JPH01303705A - Chip type inductor and mounting thereof - Google Patents

Abstract

PURPOSE:To make it possible to easily automate the mounting process of the title inductor by a method wherein each conductive surface, to be used for connection, is formed on the lower surface of a dielectric, one conductive surface is brought into the state wherein it is conductive to the upper surface of the dielectric. CONSTITUTION:The conductive surface 10, constituting the electrode, on the circuit forming side, formed on the surface of a dielectric 9 is composed of the conductive surface 11 located on the upper surface of the dielectric 9, the conductive surfaces 12A and 12B on each side face of the dielectric 9, and one of conductive surfaces 13A and 13B on the lower surface of the dielectric 9. The other conductive surface 14 on the lower surface of the dielectric 9 is formed by the metal film same as the conductive surface 10, said conductive surface 14 is positioned in the middle of the conductive surfaces 13A and 13B, they are electrically isolated with each other, aid the conductive surface 14 constitutes the electrode on the earth side. Also, connection patterns 16A, 16B and 17 are formed on the position corresponding to the part where the conductive surfaces 13A and 14, which constitute each electrode used when a dielectric resonator 8 is attached on a substrate 15, and they are soldered by heat-fusing cream solder. Through these procedures, the automation of the mounting process can be made possible.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a chip-type inductor and a method for mounting the same, and in particular to a dielectric resonator used in a high-frequency module such as a car phone, and a method for mounting the dielectric resonator on a substrate. Regarding how to implement.

[Prior Art] FIG. 2 is a diagram showing a state in which a conventional chip-type inductor is mounted.

In the figure, 1 is a dielectric resonator as a chip inductor, 2 is a dielectric, 3 is an internal electrode, 4 is an external electrode, and 5
6 is a bent lead terminal, 6 is a substrate, and 7 is a connection pattern. The lead terminal 5 is connected to one end of the internal electrode 3, and by soldering the end of the lead terminal 5 to the connection pattern 7 on the substrate 6, the dielectric resonator 1 is connected to the substrate 6.
implemented on top.

Furthermore, Japanese Utility Model Application Laid-Open No. 60-25218 proposes connecting lead terminals directly to elements such as capacitors and coils, omitting the connection pattern 7, and simplifying the effort at the time of mounting.

[Problems to be Solved by the Invention] However, in the configuration and the mounting method shown in FIG. Since the other end must be reliably soldered to the connection pattern or other circuit elements, it is difficult to automate the mounting process, and the current situation is that it relies on manual work.

Furthermore, when mounting the dielectric resonator on the substrate, lead terminals are used for connection, resulting in a problem that the selectivity Q is reduced.

The present invention has been made in view of the above circumstances, and its purpose is to provide a chip-type inductor and its mounting method that can automate the mounting process, as well as to provide a high-frequency module by mounting with a high selectivity Q. It is to make it.

[Means for Solving the Problems] In order to solve the above-mentioned problems, the present invention provides a chip-type inductor in which conductive surfaces are formed on both sides of a plate-shaped dielectric. The conductive surface of one of the conductive surfaces is formed in a conductive state with the upper conductive surface,
One of the divided conductive surfaces and the other conductive surface formed both electrodes of the inductor. In the second invention, in a method of mounting a chip-type inductor in which conductive surfaces are formed on both sides of a plate-shaped dielectric material on a substrate, the lower conductive surface is divided and one of the conductive surfaces is used as the upper conductive surface. Mounting is performed by forming a conductive state in a conductive state, providing a connection pattern at a corresponding position to each of the divided conductive surfaces on the substrate, and connecting each of the divided conductive surfaces and each connection pattern using a conductive adhesive material. method.

[Function] According to the first invention, the upper conductive surface and the other lower conductive surface are formed separately with a dielectric interposed therebetween, and an inductor is configured between each of these separate conductive surfaces, One conductive surface on the lower surface is electrically connected to the conductive surface on the upper surface, and therefore both electrodes of the inductor are arranged on the lower surface by one conductive surface and the other conductive surface on the lower surface.

According to the second invention, the two electrodes according to the first invention and the respective connection patterns provided on the substrate at positions corresponding to the two electrodes are connected and mounted using a conductive adhesive material.

[Embodiment] FIG. 1 is a diagram of a mounting state of a chip-type inductor showing an embodiment of the present invention, and FIG. 3 is a diagram of the dielectric resonator of FIG. 1 viewed obliquely from below.

In FIGS. 1 and 3, 8 is a dielectric resonator as a chip-type inductor, and 9 is a dielectric of the dielectric resonator 8. In FIG. Reference numeral 10 denotes conductive surfaces forming electrodes on the circuit formation side formed on the surface of the dielectric 9, including a conductive surface 11 on the top surface of the dielectric 9 and conductive surfaces 12A on each side surface.

12B, and one of the lower conductive surfaces 13A and 13B, which are integrally formed of a printed metal film such as Ag-Pd alloy. Reference numeral 14 denotes the other conductive surface on the lower surface of the dielectric 9, which is formed of the same metal film as the conductive surface 10, and is located at an intermediate position between the conductive surfaces 13A and 13B, and is electrically isolated from each other. It forms the electrode on the ground side.

Therefore, a dielectric material 9 is provided between the upper conductive surface 11 and the other lower conductive surface 14 forming each electrode, and these form an inductor.

15 is a substrate, 16A and 16B are connection patterns on the circuit forming side, and 17 is a connection pattern on the ground side. Each connection pattern 16A, 16B, and 17 forms each electrode when the dielectric resonator 8 is mounted on the substrate 15. Conductive surface 13A, 1
3B and 14 are installed at corresponding positions.

For mounting, a dispenser supplies an appropriate amount of conductive adhesive material such as glue ream solder to the upper surface of each connection pattern 16A, 16B, 17, and a chip mounter applies the dielectric resonator 8 to each connection pattern 16A, 16B, 17. Align and mount it, and solder it using cream solder. The circuit in the mounted state shown in FIG. 1 constitutes a high frequency module.

In addition, in FIGS. 1 and 3, the electrode on the circuit forming side is connected to one of the lower conductive surfaces 13A, 13B and the connection pattern 16A.
, 16B, each of which has two connection portions, may be formed with only one of the connection portions depending on the circuit configuration.

[Effects of the Invention] As explained above, according to the present invention, each conductive surface for connection is formed on the lower surface of the dielectric, and one of the conductive surfaces is formed in a conductive state with the upper conductive surface. Both portions form a chip-type inductor disposed at the connection corresponding position at the bottom. Since each conductive surface on the bottom surface and the opposing connection pattern are connected using a conductive adhesive material, the mounting process can be easily automated, and the electrodes and the connection pattern are directly connected. By implementing this, a high frequency module with high selectivity Q can be obtained.

[Brief explanation of the drawing]

FIG. 1 is a mounting state diagram of a chip-type inductor showing an embodiment of the present invention, FIG. 2 is a mounting state diagram of a conventional chip-type inductor, and FIG. 3 is a perspective view of the dielectric resonator of FIG. 1. . 9... Dielectric, 11... Upper conductive surface, 12A, 1
2B...Conductive surface on the side surface, 13A, 13B...One conductive surface on the bottom surface, 14...The other conductive surface on the bottom surface, 15.
... Board, 16A, 16B... Connection pattern on the circuit formation side, 17... Connection pattern on the ground side. Patent Applicant Oki Electric Industry Co., Ltd. Agent Patent Attorney Yoshi 1) Takashi Sei

Claims (3)

[Claims] (1) In a chip-type inductor in which conductive surfaces are formed on both sides of a plate-shaped dielectric material, the conductive surface on the lower surface is divided and formed, and one of the conductive surfaces is formed in a conductive state with the conductive surface on the upper surface, and the said division A chip-type inductor characterized in that one conductive surface and the other conductive surface constitute both electrodes of the inductor. (2) One conductive surface is divided into two parts, and each conductive surface is formed on both sides of the dielectric body to be electrically connected to the upper conductive surface, and the other conductive surface is placed at a midpoint between the two conductive surfaces. The chip-type inductor according to claim 1, characterized in that the chip-type inductor is formed. (3) In a method of mounting a chip-type inductor in which conductive surfaces are formed on both sides of a plate-shaped dielectric material on a substrate, the conductive surface on the lower surface is divided and one of the conductive surfaces is formed in a conductive state with the conductive surface on the upper surface. , a chip type characterized in that a connection pattern is provided at a mounting position corresponding to each of the divided conductive surfaces on the substrate, and each of the divided conductive surfaces and each connection pattern are respectively connected using a conductive adhesive material. How to implement an inductor.