this?

The present invention has been made in view of the above points, and its purpose is to integrate a board and a case, eliminate the need for assembling the board and the case, and realize the small size required for electronic components in recent years. An object of the present invention is to provide a casing for an electronic component that can be significantly reduced in size and thickness, and a method for manufacturing the same.

[Means to solve the problem]

In order to solve the above problems, the present invention provides a housing for electronic components,
In an electronic component casing that houses a substrate on which a conductive pattern is formed, at least with which the contacts of a slider of the electronic component are formed, the substrate is at least a metal surface adhered or vapor-deposited on a synthetic resin film. A flexible substrate on which a conductor pattern is formed by etching is used, a metal terminal piece is bonded to the upper surface of the end of the conductor pattern of the flexible substrate, and a film made of a synthetic resin of the same quality as the flexible substrate is placed on top of the metal terminal piece. A terminal part having a structure in which a terminal fixing film is placed, the terminal fixing film 11 and a film of a flexible board are locally welded is provided, and the flexible board is attached to a predetermined portion from the tip of the metal terminal piece of the terminal part. The flexible board was inserted into a synthetic resin casing so as to protrude outside the casing and the conductive pattern was exposed inside the casing, and the flexible substrate and the synthetic resin casing were integrated.

The present invention also provides a method for manufacturing a housing for an electronic component, in which a flat surface of a flexible substrate made of a synthetic resin film on which a single conductor pattern is formed is brought into close contact with the casing, and a synthetic resin housing is formed around the flat surface. a first mold in which a groove forming a side part of the first mold is formed; a flat surface of the first mold disposed opposite to the first mold and a portion including at least a part of the groove; a second mold in which a concave portion is formed to form the bottom of the casing, and the flexible substrate is placed between the first mold and the second mold with its conductor pattern forming surface in the first mold. The mold was held in contact with the flat surface of the mold, and the molten resin material was press-fitted from the center of the recess of the second mold to fill the space between the first mold and the second mold. .

[Effect]

By configuring the electronic component housing and its manufacturing method as described above, the flexible board and the synthetic resin housing are integrated, so the housing can be made smaller and thinner, and the board and housing can be made smaller and thinner. No assembly required.

Additionally, it can be directly surface-mounted on a printed wiring board together with various other electronic components, making it possible to automate the mounting process.

Further, when an electronic component using this casing is mounted on a printed wiring board and soldered using flux, the flux does not travel through the terminal and enter the electronic component.

In addition, the structure of the terminal part not only strengthens the connection strength between the flexible board and the metal terminal piece, but the thickness of the terminal part is only the thickness of the flexible board plus the thickness of the metal terminal piece and the fixing resin film. This results in an extremely thin terminal structure, which allows the thickness of the electronic component housing to be reduced.

〔Example〕

Hereinafter, a case in which an embodiment of the present invention is applied to an electronic component, particularly a code switch, will be described in detail based on the drawings, but the present invention is not limited to the code switch.

FIG. 1 is a diagram showing the structure of a housing of a rotary code switch with a built-in flexible substrate according to the present invention, in which FIG. 1(A) is a back view, FIG. 1(B) is a side view, and FIG. 1(C) is a back view. is a plan view.

As shown in the figure, the housing of the rotary code switch has an external shape in which metal terminal pieces 2-1 to 2-5 constituting the terminal section 2 protrude from the side of a resin-molded housing 1. A flexible substrate 3 is inserted inside the body 1.

The resin-molded casing 1 has a circular interior, side walls 1-2 are provided at the edges, and a column 1-1 rotatably supports a rotary slider, which will be described later, at the center of the bottom. is provided. Furthermore, protrusions 1-3 and 1-4 are formed on the back surface of the housing 1, which can be molded with resin.

The flexible substrate 3 has five current collection patterns 3-1 formed by etching on the upper surface of a resin film, and an insulator pattern 3-2 formed at a predetermined portion on the current collection patterns 3-1. The current collecting pattern 3-1 and the insulating pattern 3-2 of the flexible substrate 3 are exposed at the bottom of the casing 1.

Below, the configuration of each part of the housing of the above rotary code switch,
The shape and manufacturing method will be explained.

Figures 2 and 3 show the housing 1 of the above rotary foot switch.
FIG. 3 is a diagram for explaining the structure of a flexible substrate 3 inserted therein and its manufacturing method.

The flexible substrate 3 is made by first preparing a band of thermoplastic and heat-resistant synthetic resin film, and then placing a metal foil (
eg copper or aluminum) or vapor depositing such metals onto this film. Next, this metal layer is etched to form five current collecting patterns 3-1 of a predetermined shape and lead patterns 3-5 to 3-9 continuous to the current collecting patterns 3-1, and pattern 3
A code pattern for a code switch is formed by printing and forming an insulator pattern 3-2 on a predetermined portion on -1. After forming these patterns, a portion corresponding to the flexible substrate 3 and supporting portions 10.1 at both upper and lower ends are formed.
A large number of flexible substrates 3 are cut from a synthetic resin film, except for 1, and connected by supporting parts 10 and 11.
make.

In this case, the current collection pattern 3-1 and the insulator pattern 3
It goes without saying that the formation of -2 may be performed after the synthetic resin film is cut leaving the portion corresponding to the flexible substrate 3 and the supporting portion 10.11. Further, as the synthetic resin film, for example, a film of polyparabanic acid, polyetherimide, polyethylene terephthalate, etc. is used.

Next, the metal terminal piece 2 integrally formed with the support member 20
-1 to 2-5 are prepared, and these metal terminal pieces 2-1 to 2-5 are
The tip portion of the flexible substrate 3 is placed on the hot melt type conductive adhesive layer formed on the lead patterns 3-5 to 3-9 of the flexible substrate 3.

Next, lead patterns 3-5 to 3 on the flexible substrate 3
On the metal terminal pieces 2-1 to 2-5 placed on -9,
A terminal fixing film 2-6 made of a synthetic resin film of the same quality as the flexible substrate 3 is placed, and then a metal terminal piece 2-6 is placed.
The part where 1 to 2-5 are not located (2-7 in (A) of Figure 3)
A horn for ultrasonic emission (not shown) is placed on the terminal fixing film 2, and ultrasonic waves are emitted from the horn.
-6 and the synthetic resin film forming the flexible substrate 3 are locally melted by ultrasonic heating, and the metal terminal pieces 2-1 to 2 are placed on the lead patterns 3-5 to 3-9. -5 is firmly fixed by the shrinkage force of these synthetic resin films.

Next, by heating the metal terminal pieces 2-1 to 2-5 from above the terminal fixing film 2-6 or the flexible substrate 3 with a heating iron to melt the conductive adhesive layer,
Lead patterns 3-5 to 3 with metal terminal pieces 2-1 to 2-5
-9.

Note that since the synthetic resin film is firmly melted and fixed by the ultrasonic heating, the adhesion using the conductive adhesive may be omitted in some cases.

FIG. 3(A) shows a metal terminal piece 2-5 on the lead patterns 3-5 to 3-9 at the end of the flexible substrate 3 as described above.
1 to 2-5 are fixed together, and is a plan view of FIG. 3 (
B) is a sectional view taken along the line DD.

The terminal portion 2 of the flexible substrate 3 configured as described above not only has a high connection strength between the flexible substrate 3 and the metal terminal pieces 2-1 to 2-5, but also has a thickness that is similar to that of the composite material forming the flexible substrate 3. An extremely thin terminal structure is obtained by adding only the thicknesses of the resin film, the metal terminal pieces 2-1 to 2-5, the terminal fixing film 2-6, and the slightly thicker conductive adhesive layer.

Next, a method of inserting the flexible substrate 3 having the above structure into the synthetic v14i case 1 shown in FIG. 1 will be explained.

First, as shown in FIG. 4(A), the flexible substrate 3 is sandwiched between a first mold A and a second mold B.

Here, the first mold A has a flat surface A in the center thereof.
1 is formed, a circumferential groove A2 is formed around the flat surface A1, and a cylindrical hole A3 is further formed in the center of the flat surface A1.

Here, the flat surface A1 is the surface on which the code pattern consisting of the current collecting pattern 3-1 and the insulator pattern 3-2 on the flexible substrate 3 shown in FIG. 1-2 is a groove to be formed, and hole A3 is a hole in which the support column 1-1 of the housing 1 can be completely formed.

A recess B1 is formed in the second mold B at a portion corresponding to the flat surface A1 and the circumferential groove A2 of the first mold A, and a predetermined portion of the recess B1 is formed at the end of the flexible substrate 3. A groove B2 of a predetermined width is formed to promote the flow of molten resin toward the formed terminal portion 2, and a through hole B3 is formed approximately in the center of the groove B1.

Here, the recess B1 is a recess for forming the bottom of the resin molded case 1, and the recess B2 is a recess for forming the bottom of the resin molded case 1, and the recess B2 is a recess for forming the terminal part 2 formed at one end of the flexible substrate 3 when the molten resin is press-fitted from the through hole B3. This is a groove for promoting the inflow of molten resin.

Next, as shown in FIG. 4(B), a heated and melted resin material (for example, a resin such as polyphenylene sulfide or polyethylene terephthalate) is press-fitted from the through hole B3 of the second mold B (arrow Di).

By press-fitting this molten resin, the recess Bl of the second mold B,
The inside of the concave groove B2 and the circumferential groove A2 of the first mold A is filled with molten resin material.

Further, at this time, the part of the synthetic resin film of the flexible substrate 3 corresponding to the hole A3 of the first mold A is pierced by the press-fitting pressure of the molten resin material, and the molten resin material is inserted into the housing 1.
The hole A3 forming the pillar 1-1 is filled (arrow D2
). In this way, punch through the flexible board 3 and open the hole A.
By filling the inside of the hole A3 with the molten resin material, the synthetic resin film comes into close contact with the inner surface of the hole A3, and does not peel off from the inner surface.

On the other hand, if a hole is formed in advance in the part where the hole A3 of the flexible substrate 3 is located, into which the molten resin material flows,
The molten resin material that has passed through the hole and flowed into the hole A3 flows into the hole A3.
When it hits the inner surface of the board, turn it around and insert the flexible board 3 into the hole A3.
Since the pressure is applied from the side, the inverted molten resin material enters between the flexible substrate 3 and the wall surface of the first mold A, and the flexible substrate 3 separates from the wall surface of the first mold A, and the flexible substrate 3 Current collection pattern 3-1 and insulator pattern 3
There was a problem in that the surface of -2 was covered with the resin material, resulting in a defective product. The above problem was solved by not forming holes in the flexible substrate 3 in advance as described above, but by press-fitting the molten resin material to pierce the flexible substrate 3.

Also, when filling the molten resin, a concave groove B is formed in the second mold B.
2 is not formed, the molten resin material goes around from the recess B1 other than the recess B2 through the surrounding circumferential groove A2, and the upper surface of the terminal part 2 is filled first, so that the terminal part 2 becomes the second
is pushed down to the recess B1 side of the mold B. In extreme cases, the terminal portion 2 may be exposed to the back surface of the case.

As a countermeasure against this, in this embodiment, a concave fjB is formed in the second mold B.
2 is formed so that the flow of the molten resin material from the center of the recess B1 toward the terminal portion 2 is fastest at the portion where it flows through the recess B2 (in the direction indicated by the arrow p3).

As a result, the molten resin material is filled around the terminal part 2 while the terminal part 2 is pressed against the first mold A side. That is, since the force shown by the arrow D3 acts before the force due to the inflow of the molten resin material in the direction shown by the arrow D4 in the figure acts, the terminal portion 2 is not separated from the first mold A.

As described above, after filling the gap between the first mold A and the second mold B with the molten resin material and solidifying the molten resin material, the first mold A and the second mold B If the flexible substrate 3 is removed and cut along the A-A line, B-B line, and C-C line in FIG. 3(A), the flexible substrate 3 as shown in FIG. 1 will be obtained.
A resin molded electronic component housing with a built-in flexible circuit board is completed. In addition, FIG. 1(A).

A convex surface 1-5 on the back surface of the resin molded housing 1 shown in (B) is a convex surface formed by the groove B2 of the second mold B.

In the above explanation, an example was described in which a hole through which the molten resin material flows is not formed in the portion of the flexible substrate 3 where the first mold 6A3 is located, but as shown in FIG. Even if the inflow hole 3a for the molten resin material is formed in the substrate 3 in advance, the diameter d of this hole 3a is used as the hole A for forming the support 1-1.
3 diameter d.

If it is 1/2 or less, the molten resin material that has flowed into the hole A3 will not enter between the flexible substrate 3 and the wall surface of the first mold A, and the flexible substrate 3 will be connected to the first mold A. It was confirmed that the device did not move further away from the wall. In this case as well, the flexible substrate 3 in the hole A3 portion deforms as shown in the figure and comes into close contact with the inner wall of the hole A3.

FIG. 5 is a schematic side cross-sectional view showing a rotary code switch using the above-mentioned flexible board built-in electronic component housing.

In the figure, 5 is a rotor, and as shown in the figure, the rotor 5 is a disk-shaped rotor body 5-1 made of synthetic resin.
It has a structure in which a slider 5-2 is provided on the lower surface of the slider 5-2. The rotor 5 is inserted into the interior of the casing 1 by inserting the support 1-1 of the casing 1 into the hole formed in the center of the rotor body 5-1 and heat caulking the tip of the support 1-1. It is rotatably supported.

By rotating the rotor 5, the contacts of the slider 5-2 slide on the current collection pattern 3-1 and the insulator pattern 3-2 formed on the flexible substrate 3. As a result, as shown in FIG. 1, between each metal terminal piece 2-1 to 2-5, the metal terminal piece 2-1 is used as a common, and the metal terminal piece 2-1 and each metal terminal piece 2-2 to Between 2 and 5 is on or off state (
(H or L signal) and changes its code signal value.

When the rotary reed switch with the above configuration is mounted on the printed wiring board 100, the positioning is performed using the protrusions 1-3, 1-4 (see Fig. 1) formed on both sides of the back surface of the housing 1. Attach. At this time, metal terminal pieces 2-1 to 2-5
is located on the wiring pattern (not shown) of the printed wiring board 100. Various other electronic components are mounted on the printed wiring board 100, and in this state, each component is mounted on the printed wiring board 100 by soldering or the like.

Note that 4 shown in FIG. 5 is a knob that rotates together with the rotor 5, and 4-1 is a fixing pin that fixes the knob 4 to the rotor 5.

As described above, by constructing the flexible substrate 3 of the rotary code switch from a synthetic resin film and integrating the flexible substrate 3 as an insert into the resin-molded casing 1, the casing 1 and the flexible substrate 3 are Not only does assembly work become unnecessary, but it can also be made smaller and thinner.

Further, as shown in FIG. 5, the rotary code switch having the above configuration can be directly mounted on the printed wiring board 100 like other capacitors, resistors, IC chips, etc., and the automation of mounting is facilitated.

Furthermore, in the rotary cord switch having the above configuration, as shown in FIG. When the switch is placed on the printed wiring board 100 and soldered using flux, there is no problem that the blank passes through the terminal portion 2 and invades the inside of the casing 1.

FIG. 6 is a section showing the structure of the housing of another electronic component incorporating a flexible substrate according to the present invention, and FIG. 6(A) is a back view;
The same figure (B) is a side view, and the same figure (C) is a top view.

In the same figure, the difference from the case of the electronic component with a built-in flexible board shown in FIG. However, the protrusions 1-7 are completely formed upward from the edge 1-6.

FIG. 7 is an exploded perspective view of a rotary foot switch using the electronic component housing 1 shown in FIG. 6 above. The rotary code switch has a housing 1, a rotor 6, a cover plate 7, and a rotary knob 8.
Equipped with:

The rotor 6 is formed of a resin material into a disk shape, and has a cylindrical protrusion 6-4 formed in the center thereof, and a pair of engaging claws 6 for attaching the rotary knob 8 by sandwiching the protrusion 6-4. -1.6-
2 is formed. Further, a protrusion 6-3 for regulating the rotation of the rotor 6 within a predetermined range is completely formed. Although not shown, a slider 6-6 is attached to the lower part of the rotor 6, which slides into contact with the current collection pattern 3-1 and the insulator pattern 3-2 of the flexible substrate 3 (see FIG. 8). ).

The cover plate 7 is made of a metal plate, and a through hole 7-2 through which the engaging claws 6-1 and 6-2 of the rotor 6 pass is formed in the center thereof.
Holes 7-1 are formed at its four corners, through which the protrusions 1-7 of the housing 1 pass. Further, a piece member 7-3 is provided downward from the center of the front end of the lid plate 7. Piece member 7-3
This rotary load switch is connected to a printed wiring board 100.
It is for fixing to.

The rotary knob 8 is composed of a disc-shaped member made of resin, and has many unevenness formed around it, and a protrusion 6-4 of a rotor 0 is inserted into the center of the lower part, as will be described later. A protrusion 8-4 (see Fig. 8) is provided in which a protrusion 8-3 (see Fig. 8) is formed in the center, and the engagement pawl 6 of the rotor 6 is further sandwiched between the protrusion 8-4. -1.6-2 is inserted into a pair of 68-2.8-2.

FIG. 8 is a side cross-sectional view showing a rotary code switch made of the above components assembled and mounted on a printed wiring board 100.

As shown, the assembly of the rotary code switch is as follows:
First, the support column 1- formed in the center of the resin molded case 1
1 is inserted into 60-5 formed at the center of the lower part of the rotor 6, and the rotor 6 is placed on the housing 1. Next, as shown in FIG.
-1, heat caulk the tip and attach it to the cover plate 7. At this time, the protrusion 6-4 of the rotor 6 and the pair of engagement claws 6-1, 6-2 are allowed to penetrate into the through hole 7-2 of the cover plate 7.

Next, the protrusion 6-4 of the rotor 6 is inserted into the hole 8-3 formed in the protrusion 8-4 at the bottom of the rotary knob 8, and the engaging claws 6-1.6-2 are inserted into the hole 8-2. Insert into 8-2, 68-2
．． Engaging claw 6-1.6-
2 and attach the rotary knob 8 to the rotor 6.

In the rotary code switch configured as described above, when the rotary knob 8 is rotated, the rotor 6 rotates, and the slider 6-6 attached to the lower part of the rotor 6 connects with the current collecting pattern 3-1 on the flexible substrate 3. It slides onto the insulator pattern 3-2. At this time, when the rotor 6 rotates by a predetermined amount, the protrusion 6-3 formed on the peripheral edge of the rotor 6 comes into contact with the protrusion 1-8 formed on the inner peripheral surface of the side wall 1-2. The rotation range of the rotor 6 is restricted to a predetermined range.

In the above embodiment, the case of an electronic component with a built-in flexible substrate was explained using the case of a rotary code switch as an example, but it can also be used as a case of other rotary electronic components such as a rotary variable resistor.

FIG. 21 is a plan view showing a case where the housing of this electronic component is used in a rotary variable resistor. In the figure, 3-3 is a current collection pattern formed by etching a metal foil formed on the flexible substrate 3 by adhesion or vapor deposition, and 3-4 is a current collection pattern formed on the flexible substrate 3 after the current collection pattern 3-3 is formed. This is a resistor pattern formed into a predetermined shape by printing or vacuum deposition of a conductive paste that becomes a resistor. The other parts have the same structure as the rotary code switch shown in FIG. 1, so the details will be omitted.

FIG. 9 is a diagram showing the structure of the casing of a slide type code switch as a casing of another flexible board built-in heavy element component according to the present invention, FIG. 9(A) is a plan view, and FIG. 9(B) is a top view. A side view of a portion thereof, FIG. 2(C) is a back view, and FIG. 3(D) is a sectional view taken along the line A--A in FIG.

In the housing of the slide-type code switch of this embodiment, a flexible board 53 and a terminal part 52 are integrally formed with a thermoplastic heat-resistant film 51, and the flexible board 53 and the terminal part 52 are placed in a housing 54. It is an inserted structure.

On the flexible substrate 53, a current collecting pattern 53-1 and an insulator pattern 53-2 formed at a predetermined portion on the current collecting pattern 53-1 are formed. Further, the terminal portion 52 is provided with a metal terminal piece 55. In addition, the current collection pattern 53-1 and the insulator pattern 53- of the flexible substrate 53 are
The portion where 2 is formed is exposed at the bottom inside the housing 54.

Hereinafter, the structure and shape of each part of the housing of the slide type foot switch having the above structure, and the manufacturing method thereof will be explained.

FIG. 10 is a diagram for explaining the manufacturing process of the flexible substrate 53 and the terminal portion 52, in which a rectangular thermoplastic heat-resistant film 51 is continuously connected by supporting members 51-1 and 51-1. There is. Five current collection patterns 53-1 and an insulator pattern 53-2 are formed at predetermined portions on the current collection patterns 53-1 at predetermined positions on the surface of the heat-resistant film 51.

In order to form the current collecting pattern 53-1 here, first, a metal foil (for example, copper or aluminum) is adhered on the heat-resistant film 51, or a metal such as copper or aluminum is vapor-deposited on the heat-resistant film 51. to form a metal layer.

Then, this metal layer is etched into the shape of the current collecting pattern 53-1 to form the current collecting pattern 53-1.

At this time, a lead pattern 52-1 is formed at each end of the current collecting pattern 53-1 so as to be continuous with the current collecting pattern 53-1.

Then, by printing an insulator pattern 53-2 at a predetermined position on this current collecting pattern 53-1, a code pattern is completed.

Here, the portion of the heat-resistant film 51 where the current collecting pattern 53-1 and the insulator pattern 53-2 are formed becomes the flexible substrate 53 which becomes the substrate of the sliding code switch, and the portion where the lead pattern 52-1 is formed. becomes the terminal portion 52.

Next, as shown in the figure, a plurality of metal terminal pieces 55 (two and three in the figure) are attached to the current collecting pattern 55.
It is integrally formed with the support part 58 by press working at intervals corresponding to -1. Lead pattern 5 of terminal section 52
A hot-melt type conductive adhesive layer is formed on 2-1, a metal terminal piece 55 is placed thereon, and a terminal fixing made of a synthetic resin film of the same quality as the heat-resistant film 51 is placed over the metal terminal piece 55. The metal terminal piece 5 is placed on the metal terminal piece 5.
Ultrasonic waves are emitted by an ultrasonic emitting horn (not shown) to the part where the terminal portion 52 is not located, and the terminal fixing film 57 and the heat-resistant film 51 of the terminal portion 52 are melted by ultrasonic heating, and the metal terminal piece 55 is led. It is pressed and fixed onto the pattern 52-1. Next, if a heating iron is applied to the metal terminal piece 55 from above the terminal fixing film 57 or the heat-resistant film 51 of the terminal portion 52 and the conductive adhesive is melted by heating, the metal terminal piece 55 is placed on the lead pattern 52-1. is firmly attached.

FIG. 11 is a diagram showing a state in which the metal terminal piece 55 is attached to the lead pattern 52-1 of the terminal portion 52 through the above process, in which (A) is a plan view and (B) is a top view (A). ) of B
- It is a sectional view taken along the line B. Note that the welding of the terminal fixing film 57 and the heat-resistant film 51 by the ultrasonic heating is strong, and the welding between the metal terminal piece 55 surface and the lead pattern 52-
Since pressure contact with the first surface is ensured, the lead pattern 52-
The step of forming a conductive adhesive layer on top of the conductive adhesive layer may be omitted depending on the case.

The board with metal terminals of the slide type code switch that has been formed as described above includes the heat-resistant film 51, the metal terminal piece 55, and the terminal fixing film 5 even in the terminal portion with the largest thickness dimension.
Since only the thickness of 7 is added, the result is an extremely thin substrate.

The flexible substrate portion 53 of the heat-resistant film 51 to which the metal terminal piece 55 is attached as described above is attached to the metal terminal piece 55.
After inserting it into the resin molded housing 54 made of synthetic resin so that it protrudes to the outside (this method of inserting will be explained in FIG. 12 below), C- in FIG. 11(A) is inserted.
Cut on the C line and the D line, remove the support part 58,
Furthermore, by cutting along the E-E line and the F-F line in FIG. 9(A) and removing the overlapping portion of the support member 51-1 and the terminal fixing film 57, the sliding code switch shown in FIG. 9 is obtained. The resin molded housing is completed.

A flexible substrate 53 is attached to the side of the resin molded housing 54.
Four fixing protrusions 54-2 are formed to cover the outer periphery of the terminal portion 52, and four fixing protrusions 54-2 are provided on the front and rear side portions 54-1 for fixing a cover plate, which will be described later. A guide protrusion 54-3 is formed. Further, on the back side thereof, two fixing protrusions 54-4.5 are provided for fixing the resin molded housing 54 to the printed wiring board described below.
4-4 are integrally formed.

Next, a method of inserting the heat-resistant film 51 with the metal terminal pieces 55 attached to the terminal portions 52 into the resin mold casing 54 will be explained using FIG. 12.

That is, as shown in FIG. 12(A), the flexible substrate 5
3 and a terminal portion 52 are integrally formed, and a heat-resistant film 51 with a metal terminal piece 55 attached to the terminal portion 52 is sandwiched between a first mold A and a second mold B.

Here, the first mold A has a flat surface A1 that is in close contact with the surface on which the current collecting pattern 53-1 and the insulator pattern 53-2 of the flexible substrate 53 of the heat-resistant film 51 are formed.
A circumferential groove A2 forming a side portion 54-1 of the resin molded housing 54 is formed around the flat surface A1. Although not shown, the bottom of the circumferential groove A2 includes a fixing protrusion 54-2 and a guide protrusion 54-2 of the resin molded housing 54.
The recess forming part 3 has been completely formed.

- The mold B of younger brother 2 has the flat surface A1 of the first mold A.
and a resin mold case 5 in a portion corresponding to the circumferential groove A2.
4, and the terminal portion 52 of the heat-resistant film 51 and the metal terminal piece 55 form the side portion 5.
A groove B2 of a predetermined width that promotes the inflow of the resin material in the direction of the portion penetrating the resin mold case 54 is formed in the longitudinal direction approximately at the center of the groove B1. a protrusion 54-5 is formed).

In addition, the fixing protrusion 54 on the back side of the resin molded housing 54
-4.54-4, a cylindrical recess B3 is formed at a predetermined position in the center longitudinal direction of the recess B1. Also,
Although not shown, a recess for forming the protrusion 54-6 of the resin molded housing 54 is also formed around the bottom of the recess B1.

Next, as shown in FIG. 12(B), heat-melted resin material (for example, polyphenylene sulfide, polyethylene terephthalate, etc.) is poured from the hole B4 completely formed on the top of the recess B3 of the second mold B. Press in as shown. By press-fitting the molten resin material, the heat-resistant film 51 of the flexible substrate 53 is pressed against the flat surface A1 of the first mold A.

Also, when press-fitting this molten resin material, the recess B of the second mold B
If there is no groove B2 which is long in the central longitudinal direction of the flexible substrate 53, the molten resin material will wrap around from the groove B1 other than the groove B2 through the circumferential groove A2, and the periphery of the flexible substrate 53 and the terminal portion 52. Since it is filled from the top side as shown by the arrow D2, the peripheral edges of the flexible substrate 53 and the terminal portion 52 are pushed down toward the recess B1 side of the second mold B, and in extreme cases, the peripheral edges are pushed down to the resin molded housing. There is a possibility that it will be exposed on the back side of the body 54.

On the other hand, in this embodiment, since a long groove B2 is formed in the central longitudinal direction of the recess B1 of the second mold B, the groove B2 has the effect of promoting the flow of the molten resin material. The molten resin material is press-fitted from the central longitudinal direction (direction indicated by arrow D3) of the recess B1 first, gradually spreads to the periphery, and finally fills the periphery where the flexible substrate 53 and the peripheral edge of the terminal portion 520 are located. Since the groove A2 is filled, the flexible substrate 53 and the terminal portion 52 are in the first position during the filling process.
Since the flexible substrate 53 and the terminal portion 52 are pushed toward the first mold A side, the flexible substrate 53 and the terminal portion 52 are not separated from the flat surface A1 of the first mold A. That is, since the molten resin material does not flow between the flat surface A1 of the first mold A and the flexible substrate 53, after the molten resin material hardens as described later, the first mold A and the When the second mold B is removed, the surface of the flexible substrate 53 is completely exposed at the bottom inside the resin molded housing 54.

After filling the space between the first mold A and the second mold B with the molten resin material as described above, remove the first mold A and the second mold B after the resin material has solidified. For example, the housing of the sliding foot switch shown in FIG. 9 is completed.

FIG. 13 is a side sectional view showing the structure of a sliding code switch using the housing of this sliding code switch.

As shown in the figure, a sliding body 59 is placed on a flexible substrate 53 of a heat-resistant film 51 inserted into a resin molded housing 54. A slider 60 is provided at the bottom of the slider 59 and slides into contact with the current collecting pattern 53-1 and the insulator pattern 53-2 formed on the flexible substrate 53, and an operating lever 59a is integrally mounted on the upper part of the slider 60. It is formed. The sliding body 59 is placed between the lid plate 61 and the flexible substrate 53 by placing the lid plate 61 on top of the side portion 54-1 of the resin molded casing 54 and thermally caulking the tip of the fixing protrusion 54-2. to hold. This completes the sliding foot switch.

In the slide type code switch having the above structure, when the operating bar 59a is operated and the slider 59 is moved, the slider 60 moves between the current collection pattern 53-1 and the insulator pattern 53-.
2, the contacts of the slider 60 and the current collection pattern 53
-1 changes, the metal terminal pieces 55 connected to each current collection pattern 53-1 are turned on or off, and a signal change of H or L is output.

As described above, the flexible substrate section 53 on which the current collecting pattern 53-1 and the insulator pattern 53-2 are formed and the terminal section 52 on which the lead pattern 52-1 is formed are connected to a heat-resistant film 51 made of thermodegradable synthetic resin. If the heat-resistant film 51 is insert-molded into the resin mold casing 54 made of synthetic resin, not only does the assembly work of the flexible substrate 53 and the resin mold casing 54 become unnecessary.
The slide type foot switch can be made smaller and thinner.

Although the above embodiment has been explained using a slide type code switch as an example, the case with a built-in flexible board is not limited to this, and 1. It can be used as a slide type switch, and can also be used as a slide type variable resistor by changing the pattern formed on the flexible substrate 53 to a current collecting pattern formed by etching and a resistor pattern formed by printing or vacuum deposition. It is possible to do so.

Further, in the above embodiment, the metal terminal pieces 55 are provided at both ends of the resin molded housing 54, but the metal terminal pieces 55 may be provided only at one end.

14 and 15 are diagrams showing the structure of the housing of another electronic component incorporating a flexible substrate according to the present invention, in which FIG. 14 is a perspective view, FIG. 15(A) is a plan view, and FIG. (B) is a side view of part of it, Figure 15 (C) is its back view,
5(I)) is a sectional view taken along the line AA in FIG. 15(A), and FIG. 15(E) is a sectional view taken along the line BB in FIG. 15(B). In this embodiment, a slide code switch will be explained as an example of an electronic component.

As shown in the figure, the housing of the electronic component includes a flexible substrate 73 having five current collecting patterns 73-1 and an insulator pattern 73-2 formed on (7) a predetermined portion of the current collecting patterns 73-1. A substrate extending portion 73-3 in which a lead pattern 72-1 (see FIG. 16) that is continuous with the end of the current collecting pattern 73-1 is formed is integrally formed with the heat-resistant film 71, and the substrate extending portion 73-3 is formed integrally with the heat-resistant film 71. 73-3 glue-F pattern 72-
A terminal portion 72 is formed by abutting and fixing a metal terminal piece 75 on the heat-resistant film 71, and the flexible substrate 73 of the heat-resistant film 71 and the terminal portion 72 are inserted into a housing 74.

Further, a part of the current collecting pattern 73-1 of the heat-resistant film 71 is exposed on the bottom surface of the housing, and the remaining part of the current collecting pattern 73-1 is exposed on the inner surfaces of both side walls. Hereinafter, the structure of each part of the casing of the electronic component having the above structure and the manufacturing method thereof will be explained in detail.

FIG. 16 is a diagram for explaining the manufacturing process of the flexible substrate 73 and the terminal portion 72, and shows a support portion 71-1.7 whose frame is a rectangular thermoplastic heat-resistant film 71.
1-1, they are connected consecutively. Heat resistant film 71
As the material, for example, polyparabanic acid, polyetherimide, polyethylene terephthalate, etc. are used.

In order to form the current collecting pattern 73-1 here, first, a metal foil (for example, copper or aluminum) is adhered on the heat-resistant film 71, or a metal such as copper or aluminum is vapor-deposited on the heat-resistant film 71. to form a metal layer.

This metal layer is then etched into the shape of the current collecting pattern 73-1 to form the current collecting pattern 73-1.

At this time, a lead pattern 72-1 is formed at each end of the current collecting pattern 73-1 so as to be continuous with the current collecting pattern 73-1.

Then, by printing an insulator pattern 73-2 at a predetermined position on this current collecting pattern 73-1, a code pattern is completed.

Here, the flexible substrate 730 of the heat-resistant film 71
The width dimension is formed to be larger than the width dimension of the board extension part 73-3 by a predetermined dimension.

As shown in the figure, a plurality of metal terminal pieces 75 (two and three on the top and bottom in the figure) are integrally formed with the support portion 78.

Here, a hot-melt type conductive adhesive layer is formed on the lead pattern 72-1 of the substrate extending portion 73-3 of the heat-resistant film 71, and the end portion of the metal terminal piece 75 is placed thereon. Next, a terminal fixing film 77 made of the same synthetic resin as the heat-resistant film 71 is placed over the metal terminal piece 75 of the terminal portion 72.
is placed, and an ultrasonic wave is emitted from an ultrasonic emitting horn (not shown) to the parts where the metal terminal pieces 75 are not located, that is, between the metal terminal pieces 75 and at both ends, to fix the terminal fixing film 77. The substrate stretched portion 73-3 of the heat-resistant film 71 is melted by ultrasonic heating, and the metal terminal piece 75 is fixed onto the lead pattern 72-1 (see FIG. 15(E)).

Next, if the hot-melt type conductive adhesive layer is melted by heating it with a heating iron from above the terminal fixing film 77 or the board extension part 73-3, the metal terminal piece 75 is formed on the lead pattern 72-1. Be sure to adhere. As a result, the terminal portion 72 is formed in the substrate stretched portion 73-3 of the heat-resistant film 71.

The board with metal terminals of the slide type foot switch formed as described above includes the heat-resistant film 71, the metal terminal piece 75, and the terminal fixing film 7 even in the terminal portion having the largest thickness.
Since only the thickness of 7 is added, the result is an extremely thin substrate.

The flexible substrate 73 of the heat-resistant film 71 to which the metal terminal piece 75 is attached as described above is attached to the metal terminal piece 75.
After inserting it into a housing 74 made of synthetic resin (described later) so that it protrudes to the outside, it is cut along the lines CC and D-D in FIG. -1 and 71-1, the housing of the sliding code switch is completed.

Note that the side portion 74-1 of the housing 74 is connected to the flexible substrate 73.
and is formed so as to cover the outer periphery of the terminal portion 72, and a stopper protrusion 74-3 is formed on one side of the terminal portion 72. Further, an inclined surface 74-2 inclined inward of the housing 74 is formed at a predetermined position on the top of the side portion 74-1.

Next, a flexible substrate 73 provided with the terminal portion 72
A method of inserting the casing 74 into the housing 74 will be explained using FIG. 17.

That is, first, as shown in FIG. 17(A), the flexible substrate 73 and the terminal portion 72 are placed in a first mold A and a second mold B.
Sandwich it in.

Here, the first mold A has a flat surface A1 in which the surface on which the current collecting pattern 73-1 and the insulator pattern 73-2 of the flexible substrate 73 are formed is in close contact with, and a flat surface in which the surface of the terminal portion 72 is in close contact with each other. A3, and a circumferential groove A2 forming a side portion 74-1 of the housing 74 around the flat surface A1 and the flat surface A3 are completely formed.

- The mold B of younger brother 2 has the flat surface A1 of the first mold A.
, a recess B1 forming the bottom of the casing 74 is formed in a portion corresponding to the flat surface A3 and the circumferential groove A2, and the recess B1
There is a convex portion B2 inside the heat-resistant film 71 that obstructs the flow of the molten resin material in the longitudinal direction and promotes the flow in the width direction.
, B2 are formed at predetermined intervals. Also,
A filling hole B3 for filling with molten resin material is completely formed in the center of the recess B1.

A resin material made by heating and melting polyphenylene sulfide, polyethylene terephthalate, etc., for example, is press-fitted from the filling hole B3 as shown by the arrow D1.

By press-fitting the molten resin material, the molten resin material flows into the concave portion B1 of the second mold B, but the convex portion B2 formed in the concave portion B1. B2 promotes the flow of the heat-resistant film 71 in the width direction as shown in FIG. 17(C).
), the current collecting pattern 73-1 and the insulator pattern 7 on both sides of the flexible substrate 73 of the heat-resistant film 71
The 3-2 portion is pressed by the molten resin material and bent along one side of the circumferential groove A2, and is brought into close contact with the - side.

If during this filling, the convex part B of the concave part B1 of the second mold B
2. If B2 is not present, the molten resin material flows radially from the filling hole B3, and the molten resin material flowing in the longitudinal direction of the recess B1 flows from the side of the terminal part 72 into the circumferential groove A2, and a part of it flows into the circumferential groove A2. The current collector pattern 73-1 and the insulator pattern 73-2 enter between the sides of A2 and both sides of the flexible substrate 73, where the current collector pattern 73-1 and the insulator pattern 73-2 are completely formed. There is a problem in that the current collecting pattern 73-1 and the insulating pattern 73-2 are not bent sufficiently, and the surfaces of the current collecting pattern 73-1 and the insulating pattern 73-2 are covered with a resin material.

However, in the above embodiment, the convex portion B is located at the bottom of the concave portion B1.
2. Since B2 is formed, the flow of the molten resin material in the longitudinal direction of the recess B1 is obstructed, and the flow of the molten resin material in the width direction of the heat-resistant film 71 is promoted and flows into the circumferential groove A2. Flexible substrate 73 of heat-resistant film 71
The surface of the groove A2 is bent along the side surface of the circumferential groove A2 and is in close contact with the side surface. Therefore, the surfaces of the current collecting pattern 73-1 and the insulating pattern 73-2 on both sides of the flexible substrate 73 are not covered with the resin material. That is, since the molten resin material does not flow between the side surface of the flat surface A1 of the first mold A and the flexible substrate 73, after the molten resin material hardens as described later, the first mold When A and the second mold B are removed, the current collection pattern 73-1 of the flexible substrate 73 and the insulator pattern 7 are formed on the inner bottom and inner surfaces of both side walls of the casing 74.
3-2 will be exposed.

After filling the space between the first mold A and the second mold B with the molten resin material as described above, remove the first mold A and the second mold B after the resin material has solidified. For example, a housing for a sliding code switch as shown in FIG. 14 is completed.

FIG. 18 is a diagram showing the structure of a slide type code switch made using the housing 74, and FIG. ), 18th
Figure (B) is a cross-sectional view (cross-sectional view on line F-F in Figure (A))
It is.

As shown in the figure, a sliding body 80 is attached to the outer periphery of the housing 74 of the sliding code switch having the above structure. The sliding body 80 is made of resin material, and has an operation knob 81 on the side.
are integrally formed.

83 is the current collecting pattern 7 on the inner bottom surface of the flexible substrate 73
3 - 1 is a contact point that comes into sliding contact with the insulator pattern 73 - 2 , and 84 is a contact point that comes into sliding contact with the current collecting pattern 73 - 1 on both inner side surfaces of the flexible substrate 73 . These contacts 83 and 84 are integrally formed by a contact member 85, and the contact member 85 is inserted into the main body of the sliding body 80.

Further, a pair of claw members 82 and 82 are formed on both sides of the sliding body 80, respectively, to engage with both sides of the bottom outer surface of the housing 74.

The housing 7 is placed between the claw members 82 and 82 of the sliding body 80 having the above structure.
By abutting the upper part of 4 and pressing the sliding body 80,
The claw members 82.82 open on both sides and descend along the outer surface of the housing 74, and the protrusions of the claw members 82.82 engage the outer peripheral bottom surface of the housing 74 at the bottom surface of the housing 74. As a result, a sliding code switch using the housing 74 is completed.

Operation knob 81 of the sliding code switch configured above
When the slider 80 is moved in the longitudinal direction of the housing 74, the contacts 83 and 84 are connected to the current collecting pattern 73-1, respectively.
．． It slides on the upper surface of the insulator pattern 73-2, and the on/off state between the five metal terminal pieces 75 changes.

In the above embodiment, the current collection pattern 73-1 and the insulator pattern 73-2 of the flexible substrate 73 are connected to the housing 74.
The current collecting pattern 73-1. The insulator pattern 73-2 may be exposed on one inner surface of the housing 74. Furthermore, it goes without saying that the number of current collecting patterns 73-1 and insulator patterns 73-2 may be changed as necessary.

As described above, the flexible substrate 73 on which the code pattern consisting of the current collecting pattern 73-1 and the insulator pattern 73-2 is formed, and the substrate extension part 73-3 on which the lead pattern 72-1 is formed are synthesized by thermoplastic synthesis. It is composed of a heat-resistant resin film 71, and the heat-resistant film 71 is connected to the current collecting pattern 7.
3-1 and the insulator pattern 73-2 are configured to be exposed on the inner bottom surface of the casing 74 and the inner wall surfaces on both sides of the casing 740, so the inner surface of the casing 74 can be effectively used and the slide type code switch can be miniaturized. - Thinness can be achieved, and assembly work between the flexible board 73 and the casing 74 becomes unnecessary.

Further, although the above embodiment has been described using a slide type code switch as an example, the case with a built-in flexible substrate is not limited to this, and can also be used as a slide type switch or a slide type variable resistor. For example, the above case 7
On the inner bottom surface and the white rain side surface of 4, a current collecting pattern is formed by etching a conductive foil such as copper or aluminum, and a resistor pattern of a predetermined shape is further vacuum-deposited or a conductive paste that becomes a resistor is printed. A sliding variable resistor may be constructed by forming the resistor by doing the following.

FIG. 19 is a perspective view showing the structure of another casing incorporating a flexible substrate according to the present invention. In this embodiment, the flexible substrate 93 is connected to the inner bottom surface of the casing 91, the side wall 91- of the casing 910,
2 and the outer circumferential surface of the support column 91-1. Since the method of inserting the flexible substrate 93 into the housing 91 is similar to the method shown in FIGS. 4 and 17, the explanation thereof will be omitted.

With the above configuration, the current collection pattern 93-1 and the insulator pattern 93-2 are exposed on the inner bottom surface of the housing 91, the inner surface of the side wall 91-2, and the outer peripheral surface of the support column 91-10.

The terminal portion 92 has a substantially recessed structure with the terminal portion 2 of the electronic component housing shown in FIG. 1, and includes metal terminal pieces 92-1 to 92-5.

FIG. 20 is a sectional view showing a state in which a rotary code switch using the housing 91 having the above structure is mounted on a printed wiring board 100, and shows the structure of the rotary code switch in FIGS. It is.

As shown, the assembly of the rotary code switch is as follows:
First, insert the support 91-1 formed in the center of the casing 91 into the hole 96-5 formed in the center of the lower part of the rotor 96.
The rotor 96 is placed on the housing 91. And the engaging claw 96-
1.96-2 into hole 98-2.98-2, and
-2.98-2 Engaging claw 96-
1.96-2 and turn the rotary knob 98 to the rotor 96.
Attach to.

In the rotary code switch configured as described above, when the rotary knob 98 is allowed to rotate, the rotor 96 rotates;
The current collection pattern 93-1 and the insulator pattern 9 have a slider 96-6 attached to the bottom surface exposed on the inner bottom surface of the housing 91.
A slider 96-7 attached to the inner circumferential surface of the rotor 96 slides on the top of the current collecting pattern 93-1 exposed on the outer circumferential surface of the support column 91-1, and further, A slider 96-8 attached to the outer peripheral surface of the rotor 96 has a current collecting pattern 93-1 and an insulator pattern 9 exposed on the inner surface of the side wall 91-2.
Slide on the top of 3-2. As a result, the metal terminal piece 92-
The food signal between 1 and 92-5 changes.

By configuring the housing with a built-in flexible substrate as described above, the inner surface of the housing 91 can be effectively used, and the rotary code switch can be made extremely compact.

In the above embodiments, the housing of a rotary code switch was explained as an example, but it is also possible to replace the deafening bag formed on the flexible substrate 93 with a current collecting pattern formed by etching and a resistor pattern formed by vacuum deposition or printing. Therefore, it can be used as a rotary variable resistor, etc.

Although the embodiments of the electronic component casing and the manufacturing method thereof according to the present invention have been described in detail above, it goes without saying that the present invention is not limited thereto and that various modifications can be made within the scope of the present invention. .

〔Effect of the invention〕

As described in detail above, according to the electronic component casing and the manufacturing method thereof according to the present invention, the following effects are produced.

■Use a flexible substrate on which a conductive pattern is formed by etching a metal surface adhered or vapor-deposited on a synthetic resin film as the substrate, and bond a metal terminal piece to the upper surface of the end of the conductive pattern of the flexible substrate. ,
A fixing resin film made of a synthetic resin film of the same quality as the flexible substrate is placed thereon, and a terminal portion having a structure in which the fixing resin film and the flexible substrate film are locally welded is provided, and The flexible board is inserted into a synthetic resin casing so that a predetermined portion of the flexible board can protrude from the tip of the metal terminal piece of the terminal part to the outside of the casing, and the conductor pattern is exposed inside the casing, and the flexible board and the synthetic resin are Since the casing is integrated with a manufactured casing, the casing can be made smaller and thinner, and there is no need to assemble the board and the casing.

(2) Furthermore, an electronic component using the electronic component housing according to the present invention can be directly surface-mounted on a printed wiring board together with various other electronic components, making it possible to automate the mounting.

■Also, according to the electronic component housing according to the present invention, a metal terminal piece is bonded to the top surface of the end of the conductor pattern of the flexible substrate, and a fixed film made of a synthetic resin of the same quality as the flexible substrate is fixed thereon. A terminal section is provided with a structure in which the fixing resin film and the film of the flexible substrate are locally welded, and a predetermined portion from the tip of the metal terminal piece of the terminal section of the flexible substrate is mounted on the housing. The flexible board was inserted into a synthetic resin casing so as to protrude outside the body, and the flexible board and the synthetic resin casing were integrated, so electronic components using this casing could be mounted on printed wiring boards. When soldering is performed using flux by placing the terminal on the electronic component, the flux does not travel through the terminal and enter the inside of the electronic component.

■Furthermore, according to the electronic component casing according to the present invention, a metal terminal piece is bonded to the upper surface of the end of the conductor pattern of the flexible substrate, and a metal terminal piece made of synthetic resin of the same quality as the flexible substrate is attached on top of the metal terminal piece. The structure is such that a fixing resin film made of a film is placed and the fixing resin film and the film of the flexible board are locally welded, which not only strengthens the connection strength between the flexible board and the metal terminal piece, but also increases the flexibility of the flexible board. Since only the thickness of the metal terminal pieces and the fixing resin film are added to the board, the terminal structure is extremely thin, and the thickness of the electronic component housing can be reduced accordingly.

[Brief explanation of the drawing]

FIG. 1 is a diagram showing the structure of a housing of an electronic component with a built-in flexible substrate according to the present invention; FIG.
B) is a side view, and (C) is a plan view. FIG. 2 and FIGS. 3(A) and 3(B) are diagrams for explaining the structure of a flexible substrate and its manufacturing method. FIGS. 4(A), 4(B), and 4(C) are diagrams for explaining a method of inserting a flexible substrate into a resin casing. FIG. 5 is a side sectional view showing a rotary code switch using an electronic component housing with a built-in flexible substrate. FIG. 6 is a diagram showing the structure of the housing of another electronic component incorporating a flexible substrate according to the present invention, in which (A) is a back view, (B) is a side sectional view, and (C) is a side view. is a plan view. FIG. 7 is an exploded perspective view of a rotary code switch using the electronic component housing shown in FIG. 6, and FIG. 8 is a sectional view of the assembled rotary code switch. FIG. 9 is a diagram showing the structure of the housing of another electronic component incorporating a flexible substrate according to the present invention, in which FIG. 9(A) is a plan view, FIG. 9(B) is a partial side view thereof, and FIG. (C) is a back view, and (D) is a sectional view taken along the line A--A in (A). FIG. 10 and FIGS. 11(A) and 11(B) are diagrams for explaining the manufacturing process of the flexible substrate and the terminal portion. FIGS. 12(A) and 12(B) are diagrams for explaining a method of inserting a flexible substrate into a resin casing. FIG. 13 is a side sectional view showing the structure of a sliding code switch using the housing of this sliding code switch. FIG. 14 and FIG. 15 are diagrams showing the structure of the housing of another electronic component incorporating a flexible substrate according to the present invention.
Figure 4 is a perspective view, Figure 15 (A) is a plan view, Figure 15 (B) is a partial side view, Figure 15 (C) is a back view, Figure 15 (D
) is a cross-sectional view taken along the line A--A in FIG. FIG. 16 is a diagram for explaining the manufacturing process of the flexible substrate and the terminal portion. FIGS. 17(A), 17(B), and 17(C) are diagrams for explaining a method of inserting a flexible substrate into a resin casing. FIG. 18 is a diagram showing the structure of a slide type code switch using the electronic component case shown in FIG. 14, and FIG. ), same figure (B
) is a sectional view taken along the line FF in FIG. FIG. 19 is a perspective view showing the structure of another electronic component housing with a built-in flexible substrate according to the present invention, and FIG. 20 is a cross-sectional view of a rotary code switch using the electronic component housing. . FIG. 21 is a plan view showing a case where the electronic component casing according to the present invention is used in a rotary variable resistor. In the figure, 1,54,74.91... housing, 3,53.7
3.93...Flexible board, 3-1, 53-1
．． 73-1.93-1... Current collection pattern (conductor pattern), 3-5 to 3-9, 52-1, 72-1...
・Lead pattern (conductor pattern), 3~2.53-
2.73-2.93-2...Insulator pattern, 2-1
~2-5.55,75.92-1~92-5...Metal terminal piece, 2-6.57.77...Terminal fixing film, 2,52,72.92...Terminal part ,5,6.96・
...Rotor, 1-1.91-1...Strut, A1...
Flat surface, A2...groove, A...first mold, B1...
- Recessed portion, B... second mold, A3... hole.

Claims (12)

[Claims] (1) In an electronic component casing that houses a substrate on which a conductive pattern is formed, with which at least the contacts of a slider of the electronic component are formed, the substrate is at least bonded or vapor-deposited on a synthetic resin film. A flexible substrate on which a conductor pattern is formed by etching the metal surface is used, a metal terminal piece is bonded to the top surface of the end of the conductor pattern of the flexible substrate, and a metal terminal piece made of synthetic resin of the same quality as the flexible substrate is bonded to the upper surface of the end of the conductor pattern of the flexible substrate. A terminal fixing film made of a film is placed, a terminal part is provided with a structure in which the terminal fixing film and the film of the flexible board are locally welded, and the flexible board is further inserted from the tip of the metal terminal piece of the terminal part. The flexible board is inserted into a synthetic resin casing so that a predetermined portion thereof protrudes outside the casing and the conductive pattern is exposed inside the casing, and the flexible substrate and the synthetic resin casing are integrated. housing for electronic components. (2) The interior of the synthetic resin casing is formed into a substantially circular shape, and a support that rotatably supports the rotor is formed integrally with the casing in the center thereof, and a support that rotatably supports the rotor is formed integrally with the casing. Claim (1) characterized in that the conductor pattern is exposed in a substantially concentric manner at the bottom of the casing with the pillar as the center.
1) Housing of the electronic components described. (3) The flexible substrate is formed a predetermined amount larger than the bottom surface of the synthetic resin case, and its conductor pattern is
The electronic component housing according to claim 1 or 2, wherein the electronic component housing is exposed at the inner bottom of the housing, the outer circumferential side of the support, and/or the inner surface of the side wall of the housing. (4) The interior of the synthetic resin casing is formed in a rectangular shape so that a sliding body of a sliding electronic component can slide therein;
Claim (1) characterized in that the conductive pattern of the flexible substrate is formed substantially parallel to the long sides of the rectangular shape.
Housing for the electronic components listed. (5) The flexible substrate is formed a predetermined amount larger than the bottom surface of the synthetic resin housing, and the conductive pattern of the flexible substrate is exposed on the inside bottom and side walls of the synthetic resin housing. A housing for an electronic component according to claim (4). (6) The flexible substrate is formed by forming a conductive pattern by etching a metal surface adhered or vapor-deposited on a synthetic resin film, and forming a predetermined insulating pattern on the conductive pattern to form a cord. The casing for an electronic component according to any one of claims 1 to 5, characterized in that the casing has a pattern. (7) The flexible substrate has a conductor pattern formed by etching a metal surface adhered or vapor-deposited on a synthetic resin film, and a resistor pattern is formed on the synthetic resin film to make the flexible substrate flexible. Claims (1) to (5) characterized in that the pattern is a resistor pattern.
) A casing for an electronic component according to any one of the following. (8) A flexible board made of a synthetic resin film, with a flat surface on which the conductive pattern is brought into close contact, and a groove formed around the flat surface to form a side part of the synthetic resin casing. 1 mold, and a recessed portion that is disposed opposite to the first mold and that forms the bottom of the casing in a portion that includes a flat surface of the first mold and at least a part of the groove. a second mold, and the flexible substrate is sandwiched between the first mold and the second mold with its conductor pattern formed surface in contact with the flat surface of the first mold. According to any one of claims (1) to (7), wherein the molten resin material is press-fitted from the center of the recess of the second mold to fill the space between the first mold and the second mold. A method for manufacturing electronic component casings. (9) A hole forming a support is formed in the center of the flat surface of the first mold, and the flexible substrate is inserted into the first mold.
The conductor pattern forming surface is held between the mold and the second mold by contacting the flat surface of the first mold, and the molten resin material is poured from the center of the concave part of the second mold. By press-fitting, the molten resin material breaks through the flexible substrate and fills the hole forming the support of the first mold, and also fills the space between the first mold and the second mold. Claim (2) or (3) characterized in that the housing for the electronic component described in (3) is manufactured.
8) Method for manufacturing the electronic component casing described above. (10) A groove of a predetermined width is formed in the bottom of the recess of the second mold in the longitudinal direction of the flexible substrate to promote the inflow of the molten resin material. ) A method for manufacturing a housing for an electronic component described in (11) The electronic component casing according to claim (9), wherein a hole smaller in diameter than the support formation hole of the first mold is formed in a central portion of the conductive pattern forming portion of the flexible substrate. How the body is manufactured. (12) The method for manufacturing a housing for an electronic component according to claim (8), wherein the size of the conductive pattern forming portion of the flexible substrate is formed to be larger than the flat surface of the first mold by a predetermined size, and the A flexible substrate is held between a first mold and a second mold so that its conductor pattern forming surface is in contact with the flat surface of the first mold, and the flexible substrate is inserted from the center of the concave part of the second mold. Claim (3), characterized in that a molten resin material is press-fitted and filled between a first mold and a second mold, and the flexible substrate is brought into close contact with the surface of the first mold and deformed. (5) A method for manufacturing a housing for an electronic component as described above.