JPH01319906A - Cabinet of electronic part having flat cable and manufacture thereof - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a housing for electronic components with a flat cable and a method for manufacturing the same.

[Conventional technology]

Conventionally, electronic components such as rotary code switches, sliding code switches, rotary variable resistors, and sliding variable resistors used in electronic devices are made of substrates with various patterns, casings, and patterns on the substrate. It has a structure in which a substrate is fixed to the bottom of the casing, and the slider is rotatably or slidably supported on the substrate. Each of these components, such as the board, casing, and sliding body, is manufactured as a separate component, and these components are assembled in a later assembly process to complete the electronic component.

In addition, in recent years, as electronic components have become smaller and thinner, the housings of rotary cords, switches, sliding cord switches, rotary variable resistors, sliding variable resistors, rotary switches, and sliding switches have also become smaller. Efforts are being made to make it thinner and thinner.

[Problem to be solved by the invention]

However, in the conventional rotary electronic components and sliding electronic components described above, each component is manufactured separately and these components are assembled, so there is a limit to miniaturization and thinning.

Furthermore, as devices become smaller and thinner, there is a problem in that it becomes difficult to assemble each component.

In addition, when incorporating such miniaturized and thin electronic components into electronic equipment and connecting electric wires such as signal lines to external devices, it is difficult to connect the electric wires to small terminals. In addition to this, there were also problems with the reliability of the connection.

The present invention has been made in view of the above points, and its object is to integrally form a board and a flat cable with a thermoplastic synthetic resin film, and to place the flexible board within a synthetic resin molded housing. By inserting it into the board, the board, the housing and the flat cable are integrated,
This electronic component with a flat cable eliminates the need for assembling the board and the casing, greatly improves the miniaturization and thinness required for electronic components in recent years, and eliminates the need to connect the terminals of electronic components and cables. An object of the present invention is to provide a housing and a method for manufacturing the same.

[Means to solve the problem]

In order to solve the above-mentioned problems, the present invention provides a casing for an electronic component with a flat cable, the casing for an electronic component housing at least a board on which a conductive pattern is formed on which the contacts of a slider of the electronic component slide. In this method, a flexible substrate is used as the substrate, on which a conductor pattern is formed by etching at least a metal surface adhered or vapor-deposited on a synthetic resin film, and a wiring pattern electrically connected to the conductor pattern is used. When the flat cable made of the formed synthetic resin film is integrally formed with the flexible substrate and the casing of the electronic component is molded by injecting molten synthetic resin material, the conductive pattern of the flexible substrate is formed inside the casing. The flexible substrate was inserted so as to be exposed in the housing, and the flexible substrate was integrated with a housing made of synthetic resin, and the flat cable was extended from the side of the housing to the outside.

The present invention also provides a method for manufacturing a casing for an electronic component with a flat cable. a first mold in which a groove forming a side portion of the body is formed; a portion of the first mold that is disposed opposite to the first mold and includes a flat surface of the first mold and at least a part of the groove; and a second mold in which a concave portion is formed to form the bottom of the casing, and a flexible substrate formed integrally with the flat cable is placed between the first mold and the second mold. The conductor pattern forming surface is brought into contact with the flat surface of the first mold, and the molten resin material is press-fitted from the center of the recess of the second mold, thereby forming the first mold and the second mold. It was constructed by filling the space between the two.

[Effect]

By configuring the electronic component housing with a flat cable and its manufacturing method as described above, the flexible board and the synthetic resin housing are integrated, and the flat cable is extended from the side of the housing to the outside. The device can be made smaller and thinner, and the work of assembling the board and the casing and connecting the cables becomes unnecessary.

Additionally, it can be directly surface-mounted on a printed wiring board together with various other electronic components, making it possible to automate the mounting process.

Further, when a terminal portion made of a metal piece is formed at the end of the flat cable, the connection strength of the terminal portion is strong and the terminal portion can be made thinner, which is an excellent effect.

〔Example〕

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a case in which an embodiment of the present invention is applied to an electronic component, particularly a code switch, will be described in detail based on the drawings, but the present invention is not limited to the code switch.

Figure 1 is a diagram showing the structure of the housing of a rotary code switch with a flat cable according to the present invention. Figure 1 (A) is a back view of the housing, and Figure 1 (B) is a side view of the housing. (C) is a plan view of the housing, and (D) is a plan view showing the terminal structure when a terminal portion is provided at the end of the flat cable.

As shown in the figure, the housing of the rotary foot switch has a structure in which a flexible substrate 3 is inserted inside a resin molded housing 1, and a flexible substrate 3 is integrally formed from the side of the resin molded housing 1. A flexible flat cable 12 extends outward from the resin molded housing 1. In addition, a metal terminal piece 2-2 is attached to the end of the flexible flat cable 12 as shown in FIG.
A terminal portion 2 having terminals 1 to 2-5 is provided.

The resin molded housing 1 has a circular interior, side walls 1-2 are provided at its edges, and a column 1-1 that rotatably supports a rotary slider to be described later is provided at the center of the bottom. It is being Further, on the back side of the resin molded housing 1, there is a protrusion 1-
3.1-4 is formed.

The flexible substrate 3 has five current collection patterns 3-1 formed by etching on the upper surface of a resin film, and an insulator pattern 3-2 formed at a predetermined portion on the current collection patterns 3-1. The current collecting pattern 3 - 1 and the insulating pattern 3 - 2 of the flexible substrate 3 are exposed at the bottom of the resin molded casing 1 .

The flexible flat cable 12 has wiring patterns 12-1 to 12 continuous to the ends of the current collecting pattern 3-1.
-5 is formed, and a coating layer made of a resin material is formed on the portion excluding the end portion 12-6, and is electrically insulated.

Below, the configuration of each part of the housing of the above rotary foot switch,
The shape and manufacturing method will be explained.

FIG. 2 is a diagram for explaining the structure of the flexible substrate 3 formed integrally with the flexible flat cable 12 inserted into the resin molded casing 1 of the rotary code switch, and the manufacturing method thereof.

To manufacture the flexible substrate 3 that is integrally formed with the flexible flat cable 12, first, a band of thermoplastic and heat-resistant synthetic resin film is prepared, and a metal foil (for example, copper or aluminum) is bonded onto the synthetic resin film. Alternatively, such a metal is deposited on this film, and then this metal layer is etched to form five current collection patterns 3-1 of predetermined shapes and a wiring pattern continuous to the current collection patterns 3-1. 12-1 to 12-5 are formed (the wiring patterns 12-1 to 12-5 may be formed in a separate process from the current collecting pattern 3-1 by screen printing, etching in a separate process, etc.). ). Next, the current collecting pattern 3-
By forming an insulator pattern 3-2 on a predetermined portion of the foot switch 1, a code pattern for a foot switch is formed.

After forming these patterns, the synthetic resin film was cut, leaving the parts corresponding to the flexible flat cable 12 and the flexible substrate 3, and the support parts 10.11 at both upper and lower ends, and connected by the support parts 10.11. A flexible substrate 3 integrated with a large number of flexible flat cables 12 is made.

In this case, the current collection pattern 3-1, the insulator pattern 3
-2 and the wiring patterns 12-1 to 12-5 are formed by using a synthetic resin film on the flexible substrate 3, the portions corresponding to the wiring patterns 12-1 to 12-5, and the supporting portion 10.1.
Of course, this may be done after cutting all but 1. Furthermore, as the synthetic resin film, for example, a film of polyparabanic acid, polyetherimide, polyethylene terephthalate, etc. is used.

At the end of the flexible flat cable 12,
When providing metal terminal pieces in the terminal portion 2 as shown in D), prepare metal terminal pieces 2-1 to 2-5 integrally formed with the support member 20 as shown in FIG. The tip portions of the metal terminal pieces 2-1 to 2-5 are placed and bonded to the ends of the wiring patterns 12-1 to 12-5 of the flexible flat cable 12 by forming a conductive adhesive layer. Next, on the metal terminal pieces 2-1 to 2-5 joined to the ends of the wiring patterns 12-1 to 12-5, a terminal fixing film 2-6 made of a synthetic resin film of the same quality as the flexible flat cable 12 is placed. , and then metal terminal pieces 2-1 to 2-5
An ultrasonic emitting horn (not shown) is placed on the part where the terminal fixing film 2 is not located (part 2-7 in (D) of FIG. 1), and an ultrasonic wave is emitted from the horn. -6 and the flexible flat cable 12 are locally melted by ultrasonic heating, and the metal terminal pieces 2-1 to 2- are placed on the wiring patterns 12-1 to 12-5. 5 is firmly fixed by the shrinkage force of these synthetic resin films.

Next, the metal terminal pieces 2-1 to 2-5 are heated from above the terminal fixing film 2-6 or the flexible flat cable 12 with a heating iron to melt the conductive adhesive layer, thereby attaching the metal terminal pieces 2-1 to 2-5. The terminal pieces 2-1 to 2-5 are securely fixed onto the wiring patterns 12-1 to 12-5.

In addition, since the synthetic resin film is firmly melted and fixed by the ultrasonic heating, in some cases, the wiring patterns 12-1 to 12-5 and the metal terminal pieces 2-1 to 2-5 made of the conductive adhesive may be The adhesive between the two may be omitted.

After inserting this flexible board 3 into the resin molded housing 1 by the method described below, the A-A line in FIG.
By cutting on the B-B line and the C-C line, the terminal part 2
The flexible flat cable 12 and the flexible substrate 3 having the following are completed.

Next, a method of inserting the flexible substrate 3 integrally formed with the flexible flat cable 12 having the above structure into the resin molded housing 1 will be described.

As shown in FIG. 4(A), the flexible substrate 3 is
It is inserted between the mold A and the second mold B.

Here, the first mold A has a planar flat surface A1 formed in the center thereof, a circumferential groove A2 is formed around the flat surface A1, and a cylindrical shape in the center of the flat surface A1. A hole A3 is formed. The flat surface A1 is the surface on which the current collection pattern 3-1 and the insulator pattern 3-2 of the flexible substrate 3 are in close contact, and the circumferential groove A2 is the surface on which the side wall 1-2 of the resin molded casing 1 is in close contact.
(see Figure 1), and the hole A3 is the hole in which the support column 1-1 of the resin molded housing 1 is formed (see Fig. 1).
(See Figure 1).

A recess B1 is formed in the second mold B at a portion corresponding to the flat surface A1 and the circumferential groove A2 of the first mold A, and the molten resin is promoted to flow toward the end of the flexible substrate 3. Forming a concave groove B2 with a predetermined width 1. Further, a through hole B3 is formed approximately at the center of the recess B1. The recess B1 is a recess for forming the bottom of the resin molded housing 1, and the recess B2 is a recess for forming the bottom of the resin molded housing 1, and the recess B2 is a recess for forming the flat cable 1 integrally formed with the flexible substrate 3 when the molten resin is press-fitted through the through hole B3.
This is a groove for promoting the flow of molten resin in two directions and for bringing the flexible substrate 3 into close contact with the flat surface A1 of the mold A.

Next, as shown in FIG. 4(B), a heated and melted resin material (for example, a resin such as polyphenylene sulfide or polyethylene terephthalate) is press-fitted from the through hole B3 of the second mold B (arrow DI).

By press-fitting this molten resin, the recess Bl of the second mold B,
The inside of the concave groove B2 and the circumferential groove A2 of the first mold A is filled with molten resin material, and the synthetic resin film of the flexible substrate 3 is pierced by the press-fitting pressure of the molten resin material, and the molten resin material is filled into the hole A3 forming the support column 1-1 of the resin molded housing 1 (arrow D2). in this way,
By penetrating the plexiple board 3 and filling the hole A3 forming the support column 1-1 with the molten resin, the synthetic resin film is brought into close contact with the inner surface of the hole A3 (Fig. 4 (B)).
), and it will not peel off from the inner surface.

On the other hand, if a hole through which the molten resin material flows is formed in advance in the portion of the flexible substrate 3 where the hole A3 is located, the molten resin material that has passed through the hole and flowed into the hole A3 will flow into the inner surface of the hole A3. Since the molten resin material hits the end and is reversed, the reversed molten resin material enters between the flexible substrate 3 and the flat surface A1 of the first mold A, and the flexible substrate 3 is turned over between the flat surface A1 of the first mold A
1, the current collection pattern 3-1 of the flexible substrate 3
There is also a problem that the surface of the insulator pattern 3-2 is covered with a resin material, resulting in a defective product.

However, in this embodiment, the above-mentioned problem is solved by not forming holes in the flexible substrate 3 in advance as described above, but by making the flexible substrate 3 pierce by the press-fitting pressure of the molten resin material.

Also, when filling the molten resin, a concave groove B is formed in the second mold B.
2 is not completely formed, the molten resin material flows around from the recess B1 other than the recess B2 through the surrounding circumferential groove A2, and the upper surface of the flexible substrate 3 and flexible flat cable 12 located below the circumferential groove A2 is Since the molten resin is filled from the side first (in the direction shown by arrow D4), the flexible substrate 3 and the flexible flat cable 12 are pushed down to the recess B1 side of the second mold B, and in extreme cases, the flexible substrate 3 and the flexible flat cable cable 1
2 may be exposed on the back of the casing.

As a countermeasure against this, in this embodiment, a concave groove B2 is provided in the second mold B.
from the center of the recess B1 to the flat cable 12.
Since the flow of the molten resin material in the direction is made fastest in the part where it flows through this groove B2 (in the direction shown by arrow D3), the flexible flat cable 12 is placed on the side of the first mold A. While being pressed, the molten resin material is filled around the flexible substrate 3. In other words, before the force due to the inflow of the molten resin material in the direction shown by the arrow D4 in the figure is applied, the force shown by the arrow D3 is applied. As a result, the flexible flat cable 12 is never peeled off from the first mold A.

After filling the gap between the first mold A and the second mold B with the molten resin material as described above and solidifying the molten resin material, the first mold A and the second mold B are filled with the molten resin material. By removing B, a housing of an electronic component with a flat cable is completed in which a flexible substrate 3 is inserted into a resin molded housing 1 as shown in FIG.

Note that the resin molded casing 1 shown in FIGS. 1(A) and 1(B)
The convex surface 1-5 on the back surface is a convex surface formed by the groove B2 of the second mold B.

In the above explanation, an example was described in which a hole through which the molten resin material flows is not formed in the portion where the hole A3 of the first mold A of the flexible substrate 3 is located, but as shown in FIG. 4(C), Even if the inflow hole 3a for the molten resin material is formed in advance in the flexible substrate 3, if the diameter d of this hole 3a is set to be less than 1/2 of the diameter d of the hole A3 forming the support 1-1, then this hole 3
The molten resin material that has flowed into the hole A does not enter between the flexible substrate 3 and the wall of the first mold A, but is deformed as shown in the figure and comes into close contact with the inner wall of the hole A3, causing the flexible substrate 3 to 1
It was confirmed that the mold did not move away from the wall of mold A.

FIG. 5 is a schematic side cross-sectional view showing a rotary code switch using the housing of the electronic component with the flat cable.

In the figure, 5 is a rotor, and as shown in the figure, the rotor 5 is a disk-shaped rotor body 5-1 made of synthetic resin.
It has a structure in which a slider 5-2 is provided on the lower surface of the slider 5-2. The rotor 5 is attached to the resin mold casing 1 by inserting the support 1-1 of the resin mold casing 1 into the hole formed in the center of the rotor body 5-1 and heat caulking the tip of the support 1-1. It is rotatably supported inside. By rotating the rotor 5, the contacts of the slider 5-2 slide on the current collection pattern 3-1 and the insulator pattern 3-2 formed on the flexible substrate 3. As a result, between the wiring patterns 12-1 to 12-5 of the flexible flat cable 12, as shown in FIG. Between 12 and 5, it is in an on or off state (H or L signal) and changes its code signal value.

When the rotary code switch having the above configuration is mounted on the printed wiring board 100 shown in FIG. and attach it. At this time, the flexible flat cable 12 protrudes from the rotary foot switch and can be freely routed inside the electronic device.
6 or the terminal portion 2 can be connected to a desired electronic component. Therefore, it goes without saying that the shape of the flexible flat cable 12 may be changed into various shapes depending on the mounting position of the electronic components that connect it.

Note that 4 shown in FIG. 5 is a knob that rotates together with the rotor 5, and 4-1 is a fixing pin that fixes the knob 4 to the rotor 5.

As described above, by integrally configuring the flexible flat cable 12 and the flexible board 3 with a synthetic resin film, and by inserting the flexible board 3 into the resin mold casing 1 and integrating them, the resin mold casing 1 and the flexible board Not only does the assembly work described in step 3 become unnecessary, but the device can also be made smaller and thinner, and furthermore, the wiring work to the terminals becomes unnecessary.

FIG. 6 is a diagram showing the structure of the housing of another electronic component with a flat cable according to the present invention. FIG. 6(A) is a back view of the housing, and FIG. 6(B) is a side view of the housing. (C) is a plan view of the housing.

In the same figure, the parts that are different from the case of the electronic component with flat cable shown in FIG. 6, and a protrusion 1-7 is formed upward from the edge 1-6.

The other parts are the same as the casing of the electronic component with flat cable shown in FIG. 1 above, and the structure and manufacturing method thereof will be omitted.

Note that the end portion 12- of the flexible flat cable 12
6 includes metal terminal pieces 2-1 to 2-1 as shown in FIG. 1(D).
2-5 may be provided.

FIG. 7 is an exploded perspective view of a rotary code switch using the resin molded housing 1 shown in FIG. 6 above. The rotary code switch includes a resin molded housing 1, a rotor 6, a cover plate 7, and a rotary knob 8.

The rotor 6 has a disc shape made of a resin material, and has a cylindrical protrusion 6-4 formed in the center thereof, and a pair of engaging claws for attaching the rotary knob 8 by sandwiching the protrusion 6-4. 6-1.6
-2 is formed. Further, a protrusion 6-3 is formed for regulating the rotation of the rotor 6 within a predetermined range. Although not shown in the lower part of the rotor 6, there are also a current collection pattern 3-1 and an insulator pattern 3-2 of the flexible substrate 3.
A slider 6-6 is attached which slides into contact with (see FIG. 8).

The cover plate 7 is made of a metal plate, and has a through hole 7 in the center thereof through which the protrusion 6-4 of the rotor 6 and the engaging claws 6-1 and 6-2 pass.
2 are formed, and holes 7-1 are formed at the four corners thereof, through which the projections 1-7 of the resin molded housing 1 pass. Further, a tongue piece member 7-3 is provided downward from the center of the front end of the lid plate 7. The tongue piece member 7-3 is for fixing this rotary code switch to the printed wiring board 100.

The rotary knob 8 is a disc-shaped member with many unevenness formed around it, and a 68-3 (68-3) into which a protrusion 6-4 of the rotor 6 is inserted, as will be described later, is located at the lower center of the rotary knob 8. A protrusion 8-4 (see Fig. 8) is provided in the center of the rotor 6. A pair of holes 8-2.8- into which the
2 is formed, and an engaging stepped portion is formed on the inner wall of each of the holes 8-2 and 8-2.

FIG. 8 is a side cross-sectional view showing a rotary code switch made of the above components assembled and mounted on a printed wiring board 100.

As shown, the assembly of the rotary code switch is as follows:
First, the support column 1- formed in the center of the resin molded housing 1
1 is inserted into the recessed hole 6-5 formed at the center of the lower part of the rotor 6, and the rotor 6 is placed on the resin molded housing 1. Next, the projections 1-7 at the four corners of the resin molded casing 1 are inserted into the holes 7-1 at the four corners of the lid plate 7, and their tips are heat-swaged and attached to the lid plate 7. As a result, the protrusions 6-4 and - of the rotor 6 are
The pair of engaging claws 6-1 and 6-2 can be inserted into the through hole 7-2 of the cover plate 7.

Next, insert the protrusion 6-4 of the rotor ○ into the protrusion 68-3 formed on the protrusion 8-4 at the bottom of the rotary knob 8, and insert the engaging claw 6-1, 6-2 into the protrusion 68-2. Insert into 8-2, 68-2
．． The engagement claw 6-1 is attached to the engagement step formed on the wall of the engagement claw 6-1.
6-2 and attach the rotary knob 8 to the rotor 6.

In the rotary code switch having the above configuration, when the rotary knob 8 is rotated, the rotor 6 rotates, and the slider 6-6 attached to the lower part of the rotor 6 connects with the current collecting pattern 3-1 on the flexible substrate 3. It slides onto the insulator pattern 3-2. At this time, when the rotor 6 rotates by a predetermined amount, the protrusion 6-3 formed on the peripheral edge of the rotor 6 moves to the housing side wall 1-2.
Since the rotor 6 comes into contact with a protrusion 1-8 (see FIG. 7) formed on the inner circumferential surface of the rotor 6, the rotation range of the rotor 6 can be restricted to a predetermined range.

In the above example, the case of an electronic component with a flat cable was explained using the case of a rotary code switch as an example, but it can also be used as a case of other rotary electronic components with a flat cable, such as a rotary variable resistor. . In this case as well, most of the components of the above embodiment can be used, except that the shape of the conductive pattern formed by etching on the flexible substrate 3 is different.

FIG. 21 is a plan view showing a case where the housing of this rotary electronic component with a flat cable is used in a rotary variable resistor.

In the figure, 3-3 is a current collection pattern formed by etching metal foil formed on the flexible substrate 3 by adhesion or vapor deposition, and 3-4 is a current collection pattern formed on the flexible substrate 3 after the current collection pattern 3-3 is formed. This is a resistor pattern formed into a predetermined shape by printing or vacuum deposition. The other parts have the same structure as the rotary code switch shown in FIG. 1, so the details will be omitted.

FIG. 9 is a diagram showing the structure of the housing of another electronic component with a flat cable according to the present invention, FIG. 9(A) is a plan view of the housing, FIG. 9(B) is a partially sectional side view thereof, The same figure (C) is a back view, and the same figure (D) is the same figure (A) sectional view taken on the line AA.

In this embodiment, a housing for a sliding code switch is shown as a housing for an electronic component with a flat cable. As shown in the figure, the housing of the slide type code switch is constructed by integrally forming a flexible board 53 and a flexible flat cable 62 with a thermoplastic heat-resistant film 51, and placing the flexible board 53 in a resin molded housing 54. This is an inserted structure.

On the flexible substrate 53, a current collecting pattern 53-1 and an insulator pattern 53-2 which can be formed in a predetermined portion on the current collecting pattern 53-1 are formed. Further, on the flexible flat cable 62, a wiring pattern 62-1 is formed which is continuous with the end of the current collecting pattern 53-1 on the flexible substrate 53. In addition, the flexible substrate 5
No. 3 current collection pattern 53-1 and insulator pattern 53. -2
The portion where is formed is exposed at the bottom inside the resin molded casing 54.

Hereinafter, the structure and shape of each part of the housing of the slide type foot switch having the above structure and the manufacturing method thereof will be explained.

FIG. 10 is a diagram for explaining the manufacturing process of the flexible substrate 53 and the flexible flat cable 62, in which the heat-resistant film 51 is attached to the supporting members 51-1 and 51-1.
are connected continuously.

Five current collection patterns 53-1 are formed at predetermined positions on the surface of the heat-resistant film 51, and an insulator pattern 53-2 is formed at a predetermined portion on the current collection patterns 53-1. . Furthermore, a wiring pattern 62-1 is formed continuously at each end of these current collecting patterns 53-1.

Here, in order to form the current collecting pattern 53-1 and the wiring pattern 62-1, first, a metal foil (for example, copper or aluminum) is bonded on the heat-resistant film 51, or a metal foil such as copper or aluminum is bonded on the heat-resistant film. A metal layer is formed by vapor depositing a metal.

Then, this metal layer is etched in the shape of the current collecting pattern 53-1 and the wiring pattern 62-1 to form the current collecting pattern 53-1 and the wiring pattern 62-1.

Then, by printing an insulator pattern 53-2 at a predetermined position on this current collecting pattern 53-1, a code pattern is completed.

Note that the wiring pattern 62-1 does not need to be formed at the same time as the etching when creating the current collecting pattern 53-1; for example, it can be formed by etching or screen printing in a separate process after forming the current collecting pattern 53-1 by etching. You may.

Here, the portion of the heat-resistant film 51 where the current collecting pattern 53-1 and the insulator pattern 53-2 are formed becomes the flexible substrate 53 which becomes the substrate of the sliding foot switch, and the portion where the wiring pattern 62-1 is formed. becomes a flexible flat cable 62. Note that an insulating coating layer is formed on the upper part of the wiring pattern 62-1 except for the end portion 62-3 by applying a resin agent.

At the end 62-3 of the flexible flat cable 62,
When providing a terminal part as shown in Fig. 1(D),
As shown in FIG. 1, the metal terminal piece 55 integrally formed with the support portion 58 is placed on the end portion 62-3 of the wiring pattern 62-1 of the flexible flat cable 62.

Here, the end 62- of the flexible flat cable 62
A hot-melt type conductive adhesive layer is completely formed on the wiring pattern 62-1 of No. 3, and a terminal fixing film 57 made of the same synthetic resin material as the heat-resistant film i1 is placed over the metal terminal piece 55. The terminal fixing film 57 and the heat-resistant film 51 of the flexible flat cable 62 are locally heated by ultrasonic heating by emitting ultrasonic waves using an ultrasonic emitting horn (not shown) to areas where the metal terminal piece 55 is not located. The metal terminal piece 55 is press-bonded onto the wiring pattern 62-1.

Next, if the conductive adhesive is melted by applying a heating iron to the metal terminal piece 55 from above the terminal fixing film 57 or the heat-resistant film 51 of the end portion 62-3 and heating it, the metal terminal piece 55 will be melted on the wiring pattern 62-1. The terminal piece 55 is reliably bonded.

As a result, a terminal portion having substantially the same structure as that shown in FIG. 1(D) is formed.

And the end 6 of this flexible flat cable 62
2-3, when the metal terminal piece 55 is not attached to the flexible flat cable 62, the flexible board 53 formed integrally with the flexible flat cable 62 is inserted into the resin molded housing 54, and then the supporting members 51-1, 51-1 By removing , a resin molded housing 54 of the sliding foot switch as shown in FIG. 9 is completed.

Also, the end portion 62- of the flexible flat cable 62
3, when the metal terminal piece 55 is attached to the resin molded housing 54 of the slide type foot switch, the resin molded housing 54 of the slide type foot switch is further cut on the line D-D in FIG.
is completed.

The side portions of the resin molded housing 54 are formed to cover the outer periphery of the flexible substrate 53, as shown in FIG.
Four fixing protrusions 54-2 and four guide protrusions 54-3 for guiding the cover plate 61 are formed.

Moreover, two fixing protrusions 54-4, 54-4 for fixing the resin molded housing 54 to a printed wiring board described below are integrally formed on the back surface thereof.

Next, a method for inserting the flexible substrate 53 integrally formed with the flexible flat cable 62 into the resin molded housing 54 will be explained using FIG. 12.

That is, as shown in FIG. 12(A), the flexible substrate 5
3 and the flexible flat cable 62 are sandwiched between a first mold A and a second mold B.

Here, the first mold A has a flat surface A1 to which the surfaces of the current collecting pattern 53-1 and the insulating pattern 53-2 of the flexible substrate 53 are in close contact, and a resin mold casing 54 around the flat surface A1. A circumferential groove A2 forming a side portion 54-1 is formed. Although not shown, a recess is formed at the bottom of the circumferential groove A2 to form a fixing protrusion 54-2 and a guide protrusion 54-3 (see FIG. 9) of the resin molded housing 54.

On the other hand, the second mold B has a flat surface A1 of the first mold A.
A concave portion B1 forming the bottom of the resin molded housing 54 is formed in a portion corresponding to the circumferential groove A2, and a resin material is formed in the direction of the portion of the heat resistant film 51 where the flexible flat cable 62 penetrates the resin molded housing 54. In order to promote the inflow of the resin mold casing 54, a groove B2 of a predetermined width is formed in the longitudinal direction approximately at the center of the groove B1. −
5 is formed). Further, in order to form the fixing protrusions 54-4 and 54-4 on the back surface of the resin molded housing 54, a cylindrical recess B3 is formed at a predetermined position in the center longitudinal direction of the recess B1. Although not shown, a recess for forming the protrusion 54-6 of the resin molded housing 54 is also formed around the bottom of the recess B1.

Next, as shown in FIG. 12(B), a heated and melted resin material (for example, polyphenylene sulfide, polyethylene terephthalate, etc.) is poured into the hole B4 formed at the top of the recess B3 of the second mold B in the direction of the arrow D1. Press in as shown. By press-fitting the molten resin material, the heat-resistant film 51 of the flexible substrate 53 is pressed against the flat surface A1 of the first mold A.

Also, when press-fitting this molten resin material, the recess B of the second mold B
1, the molten resin material would pass through the circumferential groove A2 from the concave portion B1 other than the concave groove B2, and the molten resin material would wrap around the flexible substrate 53 and the flexible flat cable 62. Since the groove A2 is filled from the top side as shown by the arrow D2, the peripheral edges of the flexible substrate 53 and the flexible flat cable 62 are pushed down toward the recess B1 side of the second mold B, and in extreme cases, the peripheral edges There is a possibility that the portion may be exposed on the back surface of the resin molded casing 54.

However, in this embodiment, since a long groove B2 is formed in the central longitudinal direction of the recess B1 of the second mold B, the groove B2 has the effect of promoting the flow of the molten resin material. Therefore, the molten resin material is press-fitted from the center longitudinal direction (direction indicated by arrow D3) of the recess B1 first, and then gradually spreads to the periphery until it is completely filled, and finally fills the circumferential groove A2, so that the flexible substrate 53 and the flexible Since the flat cable 62 is pushed toward the first mold A until after the molten resin material is press-fitted into the inner shell, the flexible substrate 53 and the flat cable 62 are not separated from the flat surface A1 of the first mold A. That is, since the molten resin material does not flow between the flat surface A1 of the first mold A and the flexible substrate 53, after the molten resin material hardens as described later, the first mold A and the second mold When mold B is removed, resin molded housing 5
The surface of the flexible substrate 53 is completely exposed at the bottom of the flexible substrate 4.

After filling the space between the first mold A and the second mold B with the molten resin material as described above, remove the first mold A and the second mold B after the resin material has solidified. For example, the housing of the sliding code switch shown in FIG. 9 is completed.

FIG. 13 is a side sectional view showing the structure of a slide-type code switch using the housing of this flat cable-equipped code switch.

As shown in the figure, a sliding body 59 is placed on a flexible substrate 53 inserted into a resin molded housing 54. A current collecting pattern 53-1 and an insulator pattern 53 formed on the flexible substrate 53 are provided at the bottom of the sliding body 59.
-2 is provided with a sliding element 60, and an operating lever 59a is integrally formed on the upper part thereof. Then, the lid plate 61 is placed on top of the side portion 54-1 of the resin molded housing 54, and the sliding body 59 is attached to the lid plate 61 and the flexible substrate 53 by thermally caulking the tip of the fixing protrusion 54-2. hold in between. This completes the sliding code switch.

In the slide type code switch having the above structure, when the operating lever 59a is operated and the slider 59 is moved, the slider 60 moves the current collection pattern 53-1 and the insulator pattern 53-
2, the contacts of the slider 60 and the current collection pattern 53
-1 changes, the wiring pattern 62-1 of the flexible flat cable 62 connected to each current collection pattern 53-1 changes to on or off, and an H or L signal change is output. Ru.

As described above, the flexible substrate 53 on which the current collecting pattern 53-1 and the insulator pattern 53-2 are formed, and the flexible flat cable 62 on which the wiring pattern 62-1 is formed, are covered with a heat-resistant film 51 made of thermoplastic synthetic resin. If the heat-resistant film 51 is insert-molded into the resin molded housing 54 made of synthetic resin, not only does the assembly work of the flexible substrate 53 and the resin molded housing 54 become unnecessary, but also the slide type foot switch It can be made smaller and thinner, and there is no need to connect electric wires to the terminals of electronic components.

In the above embodiment, a slide type foot switch was explained as an example, but by changing the pattern that can be formed on the flexible substrate 53, it can also be used as a slide type variable resistor or the like. For example, when using it as a sliding variable resistor, conductive foil such as copper or aluminum is etched in the same way as above to form a current collection pattern and a wiring pattern in a predetermined shape, and then a resistor pattern in a predetermined shape is further etched. It may be formed by vacuum evaporation or by printing a conductive paste that becomes a resistor.

FIGS. 14 and 15 are diagrams showing the structure of another electronic component resin molded housing with a flat cable according to the present invention,
Figure 14 is a perspective view, Figure 15 (A) is a plan view of the casing,
5(B) is a partially sectional side view thereof, FIG. 15(C) is a back view thereof, and FIG. 15(D) is a sectional view taken along the line A--A in FIG. 15(A). In this embodiment, a slide code switch will be explained as an example of an electronic component.

As shown in the figure, a flexible substrate 73 inserted into a resin molded housing 74 and a flat cable 75 are integrally formed with a heat-resistant film 71. A current collecting pattern 73-1 and an insulator pattern 73-2 are formed on the flexible substrate 73, and a wiring pattern 7 continuous with the end of the current collecting pattern 73-1 is formed on the flat cable 75.
5-1 is formed. The upper surface of the flat cable 75 except for the end portion 75-2 of the flat cable 75 is coated with a resin to form an insulating coating. Current collection pattern 73-1 of flexible substrate 73 and current collection pattern 73
The insulator pattern 73-2 completely formed on -1 is exposed on the bottom surface of the housing and the inner surfaces of both side walls.

Hereinafter, the configuration of each part of the casing of the electronic component having the above configuration and the manufacturing method thereof will be explained in detail.

FIG. 16 is a diagram for explaining the manufacturing process of the flexible substrate 73 and the flat cable 75. The flexible substrate 73 and the flat cable 75 are continuously connected by a support member 71-1, 71-1 integrally formed of a heat-resistant film. As the material of the heat-resistant film 71, for example, polyparabanic acid, polyetherimide, polyethylene terephthalate, etc. are used.

Here, in order to form the current collecting pattern 73-1 and the wiring pattern 75-1, first, a metal foil (for example, copper or aluminum) is adhered on the heat-resistant film 71, or copper, aluminum, etc. A metal layer is formed by vapor-depositing a metal. Then, this metal layer is etched into the shape of the current collecting pattern 73-1 and the wiring pattern 75-1, and the current collecting pattern 73-1 and the wiring pattern 75-1 are etched.
-1. Note that this wiring pattern 75-1 may be formed in a separate process from the formation of the current collecting pattern 73-1, for example, by etching the current collecting pattern 73-1.
After forming the wiring pattern 75-1, the wiring pattern 75-1 may be formed by etching in a separate process or by printing conductive paste.

Next, a code pattern is completed by printing an insulator pattern 73-2 on a predetermined portion of the current collecting pattern 73-1.

Here, the width of the flexible substrate 73 is larger than the width of the flat cable 75 by a predetermined dimension.

After inserting the flexible board 73 into the resin molded housing 74 made of synthetic resin so that the flat cable 75 protrudes outside as described above, the supporting portion 71-1.7
By removing 1-1, an electronic component resin molded housing with a flat cable is completed.

A side portion 74-1 of the resin molded housing 74 is formed to cover the outer periphery of the flexible substrate 73, and a stopper protrusion 74-3 is formed on both sides of one end of the side portion 74-1. Further, an inclined surface 74-2 is formed at a predetermined position on the top of the side portion 74-1, and is inclined toward the inside of the resin molded housing 74.

Next, a method for inserting the flexible substrate 73 integrally formed with the flat cable 75 into the resin molded housing 74 will be explained using FIG. 18.

That is, first, as shown in FIG. 18(A), a flexible substrate 73 and a flat cable 75, 75, which are integrally formed of a heat-resistant film, are sandwiched between a first mold A and a second mold B.

Here, the first mold A has a flat surface A1 that is in close contact with the surface on which the current collection pattern 73-1 and the insulator pattern 73-2 of the flexible substrate 73 are formed, and a resin around the flat surface A1. A circumferential groove A2 forming a side portion 74-1 of the mold housing 74 is formed.

On the other hand, the second mold B has a flat surface A1 of the first mold A.
A recess B1 forming the bottom of the resin molded casing 74 is formed in a portion corresponding to the circumferential groove A2, and the recess B1 is
Convex portion B4 for obstructing the flow of the molten resin material in the longitudinal direction of the heat-resistant film 71 and promoting the flow in the width direction.
are formed at predetermined intervals. In addition, the recess B1
A filling hole B3 for filling with molten resin material is completely formed in the center of the hole.

A resin material made by heating and melting polyphenylene sulfide, polyethylene terephthalate, etc., for example, is press-fitted from the filling hole B3 as shown by the arrow D1.

By press-fitting this molten resin material, the recess B1 of the second mold B is formed.
The molten resin material flows into the heat-resistant film 71 in the width direction (vertical direction in the drawing) due to the convex portion B4 formed in the recessed portion B1, as shown in FIG. 18(C). As shown in Figure (B), the current collecting pattern 73-1 and the insulating pattern 73-2 on both sides of the flexible substrate 73 are pushed by this molten resin material, and one side of the circumferential groove A2. It is folded along the side and fits closely against the side.

If during this filling, the convex part B of the concave part B1 of the second mold B
4, the molten resin material flows radially from the filling hole B3, and the molten resin material flowing in the longitudinal direction of the recess B1 flows from the side of the flat cable 75.75 (JA both ends to the circumferential groove A2
A part of it enters between the sides of the circumferential groove A2 and the portions on both sides of the flexible substrate 73 where the current collecting pattern 73-1 and the insulator pattern 73-2 are formed, and the current collecting pattern 73- 1 and the insulator pattern 73-2 are not sufficiently bent, and there is a problem that the surfaces of the current collecting pattern 73-1 and the insulator pattern 73-2 are covered with a resin material.

However, in the above embodiment, the convex portion B4 is located at the bottom of the concave portion B1.
, B4 are formed, the flow of the molten resin material in the longitudinal direction of the recess B1 is obstructed, and the heat-resistant film 71
Since the flow in the width direction is promoted and flows into the circumferential groove A2, the surface of the flexible substrate 73 of the heat-resistant film 71 is bent along the side surface of the circumferential groove A2 and comes into close contact with the side surface. Therefore, the surfaces of the current collecting pattern 73-1 and the insulating pattern 73-2 on both sides of the flexible substrate 73 are not covered with the resin material.

That is, since the molten resin material does not flow between the side surface of the flat surface A1 of the first mold A and the flexible substrate 73, as will be described later, after the molten resin material has solidified, the first mold When mold A and second mold B are removed, the resin mold casing 7
The current collection pattern 73-1 and the insulator pattern 73-2 of the flexible substrate 73 are exposed on the inner bottom and inner surfaces of both side walls of the flexible substrate 73.

After filling the space between the first mold A and the second mold B with the molten resin material as described above, remove the first mold A and the second mold B after the resin material has solidified. For example, a housing for a sliding code switch as shown in FIG. 14 is completed.

FIG. 17 is a diagram showing the structure of a sliding code switch made using the resin molded housing 74.
Figure (A) is a partial side cross-sectional view (a cross-sectional view taken along line E-E in Figure (B)), and Figure 17 (B) is a cross-sectional view (F-F in Figure (A)).
(line sectional view).

As shown in the figure, a sliding body 80 is provided on the outer periphery of the resin molded housing 74 of the sliding code switch having the above structure. The sliding body 80 is made of a resin material, and an operating knob 81 is integrally formed on the side thereof. Reference numeral 83 denotes a contact point that slides between the current collecting pattern 73-1 and the insulator pattern 73-2 on the inner bottom surface of the flexible substrate 73, and 84 indicates the contact point that comes into sliding contact with the current collecting pattern 73-1 and the insulator pattern 73 on both inner side surfaces of the flexible substrate 73. It is a contact that slides into -2. These contacts 83 and 84 are integrally formed by a contact member 85, and the contact member 85 is inserted into the main body of the sliding body 80. Furthermore, a pair of claw members 82 and 82 are formed on both sides of the sliding body 80, respectively, to engage with both sides of the bottom outer surface of the resin molded housing 74.

By abutting the upper part of the resin molded casing 74 between the claw members 82, 82 of the slider 80 having the above structure and pressing the slider 80, the claw members 82, 82 open on both sides and exit the resin molded casing 74. The projections of the claw members 82 and 82 descend along the side surface of the resin molded housing 74 and engage with the bottom surface of the outer periphery of the resin molded housing 74 . As a result, a sliding code switch using the resin molded housing 74 is completed.

Operation knob 81 of the sliding foot switch with the above configuration
When the slider 80 is moved in the longitudinal direction of the resin molded housing 74, the contacts 83 and 84 slide on the upper surfaces of the current collection pattern 73-1 and the insulator pattern 73-2, respectively, and connect the five wirings. One wiring pattern 75-1 among the patterns 75-1 is set as a common, and the on/off state between the other four wiring patterns 75-1 is changed.

Note that the end portion 75-2 of the flat cable 75 may be provided with a terminal portion including a metal terminal piece as shown in FIG. 1CD).

In the above embodiment, the current collection pattern 73-1 and the insulator pattern 73-2 of the flexible substrate 73 were configured to be exposed on the inner bottom surface and both inner wall surfaces of the resin molded casing 74, but the current collection pattern 73 -1. Insulator pattern 7
3-2 may be exposed on the inner bottom surface and one inner surface of the resin molded housing 74. In addition, the current collecting pattern 73-
1. It goes without saying that the number of insulator patterns 73-2, etc. may be changed as necessary.

As described above, the flexible substrate 73 on which the food pattern consisting of the current collecting pattern 73-1 and the insulator pattern 73-2 is formed, and the flat cable 75 on which the wiring pattern 75-1 is formed are attached to a heat-resistant film made of thermoplastic synthetic resin. 71, and the flexible substrate 73 is formed such that its current collecting pattern 73-1 and insulator pattern 73-2 are exposed on the inner bottom surface of the resin molded casing 74 and the inner wall surfaces on both sides of the resin molded casing 74. As a result, the inner surface of the resin molded casing 74 can be effectively used, the slide type code switch can be made smaller and thinner, and the work of assembling the flexible substrate 73 and the resin molded casing 74 becomes unnecessary. Also, since it comes with a flat cable, there is no need to connect wires to this slide type code switch.

Furthermore, although the above embodiment has been explained using a slide type code switch as an example, the present invention is not limited to this.
It can also be used as a sliding switch or sliding variable resistor.

For example, when using it as a sliding variable resistor,
In the same manner as above, conductive foil such as copper or aluminum is etched to form a current collector pattern and a wiring pattern in a predetermined shape, and then a resistor pattern in a predetermined shape is further vacuum-deposited or a conductive paste that becomes a resistor is printed. It can be formed by

FIG. 19 is a perspective view showing the structure of another resin molded housing of an electronic component with a flat cable according to the present invention.

In this embodiment, a flexible substrate 93 is inserted so as to be exposed on the inner bottom surface of the resin molded housing 91, the inner surface of the side wall 91-2 of the resin molded housing 91, and the outer peripheral surface of the support column 91-1. It has a shape in which a flat cable 92 integrally formed with a substrate 93 is extended outward from the side of a resin molded casing 91. The method of inserting the flexible substrate 93 into the resin molded housing 91 is substantially the same as that shown in FIG. 4, so its explanation will be omitted.

By configuring as described above, the resin molded housing 9
A current collecting pattern 93-1 and an insulator pattern 93-2 are provided on the inner bottom surface of the first frame, the inner surface of the side wall 91-2, and the outer peripheral surface of the support column 91-1.
is exposed. Also, from the side of the resin molded housing 91,
A flat cable 92 is extending. The upper surfaces of the flange 1 to the cable 92 are coated with an insulating coating coated with a resin, except for the end portion 92-2.

FIG. 20 is a sectional view showing a state in which a rotary code switch using the resin molded housing 91 having the above structure is mounted on a printed wiring board 100, and the structure of the rotary foot switch shown in FIGS. 7 and 8 is schematically illustrated. It is concave.

As shown in the figure, in order to assemble this rotary code switch, first insert a column 91-1 formed in the center of the resin molded housing 91 into a hole 91-1 formed in the center of the lower part of the rotor 96.
-5, and place the rotor 96 on the resin molded housing 91. Then, tighten the engaging claws 96-1, 96-2 to 698-
2.98-2, the engaging claw 96-1.96-2 is engaged with the stepped portion formed on the wall of the 698-2.98-2, and the rotary knob 98 is attached to the rotor 96.

In the rotary code switch configured as described above, when the rotary knob 98 is rotated, the rotor 96 rotates;
The slider 96-6 attached to the bottom surface of the rotor 96 slides on the current collector pattern 93-1 and the insulator pattern 93-2 exposed on the inner bottom surface of the resin molded housing 91, and contacts the inner peripheral surface of the rotor 96. The attached slider 96-7 slides on the current collecting pattern 93-1 exposed on the outer circumferential surface of the support column 91-1, and the slider 96-8 attached on the outer circumferential surface of the rotor 96 slides on the current collecting pattern 93-1 exposed on the outer circumferential surface of the support column 91-1. 9
The current collecting pattern 93-1 and the insulator 93-2 exposed on the inner surface of the electrode 1-2 are brought into sliding contact. As a result, the code signal between each wiring pattern 92-1 of the flat cable 92 changes.

By configuring the resin molded casing of the electronic component with a built-in flexible board as described above, the resin molded casing 9
1 can be effectively used, and the rotary code switch can be made extremely compact.

In the above embodiment, the resin molded case of a rotary code switch was explained as an example, but by changing various patterns formed on the flexible substrate 3, it can also be used for a rotary variable resistor or the like.

For example, when using it as a rotary variable resistor, conductive foil such as copper or aluminum is etched in the same way as above to form a current collection pattern and a wiring pattern in a predetermined shape, and then a resistor pattern in a predetermined shape is further etched. It may be formed by vacuum evaporation or by printing a conductive paste that becomes a resistor.

Although the embodiments of the casing of an electronic component with a flat cable and the manufacturing method thereof according to the present invention have been described in detail above, the present invention is not limited thereto, and various modifications can be made within the scope of the present invention. Needless to say.

〔Effect of the invention〕

As described in detail above, according to the casing of an electronic component with a flat cable and the manufacturing method thereof according to the present invention, the following effects are produced.

■As a substrate: A flexible substrate is used on which a conductive pattern is formed by etching at least the metal surface adhered or vapor-deposited on a synthetic resin film, and a wiring pattern is formed to be electrically connected to the conductive pattern. A flat cable made of a synthetic resin film is formed integrally with the flexible substrate, and when the casing of the electronic component is molded by injecting molten synthetic resin material, the conductor pattern of the flexible substrate is formed inside the casing. The flexible board and the synthetic resin casing are integrated by inserting the flexible board so that it is exposed on the board, and the flat cable is extended from the side of the casing to the outside, so that the casing can be made smaller and thinner, and the board There is no need to assemble the housing and the cable connection work.

(2) Furthermore, an electronic component using the electronic component housing with a flat cable according to the present invention can be directly surface-mounted on a printed wiring board together with various other electronic components, making it possible to automate the mounting.

■Also, when forming a terminal portion made of a metal piece at the end of the flat cable of the housing of the electronic component with a flat cable according to the present invention, the metal terminal is formed on the end of the conductor pattern at the end of the flat cable. The two pieces are connected, a terminal fixing film is placed on top of the terminal fixing film, and the terminal fixing film and the flexible board film are locally welded, so the connection strength of the terminal part is strong, and the terminal fixing film is locally welded to the flexible board film. This has the excellent effect of making the terminal portion thinner.

[Brief explanation of the drawing]

Figure 1 is a diagram showing the structure of a resin molded housing for an electronic component with a flat cable according to the present invention, where Figure 1 (A) is a back view of the housing, and Figure 1 (B) is a side view of the housing. (C) is a plan view of the casing, and (D) is a plan view showing the structure of the terminal portion. FIGS. 2 and 3 are diagrams for explaining a method of manufacturing a flexible substrate and a flat cable. FIGS. 4(A), 4(B), and 4(C) are diagrams for explaining a method of inserting a flexible substrate into a resin molded casing. FIG. 5 is a side sectional view of a rotary foot switch using a resin molded electronic component housing with a flat cable. FIG. 6 is a diagram showing the structure of another electronic component resin molded housing with a built-in flexible substrate according to the present invention, and FIG. 6(A)
is a rear view of the case, (B) is a cross-sectional view of the side of the case, and (C) is a side view of the case.
is a plan view of the casing. FIG. 7 is an exploded perspective view of a rotary code switch using the resin molded housing shown in FIG. 6, and FIG. 8 is a sectional view of the assembled rotary code switch. FIG. 9 is a diagram showing the structure of another electronic component resin molded casing with a flat cable according to the present invention. FIG. 9(A) is a plan view of the casing, and FIG. Front view, same view (
C) is a back view of the housing, and FIG. FIG. 10 and FIG. 11 are diagrams for explaining the method of manufacturing a flexible substrate and a flat cable, respectively. FIGS. 12(A) and 12(B) are diagrams for explaining a method of inserting a flexible substrate into a resin molded casing. FIG. 13 is a side sectional view showing the structure of a slide type code switch using the resin molded housing of the electronic component with flat cable shown in FIG. 9. FIGS. 14 and 15 are diagrams showing the structure of another electronic component resin molded housing with a flat cable according to the present invention,
Figure 14 is a perspective view, Figure 15 (A) is a plan view of the housing, Figure 15 (B) is a partial side view, Figure 15 (C) is a back view, Figure 15 (D) is the same view. It is a sectional view on the line AA of (A). 1st
FIG. 6 is a diagram for explaining a method of manufacturing a flat cable and a flexible substrate. FIG. 17 is a diagram showing the structure of a sliding code switch using the electronic component resin molded housing with flat cable shown in FIG. 14, and FIG. 17 (A) is a partial side sectional view (
B) is a sectional view taken along the line E-E, and CB) is a sectional view taken along the line FF of FIG. FIGS. 18A, 18B, and 18C are diagrams for explaining a method for inserting a flexible substrate into a resin molded housing. FIG. 19 is a perspective view showing the structure of another electronic component resin molded housing with a flat cable according to the present invention, and FIG. 20 is a side sectional view of a rotary foot switch using this resin molded housing. FIG. 21 is a plan view showing a case where the electronic component housing with a flat cable according to the present invention is used in a rotary variable resistor. In the figure, 1.54.74... Housing, synthetic resin film, 3,53,73.93... Flexible group,
Plate, 3-1.53-1.73-1.93-1... Current collection pattern (conductor pattern), 3-2.53-2.73
-2.93-2...Insulator pattern, 5°6.96.
...Rotor, 5-2, 6-6, 60, 96-6.
96-7.96-8...Slider, 1-1, 91-1
... Support column, A... First mold, A1... Flat surface,
A2...groove, A3...hole, 3a...hole, B...
Second mold, B1... recess, B2... recessed groove, 12,
62,75.92...Flat cable, 2...Terminal part, 2-1 to 2-5...Metal terminal piece, 2-6.57
...Terminal fixing film, 12-6...End part, 59
...It is a sliding body.

Claims (13)

[Claims] (1) In a housing for an electronic component that houses therein a substrate on which a conductive pattern is formed with which at least the contacts of a slider of the electronic component slide, the substrate is formed by at least adhesion or vapor deposition on a synthetic resin film. A flexible substrate on which a conductor pattern is formed by etching the formed metal foil is used, and a flat cable made of a synthetic resin film on which a wiring pattern electrically connected to the conductor pattern is formed is connected to the flexible substrate. When the housing of the electronic component is molded by injecting a molten synthetic resin material, the flexible board is inserted into the housing so that its conductive pattern is exposed, and the flexible board and the synthetic resin are molded together. A casing for an electronic component with a flat cable, characterized in that the casing is integrated with a casing, and the flat cable is extended to the outside from a side of the casing. (2) Connect a metal terminal piece to the end of the wiring pattern at the end of the flat cable, place a terminal fixing film on it, and locally connect the terminal fixing film and the flexible board film. 2. The casing for an electronic component with a flat cable according to claim 1, further comprising a terminal portion welded to the casing. (3) The interior of the synthetic resin casing is formed into a substantially circular shape, and a pillar for rotatably supporting a rotary body is formed integrally with the casing in the center thereof, and a pillar for rotatably supporting the rotating body is formed integrally with the casing, and the support for supporting the flexible substrate is Claim (1) characterized in that the conductor pattern is exposed in a substantially concentric manner at the bottom of the casing with the pillar as the center.
A housing for an electronic component with a flat cable according to 1) or (2). (4) The flexible substrate is formed a predetermined amount larger than the bottom surface of the synthetic resin housing, and the conductive pattern is exposed at the bottom of the housing, the outer peripheral surface of the support column, and/or the inner surface of the side wall. Claim (1) or (2) or (
3) Housing of electronic components with flat cable as described. (5) The interior of the synthetic resin casing is formed in a rectangular shape so that a sliding body of a sliding electronic component can slide therein;
Claim (1) characterized in that the conductor pattern of the flexible substrate is formed substantially parallel to the long sides of the rectangular shape.
A housing for an electronic component with a flat cable according to 1) or (2). (6) Claim (5) characterized in that the flexible substrate is formed a predetermined amount larger than the inner bottom surface of the synthetic resin casing, and the conductor pattern of the flexible substrate is exposed on the bottom of the casing and the inner surface of the side wall. Housing for electronic components with flat cable as described. (7) The flexible substrate is formed by forming a conductor pattern by etching a metal surface that is adhered or vapor-deposited on a synthetic resin film, and also by forming a predetermined insulator pattern on the conductor pattern. The casing of an electronic component with a flat cable according to any one of claims 1 to 6, characterized in that the casing has a pattern. (8) The flexible substrate is made variable by forming a conductor pattern on a synthetic resin film by etching a metal surface adhered or vapor-deposited, and forming a resistor pattern on the synthetic resin film. Claims (1) to (6) characterized in that the pattern is a resistor pattern.
A casing for an electronic component according to any one of the following. (9) A first flat surface in which the conductor pattern-formed surface of the flexible substrate made of the synthetic resin film is in close contact, and a groove forming a side part of the synthetic resin casing is formed around the flat surface. a second mold, which is disposed opposite to the first mold, and has a recess forming a bottom of the casing in a portion of the first mold that includes the flat surface of the first mold and at least a part of the groove.
A flexible substrate formed integrally with a flat cable is placed between a first mold and a second mold, with its conductor pattern forming surface facing the flat surface of the first mold. Claim (1) characterized in that the first mold and the second mold are held in contact with each other, and a molten resin material is press-fitted from the center of the recess of the second mold to fill the space between the first mold and the second mold. The method for manufacturing a housing for an electronic component with a flat cable according to any one of (8) to (8). (10) A hole forming a support is formed in the center of the flat surface of the first mold, and the flexible substrate formed integrally with the flat cable is inserted between the first mold and the second mold. The molten resin is held between the molds by bringing the conductor pattern forming surface into contact with the flat surface of the first mold, and press-fitting the molten resin material from the center of the recess of the second mold. The flat according to claim (3) or (4), wherein the material is penetrated through the flexible substrate and filled into the hole forming the support of the first mold, and between the first mold and the second mold. 10. The method of manufacturing a housing for an electronic component with a flat cable according to claim 9, characterized in that the housing for an electronic component with a cable is manufactured. (11) Claims (9) or (1) characterized in that a groove of a predetermined width is formed at the bottom of the concave portion of the second mold to promote the inflow of the molten resin material toward the flat cable.
0) Method for manufacturing a housing for an electronic component with a flat cable as described above. (12) An electronic device with a flat cable according to claim (10), characterized in that a hole smaller in diameter than the pillar forming hole of the first mold is formed in the center portion of the conductive pattern forming portion of the flexible substrate. A method of manufacturing a component housing. (13) The method for manufacturing a housing for an electronic component with a flat cable according to claim (9), wherein the size of the conductive pattern forming portion of the flexible substrate is made larger by a predetermined size than the flat surface of the first mold. Then, the flexible substrate is held between a first mold and a second mold so that its conductor pattern forming surface is in contact with the flat surface of the first mold, and the recess of the second mold is Claim 1, characterized in that a molten resin material is press-fitted from the center and filled between the first mold and the second mold, and the flexible substrate is brought into close contact with the surface of the first mold and deformed. 4) or the method for manufacturing a housing for an electronic component with a flat cable according to (6).