JPH01307741A - Photosensitive lithographic printing plate - Google Patents
Photosensitive lithographic printing plateInfo
- Publication number
- JPH01307741A JPH01307741A JP13897288A JP13897288A JPH01307741A JP H01307741 A JPH01307741 A JP H01307741A JP 13897288 A JP13897288 A JP 13897288A JP 13897288 A JP13897288 A JP 13897288A JP H01307741 A JPH01307741 A JP H01307741A
- Authority
- JP
- Japan
- Prior art keywords
- acid
- photosensitive
- printing plate
- photosensitive layer
- lithographic printing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
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- 239000011347 resin Substances 0.000 claims description 30
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- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 description 1
- ZEYHEAKUIGZSGI-UHFFFAOYSA-N 4-methoxybenzoic acid Chemical compound COC1=CC=C(C(O)=O)C=C1 ZEYHEAKUIGZSGI-UHFFFAOYSA-N 0.000 description 1
- XZIIFPSPUDAGJM-UHFFFAOYSA-N 6-chloro-2-n,2-n-diethylpyrimidine-2,4-diamine Chemical compound CCN(CC)C1=NC(N)=CC(Cl)=N1 XZIIFPSPUDAGJM-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- CIWBSHSKHKDKBQ-JLAZNSOCSA-N Ascorbic acid Natural products OC[C@H](O)[C@H]1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-JLAZNSOCSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 description 1
- RBNPOMFGQQGHHO-UWTATZPHSA-N D-glyceric acid Chemical compound OC[C@@H](O)C(O)=O RBNPOMFGQQGHHO-UWTATZPHSA-N 0.000 description 1
- 206010012442 Dermatitis contact Diseases 0.000 description 1
- FPVVYTCTZKCSOJ-UHFFFAOYSA-N Ethylene glycol distearate Chemical compound CCCCCCCCCCCCCCCCCC(=O)OCCOC(=O)CCCCCCCCCCCCCCCCC FPVVYTCTZKCSOJ-UHFFFAOYSA-N 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical class C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- 241000720950 Gluta Species 0.000 description 1
- 241001446276 Helia <angisperm> Species 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- FEWJPZIEWOKRBE-XIXRPRMCSA-N Mesotartaric acid Chemical compound OC(=O)[C@@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-XIXRPRMCSA-N 0.000 description 1
- GYCMBHHDWRMZGG-UHFFFAOYSA-N Methylacrylonitrile Chemical compound CC(=C)C#N GYCMBHHDWRMZGG-UHFFFAOYSA-N 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical group CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- IWYDHOAUDWTVEP-UHFFFAOYSA-N R-2-phenyl-2-hydroxyacetic acid Natural products OC(=O)C(O)C1=CC=CC=C1 IWYDHOAUDWTVEP-UHFFFAOYSA-N 0.000 description 1
- IYFATESGLOUGBX-YVNJGZBMSA-N Sorbitan monopalmitate Chemical compound CCCCCCCCCCCCCCCC(=O)OC[C@@H](O)[C@H]1OC[C@H](O)[C@H]1O IYFATESGLOUGBX-YVNJGZBMSA-N 0.000 description 1
- 239000004147 Sorbitan trioleate Substances 0.000 description 1
- PRXRUNOAOLTIEF-ADSICKODSA-N Sorbitan trioleate Chemical compound CCCCCCCC\C=C/CCCCCCCC(=O)OC[C@@H](OC(=O)CCCCCCC\C=C/CCCCCCCC)[C@H]1OC[C@H](O)[C@H]1OC(=O)CCCCCCC\C=C/CCCCCCCC PRXRUNOAOLTIEF-ADSICKODSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 description 1
- UWHCKJMYHZGTIT-UHFFFAOYSA-N Tetraethylene glycol, Natural products OCCOCCOCCOCCO UWHCKJMYHZGTIT-UHFFFAOYSA-N 0.000 description 1
- GPVDHNVGGIAOQT-UHFFFAOYSA-N Veratric acid Natural products COC1=CC=C(C(O)=O)C(OC)=C1 GPVDHNVGGIAOQT-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical class C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 238000007754 air knife coating Methods 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 description 1
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 1
- 229940051881 anilide analgesics and antipyretics Drugs 0.000 description 1
- 150000003931 anilides Chemical class 0.000 description 1
- 238000007743 anodising Methods 0.000 description 1
- 125000003710 aryl alkyl group Chemical group 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 229960005070 ascorbic acid Drugs 0.000 description 1
- 235000010323 ascorbic acid Nutrition 0.000 description 1
- 239000011668 ascorbic acid Substances 0.000 description 1
- ZLSMCQSGRWNEGX-UHFFFAOYSA-N bis(4-aminophenyl)methanone Chemical compound C1=CC(N)=CC=C1C(=O)C1=CC=C(N)C=C1 ZLSMCQSGRWNEGX-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000003776 cleavage reaction Methods 0.000 description 1
- 238000007766 curtain coating Methods 0.000 description 1
- CCQPAEQGAVNNIA-UHFFFAOYSA-N cyclobutane-1,1-dicarboxylic acid Chemical compound OC(=O)C1(C(O)=O)CCC1 CCQPAEQGAVNNIA-UHFFFAOYSA-N 0.000 description 1
- ILUAAIDVFMVTAU-UHFFFAOYSA-N cyclohex-4-ene-1,2-dicarboxylic acid Chemical compound OC(=O)C1CC=CCC1C(O)=O ILUAAIDVFMVTAU-UHFFFAOYSA-N 0.000 description 1
- QYQADNCHXSEGJT-UHFFFAOYSA-N cyclohexane-1,1-dicarboxylate;hydron Chemical compound OC(=O)C1(C(O)=O)CCCCC1 QYQADNCHXSEGJT-UHFFFAOYSA-N 0.000 description 1
- XBZSBBLNHFMTEB-UHFFFAOYSA-N cyclohexane-1,3-dicarboxylic acid Chemical compound OC(=O)C1CCCC(C(O)=O)C1 XBZSBBLNHFMTEB-UHFFFAOYSA-N 0.000 description 1
- GCFAUZGWPDYAJN-UHFFFAOYSA-N cyclohexyl 3-phenylprop-2-enoate Chemical compound C=1C=CC=CC=1C=CC(=O)OC1CCCCC1 GCFAUZGWPDYAJN-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- OREAFAJWWJHCOT-UHFFFAOYSA-N dimethylmalonic acid Chemical compound OC(=O)C(C)(C)C(O)=O OREAFAJWWJHCOT-UHFFFAOYSA-N 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 238000000866 electrolytic etching Methods 0.000 description 1
- 125000002587 enol group Chemical group 0.000 description 1
- MEGHWIAOTJPCHQ-UHFFFAOYSA-N ethenyl butanoate Chemical compound CCCC(=O)OC=C MEGHWIAOTJPCHQ-UHFFFAOYSA-N 0.000 description 1
- UIWXSTHGICQLQT-UHFFFAOYSA-N ethenyl propanoate Chemical compound CCC(=O)OC=C UIWXSTHGICQLQT-UHFFFAOYSA-N 0.000 description 1
- OUGJKAQEYOUGKG-UHFFFAOYSA-N ethyl 2-methylidenebutanoate Chemical compound CCOC(=O)C(=C)CC OUGJKAQEYOUGKG-UHFFFAOYSA-N 0.000 description 1
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 125000002485 formyl group Chemical group [H]C(*)=O 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229940100608 glycol distearate Drugs 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 229960004337 hydroquinone Drugs 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- TYQCGQRIZGCHNB-JLAZNSOCSA-N l-ascorbic acid Chemical compound OC[C@H](O)[C@H]1OC(O)=C(O)C1=O TYQCGQRIZGCHNB-JLAZNSOCSA-N 0.000 description 1
- PBOSTUDLECTMNL-UHFFFAOYSA-N lauryl acrylate Chemical compound CCCCCCCCCCCCOC(=O)C=C PBOSTUDLECTMNL-UHFFFAOYSA-N 0.000 description 1
- 229910052912 lithium silicate Inorganic materials 0.000 description 1
- HQRPHMAXFVUBJX-UHFFFAOYSA-M lithium;hydrogen carbonate Chemical compound [Li+].OC([O-])=O HQRPHMAXFVUBJX-UHFFFAOYSA-M 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 239000001630 malic acid Substances 0.000 description 1
- 235000011090 malic acid Nutrition 0.000 description 1
- 229960002510 mandelic acid Drugs 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- GXHFUVWIGNLZSC-UHFFFAOYSA-N meldrum's acid Chemical compound CC1(C)OC(=O)CC(=O)O1 GXHFUVWIGNLZSC-UHFFFAOYSA-N 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- AWJZTPWDQYFQPQ-UHFFFAOYSA-N methyl 2-chloroprop-2-enoate Chemical compound COC(=O)C(Cl)=C AWJZTPWDQYFQPQ-UHFFFAOYSA-N 0.000 description 1
- XJRBAMWJDBPFIM-UHFFFAOYSA-N methyl vinyl ether Chemical compound COC=C XJRBAMWJDBPFIM-UHFFFAOYSA-N 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- ZIYVHBGGAOATLY-UHFFFAOYSA-N methylmalonic acid Chemical compound OC(=O)C(C)C(O)=O ZIYVHBGGAOATLY-UHFFFAOYSA-N 0.000 description 1
- PJASPDPXLKIZHB-UHFFFAOYSA-N n-(3-nitrophenyl)prop-2-enamide Chemical compound [O-][N+](=O)C1=CC=CC(NC(=O)C=C)=C1 PJASPDPXLKIZHB-UHFFFAOYSA-N 0.000 description 1
- JEPAGMKWFWQECH-UHFFFAOYSA-N n-(4-chlorophenyl)prop-2-enamide Chemical compound ClC1=CC=C(NC(=O)C=C)C=C1 JEPAGMKWFWQECH-UHFFFAOYSA-N 0.000 description 1
- BPCNEKWROYSOLT-UHFFFAOYSA-N n-phenylprop-2-enamide Chemical compound C=CC(=O)NC1=CC=CC=C1 BPCNEKWROYSOLT-UHFFFAOYSA-N 0.000 description 1
- KKFHAJHLJHVUDM-UHFFFAOYSA-N n-vinylcarbazole Chemical compound C1=CC=C2N(C=C)C3=CC=CC=C3C2=C1 KKFHAJHLJHVUDM-UHFFFAOYSA-N 0.000 description 1
- 125000004957 naphthylene group Chemical group 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- ZPIRTVJRHUMMOI-UHFFFAOYSA-N octoxybenzene Chemical compound CCCCCCCCOC1=CC=CC=C1 ZPIRTVJRHUMMOI-UHFFFAOYSA-N 0.000 description 1
- 229920002114 octoxynol-9 Polymers 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- HWGNBUXHKFFFIH-UHFFFAOYSA-I pentasodium;[oxido(phosphonatooxy)phosphoryl] phosphate Chemical compound [Na+].[Na+].[Na+].[Na+].[Na+].[O-]P([O-])(=O)OP([O-])(=O)OP([O-])([O-])=O HWGNBUXHKFFFIH-UHFFFAOYSA-I 0.000 description 1
- WRAQQYDMVSCOTE-UHFFFAOYSA-N phenyl prop-2-enoate Chemical compound C=CC(=O)OC1=CC=CC=C1 WRAQQYDMVSCOTE-UHFFFAOYSA-N 0.000 description 1
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 description 1
- QCDYQQDYXPDABM-UHFFFAOYSA-N phloroglucinol Chemical compound OC1=CC(O)=CC(O)=C1 QCDYQQDYXPDABM-UHFFFAOYSA-N 0.000 description 1
- 229960001553 phloroglucinol Drugs 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920000259 polyoxyethylene lauryl ether Polymers 0.000 description 1
- 239000001816 polyoxyethylene sorbitan tristearate Substances 0.000 description 1
- 235000010988 polyoxyethylene sorbitan tristearate Nutrition 0.000 description 1
- 229920002503 polyoxyethylene-polyoxypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229910000027 potassium carbonate Inorganic materials 0.000 description 1
- 229910052913 potassium silicate Inorganic materials 0.000 description 1
- 235000019353 potassium silicate Nutrition 0.000 description 1
- 229960001755 resorcinol Drugs 0.000 description 1
- 230000007017 scission Effects 0.000 description 1
- FQENQNTWSFEDLI-UHFFFAOYSA-J sodium diphosphate Chemical compound [Na+].[Na+].[Na+].[Na+].[O-]P([O-])(=O)OP([O-])([O-])=O FQENQNTWSFEDLI-UHFFFAOYSA-J 0.000 description 1
- 235000019832 sodium triphosphate Nutrition 0.000 description 1
- 229940035044 sorbitan monolaurate Drugs 0.000 description 1
- 239000001570 sorbitan monopalmitate Substances 0.000 description 1
- 235000011071 sorbitan monopalmitate Nutrition 0.000 description 1
- 229940031953 sorbitan monopalmitate Drugs 0.000 description 1
- 235000019337 sorbitan trioleate Nutrition 0.000 description 1
- 229960000391 sorbitan trioleate Drugs 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 150000003440 styrenes Chemical class 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 229940124530 sulfonamide Drugs 0.000 description 1
- 150000003459 sulfonic acid esters Chemical class 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 239000011975 tartaric acid Substances 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- KOZCZZVUFDCZGG-UHFFFAOYSA-N vinyl benzoate Chemical compound C=COC(=O)C1=CC=CC=C1 KOZCZZVUFDCZGG-UHFFFAOYSA-N 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- 150000003739 xylenols Chemical class 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/0226—Quinonediazides characterised by the non-macromolecular additives
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
[産業上の利用分野]
本発明はO−キノンジアジドを含むポジ型感光性平版印
刷版に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a positive-working photosensitive lithographic printing plate containing O-quinonediazide.
し発明の背景]
ポジ型感光性平版印刷版の感光1には、一般に感光成分
として0−キノンジアジド化合物、及び皮膜強度とアル
カリ溶解性とを高めるための成分としてアルカリ可溶性
樹脂が含有されている。Background of the Invention] Photosensitive 1 of a positive-working photosensitive lithographic printing plate generally contains an 0-quinonediazide compound as a photosensitive component and an alkali-soluble resin as a component for increasing film strength and alkali solubility.
従来このようなポジ型感光性平版印刷版の感光層にスカ
ミングの発生防止等を目的として有機酸を含有させるこ
とは知られている。しかしながらこのような有FM酸を
含有した感光性平版印刷版においては、感度、網点再現
性、特に小点再現性、セーフライ1〜性及びボールペン
適性等が劣化する傾向があり、特に網点再現性について
は、この再現性の変動が階調の変化として現われるため
重大な問題となり、特に小点再現性が劣る場合、得られ
る印刷物におけるハイライト部の再現性に大きな問題を
生じていた。上記小点再現性を改良するため、露光時に
おいて露光分を減少させる等の方法が行なわれるが、こ
のような方法では小点再現性はある程度改良されるもの
の、逆に中点及び欠点の再現性が劣化するという欠点を
生じていた。It has been known to contain an organic acid in the photosensitive layer of such a positive-working photosensitive lithographic printing plate for the purpose of preventing scumming. However, in photosensitive lithographic printing plates containing such FM acids, there is a tendency for sensitivity, halftone reproducibility, especially small dot reproducibility, safe fly 1~ness, ballpoint pen suitability, etc. to deteriorate, and in particular, halftone dot reproducibility tends to deteriorate. As for the reproducibility, this variation in reproducibility is manifested as a change in gradation, which is a serious problem, and especially when the dot reproducibility is poor, this causes a big problem in the reproducibility of highlight areas in the resulting printed matter. In order to improve the reproducibility of small dots mentioned above, methods such as reducing the exposure amount during exposure are carried out, but although such methods improve the reproducibility of small dots to some extent, they conversely reduce the reproduction of midpoints and defects. This had the disadvantage of deteriorating properties.
このため、感度を減少させることなく小点再現性に優れ
、かつセーフライト性及びボールペン適性に優れた、上
記有機酸含有感光性平版印刷版が望まれていた。For this reason, there has been a desire for the organic acid-containing photosensitive lithographic printing plate described above, which has excellent dot reproducibility without decreasing sensitivity, as well as excellent safelight properties and ballpoint pen suitability.
ここで「セーフライト性」とは感光性平版印刷版の製版
作業を白色蛍光灯下で行なう場合の光カブリに対する抵
抗性をいい、「ボールペン通性」とは感光性平版印刷版
にいわゆる多面焼付は等を行う際にフィルム原稿の位置
合わせのためのマーク等に用いるボールペンのインキに
対する耐性を示す。Here, "safelight property" refers to the resistance to light fog when the photosensitive planographic printing plate is made under white fluorescent light, and "ballpoint pen resistance" refers to the resistance to so-called multi-sided printing on the photosensitive planographic printing plate. This shows the resistance to ink of a ballpoint pen used for marks, etc. for positioning film originals when performing such operations.
[発明の目的]
本発明の目的は、感度を低下させることなく網点、特に
小点の再現性が改良された感光性平版印刷版を提供する
ことにある。[Object of the Invention] An object of the present invention is to provide a photosensitive lithographic printing plate in which the reproducibility of halftone dots, particularly small dots, is improved without reducing sensitivity.
また、本発明の目的は、セーフライト性及びボールペン
適性に優れた感光性平版印刷版を提供することにある。Another object of the present invention is to provide a photosensitive lithographic printing plate that has excellent safelight properties and ballpoint pen suitability.
[発明の構成コ
上記本発明の目的は、支持体上に0−キノンジアジド化
合物、アルカリ可溶性樹脂及び有機酸を含有する感光層
を有する感光性平版印刷版において、前記感光層中にお
ける前記有機酸の含有mが少なくとも前記支持体に近い
側の感光層表面近傍領域において、前記支持体から遠い
側の感光層表面近傍領域より多いことを特徴とする感光
性平版印刷版によって達成された。[Structure of the Invention] The object of the present invention is to provide a photosensitive lithographic printing plate having a photosensitive layer containing an 0-quinonediazide compound, an alkali-soluble resin, and an organic acid on a support; This was achieved by a photosensitive lithographic printing plate characterized in that the content m is greater at least in a region near the surface of the photosensitive layer on the side closer to the support than in a region near the surface of the photosensitive layer on the side farther from the support.
[発明の具体的構成]
本発明においては、感光層中における右握酸の含有量が
支持体に近い側の感光層表面近傍領域において、支持体
から遠い側の感光層表面近傍領域より多ければいかなる
含有率分布を示してもよいが、特に支持体に近い側の感
光層表面から全感光層の厚さの50%の距離までの範囲
内の領域における有機酸の含有量が支持体から遠い[1
11]の感光層表面から全感光層の厚さの50%の距離
までの範囲内の領域における含有量より多いことが好ま
しい。[Specific Structure of the Invention] In the present invention, if the content of dextral acid in the photosensitive layer is higher in the area near the surface of the photosensitive layer on the side closer to the support than in the area near the surface of the photosensitive layer on the side farther from the support. Any content distribution may be shown, but in particular, the organic acid content in a region within a distance of 50% of the total photosensitive layer thickness from the photosensitive layer surface on the side closer to the support is far from the support. [1
11] is preferably higher than the content in the region within the range from the surface of the photosensitive layer to a distance of 50% of the total thickness of the photosensitive layer.
更に、上記有機酸の含有量としては感光層表面からその
厚さの50%の距離を境として、支持体から遠い側に該
感光層に含まれる全有機酸の40重量%以下、支持体に
近い側に60ffi1%以上含まれることが好ましく、
更に支持体から遠い側に該感光層に含まれる全有機酸の
30ffiffi%以下、支持体に近い側に70重鍮%
以上含まれることが好ましい。Further, the content of the organic acid is 40% by weight or less of the total organic acid contained in the photosensitive layer on the side far from the support at a distance of 50% of the thickness from the surface of the photosensitive layer, and 40% by weight or less of the total organic acid contained in the photosensitive layer. It is preferable that the near side contains 60ffi1% or more,
Further, on the side far from the support, 30% or less of the total organic acids contained in the photosensitive layer, and on the side close to the support, 70% of the total organic acids contained in the photosensitive layer.
It is preferable that the above is included.
具体的には、感光層中において有機酸含有率が支持体に
近い感光層表面から支持体から遠い感光層表面方向へ向
かって連続的に減少しているもの、不連続的に減少して
いるもの、少なくとも1部に含有率が変化しない、すな
わち答含有率部分を有するものが好ましく、更には本発
明の範囲内において、1部支持体に近い側より支持体か
ら遠い側の方が有!!1酸含有率が高くなる部分を有す
るものも含む。また上記の種々のパターンを組合わせた
ものも含む。更に上記支持体に近い感光層表面から支持
体から遠い感光層表面方向への有機酸含有率の変化は直
線的に一定変化率で変化してもよいし、曲線的に変化率
を増大又は減少させながら変化してもよい。Specifically, in the photosensitive layer, the organic acid content decreases continuously from the surface of the photosensitive layer near the support toward the surface of the photosensitive layer far from the support, and it decreases discontinuously. It is preferable that at least one part of the material has an unchanged content, that is, a negative content part, and furthermore, within the scope of the present invention, it is preferable that at least one part of the content is present on the side farther from the support than on the side closer to the support. ! It also includes those having a portion with a high monoacid content. It also includes combinations of the above various patterns. Furthermore, the organic acid content may change linearly at a constant rate of change from the surface of the photosensitive layer near the support to the surface of the photosensitive layer far from the support, or the rate of change may be increased or decreased in a curved manner. It may be changed while changing.
好ましくは第1図の(a )〜(h)に示すような有機
酸含有率パターンを有する感光層を有する感光性平版印
刷版が望ましい。Preferably, a photosensitive lithographic printing plate having a photosensitive layer having an organic acid content pattern as shown in (a) to (h) of FIG. 1 is desirable.
また、このような有機酸の分布を有する感光性平版印刷
版は同一組成で有I!酸の濃度のみが異なる複数の塗布
液を順次塗布することによって作製しうる。2
本発明に用いる有機酸としては公知の種々の有機酸がす
べて用いられるがpKa値が2以上である有Illが好
ましく、更に好ましくはpKaliiIが3.0〜9.
0であり、特に好ましくは3.5〜8.0の有機酸であ
る。但し、本発明で使用されるpKa値は25℃におけ
る値である。Furthermore, photosensitive lithographic printing plates having such an organic acid distribution have the same composition. It can be produced by sequentially applying a plurality of coating liquids that differ only in acid concentration. 2 As the organic acid used in the present invention, all known various organic acids can be used, but those having a pKa value of 2 or more are preferable, and more preferably those having a pKa value of 3.0 to 9.
0, particularly preferably 3.5 to 8.0. However, the pKa value used in the present invention is a value at 25°C.
このような有機酸としては、例えば1ヒ学便覧基礎編■
(丸善1111966年、第1054〜1058頁に記
載されている有機酸で、本発明のpKa[を示し得る化
合物を挙げることができる。このような化合物としては
、例えば安息香酸、アジピン酸、アゼライン酸、イソフ
タル酸、p−トルイル酸、Q−1−ルイル酸、β−エチ
ルグルタル酸、m−オキシ安息香酸、p−オキシ安息香
酸、3.5−ジメチル安息香酸1.3,4−ジメトキシ
安息香酸、グリセリン酸、グルタ、コン酸、グルタル酸
、p−アニス酸、コハク酸、セバシン酸、β、β−ジエ
チルグルタル酸、1,1−シクロブタンジカルボン酸、
1.3−シクロブタンジカルボン酸、1.1−シクロペ
ンタンジカルボン酸、1.2−シクロペンタンジカルボ
ン酸、1−13−シクロペンタンジカルボン酸、β、β
−ジメチルグルタル酸、ジメチルマロン酸、α−酒石酸
、スペリン酸、テレフタル酸、ピメリン酸、フタル酸、
フマル酸、β−プロピルグルタル酸、プロピルマロン酸
、マンデル酸、メソ酒石酸、β−メチルグルタル酸、β
、β−メチルプロピルグルタル酸、メチルマロン酸、リ
ンゴ酸、1,1−シクロヘキサンジカルボン酸、1.2
−シクロヘキサンジカルボン酸、1.3−シクロヘキサ
ンジカルボン酸、1,4−シクロヘキサンジカルボン酸
、シス−4−シクロヘキセン1.2−ジカルボン酸等を
挙げることができる。Examples of such organic acids include, for example, 1.
Examples of such compounds include benzoic acid, adipic acid, and azelaic acid. , isophthalic acid, p-toluic acid, Q-1-ruic acid, β-ethylglutaric acid, m-oxybenzoic acid, p-oxybenzoic acid, 3,5-dimethylbenzoic acid, 1,3,4-dimethoxybenzoic acid , glyceric acid, gluta, conic acid, glutaric acid, p-anisic acid, succinic acid, sebacic acid, β, β-diethylglutaric acid, 1,1-cyclobutanedicarboxylic acid,
1.3-cyclobutanedicarboxylic acid, 1.1-cyclopentanedicarboxylic acid, 1.2-cyclopentanedicarboxylic acid, 1-13-cyclopentanedicarboxylic acid, β, β
-dimethylglutaric acid, dimethylmalonic acid, α-tartaric acid, speric acid, terephthalic acid, pimelic acid, phthalic acid,
Fumaric acid, β-propylglutaric acid, propylmalonic acid, mandelic acid, mesotartaric acid, β-methylglutaric acid, β
, β-methylpropylglutaric acid, methylmalonic acid, malic acid, 1,1-cyclohexanedicarboxylic acid, 1.2
-cyclohexanedicarboxylic acid, 1,3-cyclohexanedicarboxylic acid, 1,4-cyclohexanedicarboxylic acid, cis-4-cyclohexene 1,2-dicarboxylic acid, and the like.
その他メルドラム酸やアスコルビン酸などのエノール構
造を有する有機酸も好ましく用いることができる。上記
有様酸の感光層中に占める割合は0.05〜10重量%
が適当であり、好ましくは0.1〜5重量26である。Other organic acids having an enol structure such as Meldrum's acid and ascorbic acid can also be preferably used. The proportion of the above-mentioned specific acid in the photosensitive layer is 0.05 to 10% by weight.
is suitable, preferably 0.1 to 5 weight26.
本発明におけるO−キノンジアジド化合物としては例え
ばO−ナフトキノンジアジドスルホン酸と、フェノール
類及びアルデヒド又はケトンの重縮合樹脂とのエステル
化合物が挙げられる。Examples of the O-quinonediazide compound in the present invention include ester compounds of O-naphthoquinonediazide sulfonic acid and polycondensation resins of phenols and aldehydes or ketones.
前記フェノール類としては、例えば、フェノール、0−
クレゾール、m−クレゾール、p−クレゾール、3,5
−キシレノール、カルバクロール、チモール等の一価フ
エノール、カテコール、レゾルシン、ヒドロキノン等の
二価フェノール、ピロガロール、70ログルシン等の三
価フェノール等が挙げられる。前記アルデヒドとしては
ホルムアルデヒド、ベンズアルデヒド、アセ1−アルデ
ヒド、クロトンアルデ仁ド、フルフラール等が挙げられ
る。これらのうち好ましいものはホルムアルデヒド及び
ベンズアルデヒドである。まIζ、前記ケト・ンとして
はアセトン、メヂルエチルケトン等が挙げられる。Examples of the phenols include phenol, 0-
Cresol, m-cresol, p-cresol, 3,5
- Monohydric phenols such as xylenol, carvacrol, and thymol, dihydric phenols such as catechol, resorcinol, and hydroquinone, and trihydric phenols such as pyrogallol and 70 loglucin. Examples of the aldehyde include formaldehyde, benzaldehyde, ace1-aldehyde, crotonaldenide, and furfural. Preferred among these are formaldehyde and benzaldehyde. Also, examples of the ketone include acetone, methyl ethyl ketone, and the like.
前記重縮合樹脂の具体的な例どしては、フェノール・ホ
ルムアルデヒド樹脂、m−クレゾール・ホルムアルデヒ
ド樹脂、m−、p−混合クレゾール・ホルムアルデヒド
樹脂、レゾルシン・ベンズアルデヒド樹脂、ピロガロー
ル・アセトン樹脂等が挙げられる。Specific examples of the polycondensation resin include phenol/formaldehyde resin, m-cresol/formaldehyde resin, m-, p-mixed cresol/formaldehyde resin, resorcinol/benzaldehyde resin, pyrogallol/acetone resin, etc. .
前記O−ナフトキノンジアジド化合物のフェノール類の
OH基に対するO−ナフトキノンジアジドスルホン酸の
綜合率(OH基1個に対する反応率)は、15〜80%
が好ましく、より好ましくは20〜45%である。The overall conversion rate of O-naphthoquinonediazide sulfonic acid to the OH group of the phenol in the O-naphthoquinonediazide compound (reaction rate to one OH group) is 15 to 80%.
is preferable, and more preferably 20 to 45%.
更に本発明に用いられるオルトキノンジアジド化合物と
しては特開昭58−43451号公報明細書に記載のあ
る以下の化合物も使用できる。すなわち例えば1,2−
ベンゾキノンジアジドスルホン酸エステル、1.2−ナ
フトキノンジアジドスルホン酸エステル、1.2−ベン
ゾキノンジアジドスルホン酸アミド、1.2−ナフトキ
ノンジアジドスルホン酸アミドなどの公知の1.2−キ
ノンジアジド化合物、さらに具体的にはジエイ・コサー
ル(J、 Kosar)著「ライ!−・センシティブ
システムJ (” l ight−3ensitive
3ystems”)第339〜352頁(1965
年)、ジョン・ウィリー アンド サンズ(John
Wiley & 5ons )社にューヨーク)や
ダブリュー・ニス・デイ−・フォレスト(W、 S、
D、 Forest )著「フォトレジストJ (”
Photoresisじ′)第50巻。Furthermore, as the orthoquinone diazide compound used in the present invention, the following compounds described in JP-A-58-43451 can also be used. For example, 1,2-
Known 1.2-quinonediazide compounds such as benzoquinonediazide sulfonic acid ester, 1.2-naphthoquinonediazide sulfonic acid ester, 1.2-benzoquinonediazide sulfonic acid amide, and 1.2-naphthoquinonediazide sulfonic acid amide, more specifically "Lie! - Sensitive" by J. Kosar.
System J
3systems”) pages 339-352 (1965
John Wiley and Sons
Wiley & 5ons (New York) and W varnish Day Forest (W, S,
"Photoresist J ("
Photoresis Volume 50.
(1975年)、マグロ−ヒル(Mc Graw −H
lll )社にューヨーク)に記載されている1、2
−ベンゾキノンジアジド−4−スルホン酸フェニルエス
テル、1.2.1’ 、2’、−ジー〈ベンゾキノンジ
アジド−4−スルホニル)−ジヒドロキシビフェニル、
1.2−ベンゾキノンジアジド−4−(N−エチル−へ
−β−ナフチル)−スルホンアミド、1.2−ナフトキ
ノンジアジド−5−スルホン酸シクロヘキシルエステル
、1−(1,2−ナフトキノンジアジド−5−スルホニ
ル)−3゜5−ジメチルピラゾール、1,2−ナフトキ
ノンジアジド−5−スルホン酸−4“−ヒト0キシジフ
ェニル−4″−アゾーB−ナフトールエステル、N、N
−ジー(1,2−ナフトキノンジアジド−5−スルホニ
ル)−アニリン、2’ −(1,2−ナフトキノンジア
ジド−5−スルホニルオキシ)−1−ヒドロキシ−アン
トラキノン、1.2−すブトキノンジアジド−5−スル
ホン?!−2,4−ジヒドロキシベンゾフェノンエステ
ル、1.2−ナフトキノンジアジド−5−スルホンIQ
−2,3゜4−トリヒドロキシベンゾフェノンエステル
、1゜2−ナフトキノンジアジド−5−スルホン酸クロ
リド2モルと4.4′−ジアミノベンゾフェノン1モル
の縮合物、1.2−ナフトキノンジアジド−5−スルホ
ン酸クロリド2モルと4,4′−ジヒドロキシ−1,1
′−ジフェニルスルホン1モルの縮合物、1,2−ナフ
トキノンジアジド−5−スルホン酸クロリド1モルとプ
ルブロガリン1モルの縮合物、1,2−ナフトキノンジ
アジド−5−(N−ジヒドロアごエチル)−スルホンア
ミドなどの1.2−キノンジアジド化合物を例示するこ
とができる。また特公昭37−1953号、同37−3
627号、同37−13109号、同40−26126
号、同 40−3801号、同 45−5604号、同
45−27345号、同51−13013号、特開昭4
8−96575号、同48−63802号、同48−6
3802号各公報に記載された1、2−キノンジアジド
化合物をも挙げることができる。(1975), McGraw-H
1, 2 listed in New York)
-benzoquinonediazide-4-sulfonic acid phenyl ester, 1.2.1',2', -di<benzoquinonediazide-4-sulfonyl)-dihydroxybiphenyl,
1.2-Benzoquinonediazide-4-(N-ethyl-he-β-naphthyl)-sulfonamide, 1.2-naphthoquinonediazide-5-sulfonic acid cyclohexyl ester, 1-(1,2-naphthoquinonediazide-5- sulfonyl)-3゜5-dimethylpyrazole, 1,2-naphthoquinonediazide-5-sulfonic acid-4"-human 0oxydiphenyl-4"-azo B-naphthol ester, N,N
-di(1,2-naphthoquinonediazide-5-sulfonyl)-aniline, 2'-(1,2-naphthoquinonediazide-5-sulfonyloxy)-1-hydroxy-anthraquinone, 1,2-butoquinonediazide-5- Sulfone? ! -2,4-dihydroxybenzophenone ester, 1,2-naphthoquinonediazide-5-sulfone IQ
-2,3゜4-trihydroxybenzophenone ester, 1゜Condensate of 2 moles of 2-naphthoquinonediazide-5-sulfonic acid chloride and 1 mole of 4,4'-diaminobenzophenone, 1,2-naphthoquinonediazide-5-sulfone 2 moles of acid chloride and 4,4'-dihydroxy-1,1
'-Diphenylsulfone 1 mol condensate, 1,2-naphthoquinonediazide-5-sulfonic acid chloride 1 mol condensate and purbrogalin 1 mol, 1,2-naphthoquinonediazide-5-(N-dihydroagoethyl)-sulfone Examples include 1,2-quinonediazide compounds such as amides. Also, Special Publication No. 37-1953, No. 37-3
No. 627, No. 37-13109, No. 40-26126
No. 40-3801, No. 45-5604, No. 45-27345, No. 51-13013, JP-A-4
No. 8-96575, No. 48-63802, No. 48-6
1,2-quinonediazide compounds described in Patent No. 3802 can also be mentioned.
本発明の0−キノンジアジド化合物としては上記化合物
を各々単独で用いてもよいし、2種以上組合わせて用い
てもよい。本発明に用いられる0−キノンジアジド化合
物の感光性層中に占める割合は、5〜60fliλ%が
好ましく、特に好ましくは、10〜50重徂%である。As the 0-quinonediazide compound of the present invention, each of the above compounds may be used alone, or two or more thereof may be used in combination. The proportion of the O-quinonediazide compound used in the present invention in the photosensitive layer is preferably 5 to 60% by weight, particularly preferably 10 to 50% by weight.
本発明におけるアルカリ可溶性樹脂どしては、当分野に
おいて公知の種々の樹脂が用いられるが、特にノボラッ
ク樹脂及びフェノール性水IIを有する構造単位を分子
構造中に有するビニル系重合体が好ましい。As the alkali-soluble resin in the present invention, various resins known in the art can be used, but a vinyl polymer having a novolac resin and a structural unit having phenolic water II in its molecular structure is particularly preferred.
本発明に好ましく用いられるノボラック樹脂としては、
フェノール類とホルムアルデヒドをM FO媒の存在下
で縮合して得られる樹脂が挙げられ、該フェノール類と
しては、例えばフェノール、0−クレゾール、m−クレ
ゾール、p−クレゾール、3.5−キシレノール、2.
4−キシレノール、2,5−キシレノール、カルバクロ
ール、チモール、カテコール、レゾルシン、ヒドロキノ
ン、ピロガロール、フロログルシン等が挙げられる。Novolac resins preferably used in the present invention include:
Examples include resins obtained by condensing phenols and formaldehyde in the presence of an MFO medium; examples of the phenols include phenol, 0-cresol, m-cresol, p-cresol, 3.5-xylenol, 2 ..
Examples include 4-xylenol, 2,5-xylenol, carvacrol, thymol, catechol, resorcinol, hydroquinone, pyrogallol, phloroglucin, and the like.
上記フェノール類化合物は単独で又は2種以上組み合わ
せてホルムアルデヒドと縮合し樹脂を得ることができる
。これらのうち好ましいノボラック樹脂は、フェノール
、m−クレゾール(又は。−クレゾール)及びp−クレ
ゾールから選ばれる少なくとも1種とホルムアルデヒド
とを共重縮合して得られる樹脂である。例えば、フェノ
ール・ホルムアルデヒド樹脂、l−クレゾール・ホルム
アルデヒド樹脂、0−クレゾール・ホルムアルデヒド樹
脂、フェノール・p−クレゾール・ホルムアルデヒド共
重合体樹脂、l−クレゾール・p−クレゾール・ホルム
アルデヒド共重縮合体樹脂、0−クレゾール・p−クレ
ゾール・ホルムアルデヒド共重縮合体樹脂、フェノール
・偏−クレゾール・p−クレゾール・ホルムアルデヒド
共重縮合体樹脂、フェノール・0−クレゾール・p−ク
レゾール・ホルムアルデヒド共重縮合体樹脂が挙げられ
る。更に上記のノボラック樹脂のうち、フェノール・m
−クレゾール・p−クレゾール・ホルムアルデヒド樹脂
が好ましい。The above-mentioned phenolic compounds can be used alone or in combination with formaldehyde to obtain a resin. Among these, a preferred novolak resin is a resin obtained by copolycondensing formaldehyde with at least one selected from phenol, m-cresol (or -cresol), and p-cresol. For example, phenol/formaldehyde resin, l-cresol/formaldehyde resin, 0-cresol/formaldehyde resin, phenol/p-cresol/formaldehyde copolymer resin, l-cresol/p-cresol/formaldehyde copolymer resin, 0- Examples include cresol/p-cresol/formaldehyde copolycondensate resin, phenol/partially cresol/p-cresol/formaldehyde copolycondensate resin, and phenol/0-cresol/p-cresol/formaldehyde copolycondensate resin. Furthermore, among the above novolac resins, phenol/m
-Cresol/p-cresol/formaldehyde resins are preferred.
本発明においては、上記ノボラック樹脂は単独で用いて
もよいし、また2種以上組合わせて用いでもよい。In the present invention, the above-mentioned novolac resins may be used alone or in combination of two or more.
上記ノボラック樹脂の分子賞(ポリスチレン標準)は、
重9平均分子fuMvが2.0X103〜2、OX 1
04で、数平均分子ffiMnで7.0×102〜5.
OX 1Q3の範囲内の値であることが好ましく、更に
、好ましくは、lylwが3.0×103−6.Ox
103 、Mnが7.7x 1Q 2−・j、2xlQ
3の範囲内の値である。本発明におけるノボラック樹脂
の分子蚤の測定は、前述のGPCによって行う。The molecular award for the above novolac resin (polystyrene standard) is
Heavy 9 average molecular fuMv is 2.0X103~2, OX 1
04, the number average molecule ffiMn is 7.0×102 to 5.
It is preferable that the value is within the range of OX 1Q3, and more preferably, lylw is 3.0×103-6. Ox
103, Mn is 7.7x 1Q 2-・j, 2xlQ
The value is within the range of 3. The molecular weight of the novolak resin in the present invention is measured by the above-mentioned GPC.
また、本発明に好ましく用いられるフェノール性水酸基
を有する構造単位を分子構造中に有するビニル系重合体
としては、炭素−炭素二重結合が開裂して、重合してで
きた重合体のことであり下記一般式[I]〜[VI]の
少なくとも1つの構造単位を含む重合体が好ましい。Furthermore, the vinyl polymer having a structural unit having a phenolic hydroxyl group in its molecular structure, which is preferably used in the present invention, is a polymer formed by polymerization by cleavage of a carbon-carbon double bond. Polymers containing at least one structural unit of the following general formulas [I] to [VI] are preferred.
一般式[I]
+ CR+ R2−CR3+−
0−C○−B−OH
一般式[■]
→CR1R2−CR3→−
C0NR1→1rB−OH
一般式[I[[]
%式%
一般式[rV]
−+ CR+ R2−CR3←
−0H
一般式[Vl
OH
一般式[Vl ]
OH
式中、R1およびR2はそれぞれ水素原子、アルキル基
、またはカルボキシル基を表し、好ましくは水素原子で
ある。R3は水素原子、ハロゲン原子またはアルキル基
を表し、好ましくは水素原子またはメチル基、エチル基
等のアルキル基である。R+は水素原子、アルキル基、
アリール基またはアラルキル基を表し、好ましくは水素
原子である。Aは窒素原子または酸素原子と芳香族炭素
原子とを連結する置換基を有してもよいアルキレン基を
表し、mは0〜10の整数を表し、81.を置換基を有
してもよいフェニレン基または置換基を有してもよいナ
フチレン基を表す。本発明においては、これらのうち一
般式[II]で示される構造単位を少なくとも1つ含む
共重合体が好ましい。General formula [I] + CR+ R2-CR3+- 0-C○-B-OH General formula [■] →CR1R2-CR3→- C0NR1→1rB-OH General formula [I[[] % formula% General formula [rV] -+ CR+ R2-CR3← -0H General formula [Vl OH General formula [Vl] OH In the formula, R1 and R2 each represent a hydrogen atom, an alkyl group, or a carboxyl group, preferably a hydrogen atom. R3 represents a hydrogen atom, a halogen atom, or an alkyl group, preferably a hydrogen atom or an alkyl group such as a methyl group or an ethyl group. R+ is a hydrogen atom, an alkyl group,
Represents an aryl group or an aralkyl group, preferably a hydrogen atom. A represents an alkylene group which may have a substituent connecting a nitrogen atom or an oxygen atom and an aromatic carbon atom, m represents an integer of 0 to 10, and 81. represents a phenylene group which may have a substituent or a naphthylene group which may have a substituent. In the present invention, among these, a copolymer containing at least one structural unit represented by the general formula [II] is preferred.
前記ビニル系重合体は共重合体型の構造を有しており、
このような共重合体において、前記一般式[I]〜[V
I]の各々で示される構造単位の少なくとも1種と組み
合わせて用いることができる単量体単位としては、例え
ばエチレン、プロピレン、イソブチレン、ブタジェン、
イソプレン等のエチレン系不飽和オレフィン類、例えば
スチレン、α−メチルスチレン、p−メチルスチレン、
p−クロロスチレン等のスチレン類、例えばアクリル酸
、メタクリル酸等のアクリル酸類、例えばイタコン酸、
マレイン酸、無水マレイン酸等の不飽和脂肪族ジカルボ
ン酸類、例えばアクリル酸メチル、アクリル酸エチル、
アクリルln−ブチル、アクリル酸イソブチル、アクリ
ル酸ドデシル、アクリル酸2−クロロエチル、アクリル
酸フェニル、α−クロロアクリル酸メチル、メタクリル
酸メチル、メタクリル酸エチル、エタクリル酸エチル等
のα−メチレン脂肪族モノカルボン酸のエステル類、例
えばアクリロニトリル、メタアクリロニトリル等のニト
リル類、例えばアクリルアミド等のアミド類、例えばア
クリルアニリド、p−クロロアクリルアニリド、m−ニ
トロアクリルアニリド、m−メl−キシアクリルアニリ
ド等のアニリド類、例えば酢酸ビニル、プロピオン酸ビ
ニル、ベンジェ酸ビニル、酪酸ビニル等のビニルエステ
ル類、例えばメチルビニルエーテル、エチルビニルエー
テル、イソブチルビニルエーテル、β−クロロエチルビ
ニルエーテル等のビニルエーテル類、塩化ビニル、ビニ
リデンクロライド、ビニリデンシアナイド、例えば1−
メチル−1−メトキシエチレン、1,1−ジメトキシエ
チレン、1,2−ジメトキシエチレン、1,1−ジメト
キシカルボニルエチレン、1−メチル−1−二トロエチ
レン等のエチレン誘導体類、例えばN−ビニルビロール
、N−ビニルカルバゾール、N−ビニルインドール、N
−ビニルピロリドン、N−ビニルピロリドン等のN−ビ
ニル化合物、等のビニル系単量体がある。The vinyl polymer has a copolymer type structure,
In such a copolymer, the general formulas [I] to [V
Examples of monomer units that can be used in combination with at least one of the structural units represented by each of I] include ethylene, propylene, isobutylene, butadiene,
Ethylenically unsaturated olefins such as isoprene, such as styrene, α-methylstyrene, p-methylstyrene,
Styrenes such as p-chlorostyrene, acrylic acids such as acrylic acid and methacrylic acid, itaconic acid,
Unsaturated aliphatic dicarboxylic acids such as maleic acid and maleic anhydride, such as methyl acrylate, ethyl acrylate,
α-methylene aliphatic monocarboxes such as ln-butyl acrylate, isobutyl acrylate, dodecyl acrylate, 2-chloroethyl acrylate, phenyl acrylate, methyl α-chloroacrylate, methyl methacrylate, ethyl methacrylate, ethyl ethacrylate, etc. Esters of acids, such as nitriles such as acrylonitrile and methacrylonitrile, amides such as acrylamide, and anilides such as acrylanilide, p-chloroacrylanilide, m-nitroacrylanilide, m-mel-xyacrylanilide, etc. , vinyl esters such as vinyl acetate, vinyl propionate, vinyl benzoate, vinyl butyrate, vinyl ethers such as methyl vinyl ether, ethyl vinyl ether, isobutyl vinyl ether, β-chloroethyl vinyl ether, vinyl chloride, vinylidene chloride, vinylidene cyanide, etc. , for example 1-
Ethylene derivatives such as methyl-1-methoxyethylene, 1,1-dimethoxyethylene, 1,2-dimethoxyethylene, 1,1-dimethoxycarbonylethylene, 1-methyl-1-ditroethylene, such as N-vinylpyrol, N -vinylcarbazole, N-vinylindole, N
- Vinyl monomers such as N-vinyl compounds such as vinylpyrrolidone and N-vinylpyrrolidone.
これらのビニル系単暑体は不飽和二重結合が開裂した構
造で高分子化合物中に存在する。These vinyl monomers exist in polymer compounds with a structure in which unsaturated double bonds are cleaved.
上記の単量体のうち、一般式[11〜[VI]で示され
る構造単位の少なくとも1種と組み合わせて用いるもの
として、(メタ)アクリル酸類、脂肪族モノカルボン酸
のエステル類、ニトリル類が総合的に優れた性能を示し
、好ましい。より好ましくは、メタクリル酸、メタクリ
ル酸メチル、アクリロニトリル、アクリル酸エチル等で
ある。Among the above monomers, (meth)acrylic acids, esters of aliphatic monocarboxylic acids, and nitriles are used in combination with at least one of the structural units represented by general formulas [11 to VI]. It shows excellent overall performance and is preferable. More preferred are methacrylic acid, methyl methacrylate, acrylonitrile, ethyl acrylate, and the like.
これらの単伍体は前記ビニル系重合体中にブロック又は
ランダムのいずれの状態で結合していてもよい。These monomers may be bonded in the vinyl polymer either in a block or random manner.
前記ビニル系重合体中における、一般式[11〜[VI
]のそれぞれで示される構造単位の含有率は、5〜70
モル%が好ましく、特に、10〜40モル%が好ましい
。In the vinyl polymer, general formulas [11 to [VI
] The content of the structural units shown in each is 5 to 70
It is preferably mol %, particularly preferably 10 to 40 mol %.
また、感光性層中における前記アルカリ可溶性樹脂の占
める割合は50〜95重量%であり、好ましくは60〜
90重量%である。Further, the proportion of the alkali-soluble resin in the photosensitive layer is 50 to 95% by weight, preferably 60 to 95% by weight.
It is 90% by weight.
前記の重合体は上記組合せのもの1種のみで用いてもよ
いが、2種以上併用して感光性組成物中に含んでいても
よい。The above-mentioned polymers may be used alone in the above-mentioned combination, or two or more may be used in combination in the photosensitive composition.
以下に本発明に用いられるビニル系重合体の代表的な具
体例をあげる。なお下記に例示の化合物において、Mw
は重ω平均分子】、Mnは数平均分子但、s、に、j!
、o、mおよびnは、それぞれ構造単位のモル%を表す
。Typical examples of vinyl polymers used in the present invention are listed below. In addition, in the compounds exemplified below, Mw
is a heavy ω-average molecule], Mn is a number-average molecule; however, s, j!
, o, m and n each represent mol% of the structural unit.
例示化合物
(ビ) ru
−ツム13
1) CHs
以下余白
本発明の感光性平版印刷版の感光層には更に、分子構造
中に下記構造単位[I]及び/又は[II]を有する化
合物を含有することが好ましい。Exemplary Compound (Bi) ru-Tsum 13 1) CHs The photosensitive layer of the photosensitive lithographic printing plate of the present invention further contains a compound having the following structural units [I] and/or [II] in its molecular structure. It is preferable to do so.
構造単位[I]
+CH2CH2O+−
構造単位[I]
CH3
一+CH2CH−0+−
(式中、nは2〜5000の整数を表わす、、)本発明
に用いられる構造単位[I]及び/又は[II]を有す
る化合物としては、上記構造単位[I]及び[■]の1
方又は両方を有する化合物であればいかなるものでもよ
いが、特に構造単位[I]及び[I[]のそれぞれにお
いてnが2〜5000の範囲内の整数であり、かつ沸点
が240℃以上である化合物が好ましく、更に好ましく
はnが2〜500の範囲内の整数であり、かつ沸点が2
80℃以上である化合物であり、最も好ましいものはn
が3〜100の範囲内の化合物である。Structural unit [I] +CH2CH2O+- Structural unit [I] CH3 +CH2CH-0+- (In the formula, n represents an integer of 2 to 5000, ,) Structural unit [I] and/or [II] used in the present invention As a compound having one of the above structural units [I] and [■]
Any compound may be used as long as it has one or both, but in particular, in each of the structural units [I] and [I[], n is an integer within the range of 2 to 5000, and the boiling point is 240 ° C. or higher. Compounds are preferred, and more preferably n is an integer within the range of 2 to 500 and the boiling point is 2.
A compound whose temperature is 80°C or higher, and the most preferable one is n
is a compound within the range of 3 to 100.
このような化合物としては、例えば、
・ポリエチレングリコール(HO→CH,CH,O”1
rrH)・ポリオキシエチレンアルキルエーテル(RO
(CHt CH20)n H)
・ポリオキシエヂレンアルキルフェニルエーテル・ポリ
オキシエチレンポリスチリルフェニルエー・ポリオキシ
エチレン−ポリオキシプロピレングリコール
(ただし、ブロックポリマー、ランダムポリマーを含む
)
・ポリオキシエチレンーポリオキシブロビレンアルキル
エーテル
(末端がアルキルエーテルを形成している)(ただし、
ランダムポリマーを含む)
・アルキルフェノールポルマリン縮合物の酸化エチレン
誘導体
・ポリオキシエチレン多価アルコール脂肪酸部分エステ
ル
例えば
CHO(CH2CH20)nH
CH,0(CH2CH,0)nH
・ポリオキシエチレン脂肪酸エステル
(例えば、RCOO(CH2CH20> n H)・ポ
リオキシエチレンフ’/し:にルアミン等が挙げられる
。Examples of such compounds include: - Polyethylene glycol (HO→CH, CH, O"1
rrH)・Polyoxyethylene alkyl ether (RO
(CHt CH20)n H) ・Polyoxyethylene alkylphenyl ether ・Polyoxyethylene polystyrylphenyl ether ・Polyoxyethylene-polyoxypropylene glycol (including block polymer and random polymer) ・Polyoxyethylene-polyoxy Brobylene alkyl ether (the terminal forms an alkyl ether) (however,
・Ethylene oxide derivatives of alkylphenol-pormarine condensates ・Polyoxyethylene polyhydric alcohol fatty acid partial esters such as CHO(CH2CH20)nH CH,0(CH2CH,0)nH ・Polyoxyethylene fatty acid esters (such as RCOO (CH2CH20> n H)・Polyoxyethylene F'/H: Examples include ruamine and the like.
具体的には例えば以下のようなものが好ましい。Specifically, the following are preferable, for example.
すなわち、ポリオキシエチレンラウリルエーテル、ポリ
オキシエチレンセチルエーテル、ポリオキシエチレンス
テアリルエーテル、ポリオキシエチレンオレイルエーテ
ル
ルコールエーテル、ボリオギシエチレンオクチルフェニ
ルエーテル、ポリオ:1ニジJチレンノニルフエニルエ
ーテル、ポリ詞キシエチレンソルビタンモノラウレート
、ポリオニにジエチレンソルビタンモノパルミテート
ンモノステアレート、ポリオキシエチレンソルビタント
リステアレート、、ポリオキシエチレンソルビタンモノ
オレエート、ポリオキシエチレンソルビタントリオレエ
ート、テトラオレイン酸ポリオキシエチレンソルビット
、ポリエチレングリコールモノラウレート、ポリエチレ
ングリコールモノステアレート、ポリエチレングリコー
ルモノオレエート、ポリエチレングリコールジステアレ
ート、ポリオキシエチレンノニルフェニルエーテルホル
ムアルデヒド縮合物、オキシエチレンオキシブロビレン
ブロックコボリマー、ポリエチレングリコール、テトラ
エチレングリコール等である。Namely, polyoxyethylene lauryl ether, polyoxyethylene cetyl ether, polyoxyethylene stearyl ether, polyoxyethylene oleyl ether alcohol ether, polyoxyethylene octylphenyl ether, polyoxyethylene ethylene octylphenyl ether, polyoxyethylene Ethylene sorbitan monolaurate, polyoni diethylene sorbitan monopalmitate monostearate, polyoxyethylene sorbitan tristearate, polyoxyethylene sorbitan monooleate, polyoxyethylene sorbitan trioleate, polyoxyethylene sorbitan tetraoleate, Polyethylene glycol monolaurate, polyethylene glycol monostearate, polyethylene glycol monooleate, polyethylene glycol distearate, polyoxyethylene nonylphenyl ether formaldehyde condensate, oxyethylene oxybrobylene block copolymer, polyethylene glycol, tetraethylene glycol, etc. It is.
上記化合物の感光性居中に占める割合は全感光層に対し
て0.1〜2Of4ff1%が好ましく、より好ましく
は0.2〜10重グ%である。The proportion of the above compound in the photosensitive layer is preferably 0.1 to 2% by weight, more preferably 0.2 to 10% by weight, based on the total photosensitive layer.
また、上記の化合物は上記含有mの範囲内であれば、単
独で用いてもよいし2種以上組合わせて使用してもよい
。Moreover, the above-mentioned compounds may be used alone or in combination of two or more types, as long as they are within the range of the above-mentioned content m.
また、本発明においては、感光層中における分子構造中
に前記構造単位[I]及び/又は[II]を有する化合
物の含有♀が支持体から遠い側の感光層表面近傍領域に
おいて、支持体に近い側の感光層表面近傍領域より多い
分布を右することが好ましく、特に支持体から遠い側の
感光層表面から全感光層の厚さの50%の距離までの範
囲内のダj域における上記化合物の含有mが支持体に近
い側の感光層表面から全感光層の厚さの50%の距離ま
での範囲内の領域にお【づる含有量より多いことが好ま
しい。In addition, in the present invention, the ♀ containing a compound having the structural units [I] and/or [II] in the molecular structure in the photosensitive layer is attached to the support in a region near the surface of the photosensitive layer on the side far from the support. It is preferable that the distribution is larger than the area near the surface of the photosensitive layer on the near side, and especially in the above-mentioned area within the range from the surface of the photosensitive layer on the side far from the support to a distance of 50% of the total thickness of the photosensitive layer. It is preferable that the content m of the compound is greater than the content in a region within the range from the surface of the photosensitive layer on the side closer to the support to a distance of 50% of the total thickness of the photosensitive layer.
更に、上記化合物の含有1としては感光層表面からその
厚さの50%の距離を境として、支す体に近い側に該感
光層に含まれる全上記化合物の40重n%以下、支持体
から遠い側に60重迅%以上含まれることが好ましく、
更に支持体に近い側に該感光層に含まれる上記化合物全
体の30重S%以下、支持体から遠い側に70重量%以
上含まれることが好ましい。Furthermore, as for the content 1 of the above-mentioned compounds, not more than 40 weight n% of the total of the above-mentioned compounds contained in the photosensitive layer is added to the support at a distance of 50% of the thickness from the surface of the photosensitive layer, on the side closer to the supporting body. It is preferable that 60% or more is contained on the side far from the
Further, it is preferable that the photosensitive layer contains 30% by weight or less of the above-mentioned compound in the photosensitive layer on the side closer to the support, and 70% or more by weight on the side far from the support.
具体的には、感光層中において上記化合物の含有率が支
持体から遠い感光層表面から支持体に近い感光層表面方
向へ向かって連続的に減少しているもの、不連続的に減
少しているもの、少なくとも1部に含有率が変化しない
、すなわら等含有率部分を有するものが好ましく、更に
は本発明の範囲内において、1部支持体から遠い側より
支持体に近い側の方が上記化合物の含有率が高くなる部
分を有するものも含む。また上記の種々のパターンを組
合わせたものも含む。更に上記支持体から遠い感光層表
面から支持体に近い感光層表面への化合物の含有率の変
化は直線的に一定変化率で変 ・化してもよいし、曲線
的に変化率を増大又は減少させながら変化してもよい。Specifically, the content of the above compound in the photosensitive layer decreases continuously from the surface of the photosensitive layer far from the support toward the surface of the photosensitive layer close to the support, and it decreases discontinuously. Preferably, at least one part of the content does not change, that is, it has an equal content, and within the scope of the present invention, one part is closer to the support than on the side farther from the support. It also includes those having a portion where the content of the above compound is high. It also includes combinations of the above various patterns. Furthermore, the change in compound content from the surface of the photosensitive layer far from the support to the surface of the photosensitive layer close to the support may be linearly changed at a constant rate of change, or may be increased or decreased in a curved manner. It may be changed while changing.
本発明の感光性平版印刷版の感光層には前記各々の素材
の他、必要に応じて更に染料、顔料等の色素、可塑剤な
どを添加することができる。In addition to the above-mentioned materials, pigments such as dyes and pigments, plasticizers, etc. may be added to the photosensitive layer of the photosensitive lithographic printing plate of the present invention, if necessary.
更に、本発明の感光性平版印刷版の感光層には、感脂性
を向上するために親油性の樹脂を添加することもできる
。これらの各成分を下記の溶媒に溶解させ、更にこれを
適当な支持体の表面に塗布乾燥させることにより、感光
層を設けて、本発明の感光性平版印刷版を形成すること
ができる。Furthermore, a lipophilic resin may be added to the photosensitive layer of the photosensitive lithographic printing plate of the present invention in order to improve the oil sensitivity. The photosensitive lithographic printing plate of the present invention can be formed by dissolving each of these components in the following solvents and coating and drying the solution on the surface of a suitable support to provide a photosensitive layer.
本発明における感光層を形成する感光性組成物の各成分
を溶解する際に使用し得る溶媒としては、メチルセロソ
ルブ、メチルセロソルブアセテ−1・、エチルセロソル
ブ、エチルセ゛ロソルブアセテート等のセロソ、ルブ類
、ジメチルホルムアミド、ジメチルスルホキシド、ジオ
キサン、アセトン、シクロヘキサノン、]・]リクロロ
エチレンメチルエチルケトン等が挙げられる。これら溶
媒は、単独であるいは2種以上混合して使用することが
て・きる。Examples of solvents that can be used to dissolve each component of the photosensitive composition forming the photosensitive layer of the present invention include cellosol, rubs such as methyl cellosolve, methyl cellosolve acetate, ethyl cellosolve, and ethyl cellosolve acetate. , dimethylformamide, dimethyl sulfoxide, dioxane, acetone, cyclohexanone, ]-]lichloroethylene methyl ethyl ketone, and the like. These solvents can be used alone or in combination of two or more.
本発明における感光層を支持体表面に設ける際に用いる
塗布方法としては、従来公知の方法、例えば、回転塗布
、ワイヤーバー塗布、デ2rツブ塗布、エアーナイフ塗
布、ロール塗布、ブレード塗布及びカーテン塗布等が可
能である。この際塗布量は用途により異なるが、例えば
固形分として0.5〜5.0(1/i”が好ましい。Coating methods used in the present invention to provide the photosensitive layer on the surface of the support include conventionally known methods, such as spin coating, wire bar coating, dip coating, air knife coating, roll coating, blade coating, and curtain coating. etc. are possible. At this time, the coating amount varies depending on the application, but for example, the solid content is preferably 0.5 to 5.0 (1/i'').
本発明における感光層を設ける支持体としては、アルミ
ニウム、亜鉛、鋼、銅等の金属板、並びにクロム、亜鉛
、銅、ニッケル、アルミニウム、鉄等がメツキ又は蒸着
された金属板、紙、プラスチックフィルム及びガラス板
、樹脂が塗布された紙、アルミニウム等の金属箔が張ら
れた紙、親水化処理したプラスチックフィルム等が挙げ
られる。このうち好ましいのはアルミニウム板である。Supports on which the photosensitive layer is provided in the present invention include metal plates made of aluminum, zinc, steel, copper, etc., metal plates plated or vapor-deposited with chromium, zinc, copper, nickel, aluminum, iron, etc., paper, and plastic films. Examples include glass plates, paper coated with resin, paper covered with metal foil such as aluminum, and plastic films treated to make them hydrophilic. Among these, aluminum plates are preferred.
本発明の感光性平版印刷版の支持体として砂目穴て処理
、陽極酸化処理および必要に応じて封孔処理等の表面処
理が施されているアルミニウム板を用いることがより好
ましい。As the support for the photosensitive lithographic printing plate of the present invention, it is more preferable to use an aluminum plate that has been subjected to surface treatments such as graining, anodizing, and, if necessary, sealing.
これらの処理には公知の方法を適用することができる。Known methods can be applied to these treatments.
一般に、感光性平版印刷版は、露光焼き付は装置を用い
て露光焼付され、次いで現像液にて現像される。この結
果、未露光部分のみが支持体表面に残り、ポジーポジ型
レリーフ像ができる。Generally, a photosensitive lithographic printing plate is exposed to light using a printing device and then developed with a developer. As a result, only the unexposed portion remains on the surface of the support, creating a positive-positive relief image.
本発明の感光性平版印刷版の現像に用いられる現像液と
しては、水系アルカリ現像液が好適である。前記の水系
アルカリ現像液としては例えば、水酸化ナトリウム、水
酸化カリウム、炭酸す1〜リウム、炭酸カリウム、メタ
ケイ酸す1−リウム、メタケイ酸カリウム、第ニリン酸
ナトリウム、第三リン酸ナトリウム等のアルカリ金属塩
の水溶液が挙げられる。As the developer used for developing the photosensitive lithographic printing plate of the present invention, an aqueous alkaline developer is suitable. Examples of the aqueous alkaline developing solution include sodium hydroxide, potassium hydroxide, mono-lithium carbonate, potassium carbonate, mono-lithium metasilicate, potassium metasilicate, sodium diphosphate, and sodium triphosphate. Examples include aqueous solutions of alkali metal salts.
(実施例)
[アルミニウム板の作製]
厚さ0.24IRQ+のアルミニウム板(材質1050
.調質H16)を5重伍%の水酸化ナトリウム水溶液中
で60℃で1分間脱脂処理を行った後、1/lの0.5
モル塩酸水溶液中において温度;25℃、電流密度:6
0A/dn”、処理時間;30秒間の条件で電解エツチ
ング処理を行った。次いで、5重量%水酸化ナトリウム
水溶液中で60℃、10秒間のデスマット処理を施した
後、20重量%硫酸溶液中で温度;20℃、電流!度;
3△/ d vz、処理時間;1分間の条件で陽極酸化
処理を行った。(Example) [Production of aluminum plate] Aluminum plate with a thickness of 0.24IRQ+ (material: 1050
.. After degreasing H16) in a 5% by weight aqueous sodium hydroxide solution at 60°C for 1 minute, 1/l of 0.5
In molar hydrochloric acid aqueous solution, temperature: 25°C, current density: 6
Electrolytic etching treatment was carried out under the conditions of 0 A/dn'' and a treatment time of 30 seconds.Next, a desmut treatment was performed at 60°C for 10 seconds in a 5% by weight aqueous sodium hydroxide solution, and then in a 20% by weight sulfuric acid solution. Temperature: 20℃, current: degrees;
The anodic oxidation treatment was performed under the conditions of 3Δ/d vz and treatment time: 1 minute.
更に、30℃の熱水で20秒間、熱水封孔処理を行い、
平版印刷版材料用支持体のアルミニウム板を作製した。Furthermore, hot water sealing treatment was performed with hot water at 30°C for 20 seconds.
An aluminum plate as a support for lithographic printing plate material was produced.
感光性平版印刷版試料10作製
上記のように作製したアルミニウム板に下記組成の感光
性組成物塗布液(1)をワイヤーバーを用いて1fあた
り固形分で1.2g塗布し、90℃で4分間乾燥した。Preparation of 10 Photosensitive Lithographic Printing Plate Samples A photosensitive composition coating liquid (1) having the following composition was coated on the aluminum plate prepared as described above using a wire bar at a solid content of 1.2 g per 1f, and then heated at 90°C for 40 minutes. Dry for a minute.
その上に更に下記組成の感光性組成物塗布液(2)を同
様に1fあたり固形分で1.2g塗布し、90℃で4分
間乾燥し、ポジ型感光性平版印刷版試料1を得た。Further, 1.2 g of photosensitive composition coating liquid (2) having the following composition was similarly applied on the solid content per 1f and dried at 90°C for 4 minutes to obtain positive photosensitive lithographic printing plate sample 1. .
(感光性組成物塗布液(1)組成)
・ノボラック樹脂A 6.71;
1・O−キノンジアジド化合物 1.50(Q
D−1)
・安息香酸 0.4 Q・ビ
クトリアピュアブルーBOH0,08g(保止ケ谷化学
鵠)製)
・ハロゲン遊離基を生成する化合物 0.15(1(
rad−1)
・メチルセロソルブ 50.ρ(感
光性組成物塗布液(2)組成)
・ノボラック樹脂A 6.7g・
0−キノンジアジド化合物 1.5g(QD−
1)
・ビクトリアピュアブルーB OH0,08+3・ハロ
ゲン遊離基を生成する化合物 o、 isg(rac
l−1)
・エチルセロソルブ 50顧かくし
て1qられた感光性平版印刷版の上層部、ずなわら、支
持体から遠い側の厚さの172の部分を採取し、含まれ
ている安息香酸のmを定ごしたところ、全mの約25%
の闇が存在していた。(Photosensitive composition coating liquid (1) composition) - Novolac resin A 6.71;
1.O-quinonediazide compound 1.50(Q
D-1) - Benzoic acid 0.4 Q. Victoria Pure Blue BOH 0.08g (manufactured by Hodogaya Kagakuen)) - Compound that generates halogen free radicals 0.15 (1 (
rad-1) ・Methyl cellosolve 50. ρ (Photosensitive composition coating liquid (2) composition) ・Novolac resin A 6.7g・
0-quinonediazide compound 1.5g (QD-
1) - Victoria Pure Blue B OH0,08+3 - Compound that generates halogen free radicals o, isg (rac
l-1) ・Ethyl Cellosolve 50 Sample the upper layer of the photosensitive lithographic printing plate, which was removed by 1q, at the thickness of 172 on the side far from the support, and measure the amount of benzoic acid contained in it. As a result, approximately 25% of the total m
There was a darkness.
感光性平版印刷版試料2〜10の作製
上記感光性平版印刷版試料1の作製における感光性組成
物塗布液(1)及び(2)組成の特定の素材及び塗布量
を第1表のように変える以外は上記試料1の作製と同様
にして感光性平版印刷版試料2〜10を得た。Preparation of Photosensitive Planographic Printing Plate Samples 2 to 10 The specific materials and coating amounts of the photosensitive composition coating liquids (1) and (2) in the preparation of the above photosensitive planographic printing plate sample 1 were as shown in Table 1. Photosensitive lithographic printing plate samples 2 to 10 were obtained in the same manner as in the preparation of sample 1 except for the following changes.
感光性平版印刷版試料11〜20の作製前記のように作
製したアルミニウム板に下記組成の感光性組成物塗布液
(3)を、その上に感光性組成物塗布液(4)を感光性
平版印刷版試料1の作製と同様にして塗布乾燥し、感光
性平版印刷版試料11を得た。更に上記塗布液(3)及
び(4)における特定の素材及び塗布量を第1表のよう
に変える以外は上記平版印刷版試料11の作製と同様に
して平版印刷版試料12〜20を得た。Preparation of Photosensitive Planographic Printing Plate Samples 11 to 20 A photosensitive composition coating solution (3) having the following composition was applied to the aluminum plate prepared as described above, and a photosensitive composition coating solution (4) was applied thereon to the photosensitive planographic plate. The coating was applied and dried in the same manner as in the preparation of printing plate sample 1 to obtain photosensitive lithographic printing plate sample 11. Furthermore, lithographic printing plate samples 12 to 20 were obtained in the same manner as in the preparation of lithographic printing plate sample 11, except that the specific materials and coating amounts in coating solutions (3) and (4) were changed as shown in Table 1. .
(感光性組成物塗布液(3)組成)
・ノボラック樹脂A ’ 6.3g
・O−キノンジアジド化合物 1.9g(Q
D−1)
・シス−1,2−シクロヘキサン 0,3gジカル
ボン酸
・ビク1へリアピュアブルーB OH0,07g(採土
ケ谷化学U製)
・ハロゲン遊rIimを生成する化合物 0.131
7(rad −2)
・メチルセロソルブ 501g(感
光性組成物塗布液(4)組成)
・ノボラック樹脂A 6.3(1
・0−キノンジアジド化合物 1.9(1(Q
D−1)
一しオドーJL、TW−0 120 0.3
g・ビクトリアピュアブルーBOH0,07g・ハロ
ゲン:1ll11基を生成する化合物 0.13(]
(rad −2)
・メチルセロソルブ 501g感光
性平版印刷版試料21〜23の作製前記感光性平版印刷
版試料N 0.2に用いた感光性組成物塗布液(1)の
p−トルイル酸の聞を0.2gとし、試料N o、 2
の(¥製と同様にして112当たりの固形分で2.49
となるように塗布し、乾燥して感光性平版印刷版試料N
o、21を作製した。(Photosensitive composition coating liquid (3) composition) -Novolac resin A' 6.3g
・O-quinonediazide compound 1.9g (Q
D-1) - Cis-1,2-cyclohexane 0.3g Dicarboxylic acid - Biku 1 Helia Pure Blue B OH 0.07g (manufactured by Odugaya Kagaku U) - Compound that generates halogen free rIim 0.131
7 (rad -2) - Methyl cellosolve 501g (photosensitive composition coating liquid (4) composition) - Novolac resin A 6.3 (1
・0-quinonediazide compound 1.9(1(Q
D-1) Isshi Odo JL, TW-0 120 0.3
g・Victoria Pure Blue BOH0.07g・Halogen: Compound that produces 111 groups 0.13(]
(rad -2) Methyl cellosolve 501g Preparation of photosensitive lithographic printing plate samples 21 to 23 The amount of p-toluic acid in the photosensitive composition coating liquid (1) used for the photosensitive lithographic printing plate sample N0.2 was is 0.2g, sample No. 2
(Same as ¥ made, solid content per 112 is 2.49
After coating and drying, photosensitive planographic printing plate sample N
o, 21 was prepared.
また、上記感光性組成物塗布液(1)の特定の素材を第
1表のように変える以外は試料N021と同様にして感
光性平版印刷版試料No、22及び23を作製した。In addition, photosensitive lithographic printing plate samples Nos. 22 and 23 were prepared in the same manner as sample No. 021 except that the specific material of the photosensitive composition coating liquid (1) was changed as shown in Table 1.
かくして得られた感光性平版印刷版試料No、1〜23
上に感度測定用ステップタブレット(イーストマン・コ
ダック社製N082、濃度差0.15ずつで21段階の
グレースケール)及びブルナーチャートを密着して、4
KWメタルハライドランプを光源としてクリア段数が5
段の条件で、露光した。その時の露光カウント及びブル
ナーの2%小点の再現性を評価した。Photosensitive lithographic printing plate samples No. 1 to 23 thus obtained
A step tablet for sensitivity measurement (N082 manufactured by Eastman Kodak, 21 levels of gray scale with a density difference of 0.15) and a Brunner chart were placed on top of the 4
Clear stage number is 5 using KW metal halide lamp as light source
Exposure was performed under the following conditions. At that time, the exposure count and the reproducibility of Brunner's 2% point were evaluated.
また、セーフライト性を評価Tlる為に、未露光の前記
試料N011〜23を明室に10分、15分及び20分
間放置し曝光させ5DR−1(コニカ(株社製)を水で
6倍希釈した現象液(標準現象液)で27℃にて20秒
間現像し、画像部の浸食度を明室に放買しなかったもの
と比較し、評価した。In addition, in order to evaluate the safelight property, the unexposed samples N011 to 23 were left in a bright room for 10 minutes, 15 minutes, and 20 minutes and exposed to light. It was developed with a twice diluted phenomenon solution (standard phenomenon solution) at 27° C. for 20 seconds, and the degree of erosion of the image area was evaluated by comparing it with that of a sample that was not exposed to light in a bright room.
更に、ボールペン適性を検討するためにペリカン製ボー
ルペンで未露光部に描画を行い、その後上記と同様に現
像処理し描画部のやられ(侵食r!りを判定した。結果
を第1表に示す。Furthermore, in order to examine suitability for a ballpoint pen, drawings were drawn on the unexposed areas using a Pelikan ballpoint pen, and then developed in the same manner as above, and the damage (erosion r!) of the drawn areas was determined. The results are shown in Table 1.
以下余白“、4
:・ 1“ ユ:
傘10−キノンジアジド化合物
QD−1: 1,2−ナフトキノンジアジド−5−スル
ボンM−2,3,II、4’ −テトラヒドロキシベン
ゾフェノンエ
ステル
QD−2;
(X/V −1/3
QDを反応させる前の樹脂のMW −1,600)QD
−3;
QDを反応させる前の樹脂のMW = 1,300本
2 ノボラック樹脂
・ノボラック樹脂A
フェノールとm−クレゾールとp−クレゾールとホルム
アルデヒドとの共重縮合樹脂(フェノール、m−クレゾ
ール及びp−クレゾールの各々のモル比が2.0:
4.8: 3.2、MW = 7,000、tvL
w /Mn −5,4)
・ノボラック樹脂B
m−クレゾールとp−クレゾールとホルムアルデヒドと
の共重樹脂(a+−クレゾール及びp−クレゾールの各
々のモル比が6:4、MW −a、ooo、MW /M
n −5,7)
$3 構造単位[I]及び/又は[I[]を有する化合
物
・レオドールTW−0120(花王側製);ポリオキシ
エチレンソルビタンモノオレエート・エマルゲン920
(花王@製):
ポリオキシエチレンノニルフェニルエーテル・ポリエチ
レングリコール(関東化学社製);ポリエチレングリコ
ール# 2000
・エマノーン1112(花王■製):
ポリエチレングリコールモノラウレート・ニラコールR
= 1010 (日光ケミカルズ社製):ポリオキシエ
チレンノニルフェニルホルムアルデヒド縮合物
・レオドール440(花王■製);
テトラオレイン酸ポリオキシエチレンソルビット
・エマルゲン408(花王慣)製);
ポリオキシエチレンオレイルエーテル
・エマルゲンA −90(花王(体製);ポリオキシエ
チレン誘導体
・エマルゲンl−40(花王■製);
ポリオキシエチレンW Q体
・エマルゲンpp−250(花王(体製);オキシエチ
レン・オキシプロピレンブロックコポリマー
Oハロゲン遊離基を生成する化合物
rad−1;2−トリクロロメチル−5−(p−メトキ
シスチリル)−1,3,4−
オキサジアゾール(特開昭54−74728号公報実施
例1に記載の化合物)
rad−2:2−トリクロロメチル−5−[β−(2−
ベンゾフリル)ビニル]1゜
3.4−オキサジアゾール(特開昭
60−138539号公報に記載の例示化合物(1))
[発明の効果]
本発明により、感度を低下させることなく網点、特に小
点の再現性が改良された感光性平版印刷版を提供するこ
とができた。The following margins are ", 4:・1" U: Umbrella 10-quinonediazide compound QD-1: 1,2-naphthoquinonediazide-5-sulfone M-2,3,II, 4'-tetrahydroxybenzophenone ester QD-2; ( X/V -1/3 MW of resin before reacting QD -1,600) QD
-3; MW of resin before reacting with QDs = 1,300 pieces 2 Novolac resin/Novolac resin A Copolycondensation resin of phenol, m-cresol, p-cresol, and formaldehyde (phenol, m-cresol, and p-cresol) The molar ratio of each cresol is 2.0:
4.8: 3.2, MW = 7,000, tvL
w /Mn -5,4) - Novolac resin B Copolymer resin of m-cresol, p-cresol and formaldehyde (molar ratio of each of a+-cresol and p-cresol is 6:4, MW -a,ooo, MW/M
n -5,7) $3 Compound having structural unit [I] and/or [I[] - Rheodol TW-0120 (manufactured by Kao); Polyoxyethylene sorbitan monooleate - Emulgen 920
(manufactured by Kao@): Polyoxyethylene nonylphenyl ether/polyethylene glycol (manufactured by Kanto Kagaku Co., Ltd.); Polyethylene glycol #2000 ・Emanon 1112 (manufactured by Kao ■): Polyethylene glycol monolaurate/Nilacol R
= 1010 (manufactured by Nikko Chemicals): polyoxyethylene nonylphenyl formaldehyde condensate, Rheodol 440 (manufactured by Kao ■); polyoxyethylene sorbitol tetraoleate, Emulgen 408 (manufactured by Kao); polyoxyethylene oleyl ether, Emulgen A-90 (Kao (manufactured by Tai); Polyoxyethylene derivative/Emulgen l-40 (manufactured by Kao ■); Polyoxyethylene W Q form/Emulgen pp-250 (Kao (manufactured by Tai); Oxyethylene/oxypropylene block copolymer Compound rad-1 that generates O halogen free radical; 2-trichloromethyl-5-(p-methoxystyryl)-1,3,4-oxadiazole (described in Example 1 of JP-A-54-74728) Compound) rad-2:2-trichloromethyl-5-[β-(2-
benzofuryl)vinyl]1゜3.4-oxadiazole (exemplified compound (1) described in JP-A-60-138539) It was possible to provide a photosensitive lithographic printing plate with improved reproducibility of small dots.
また、本発明によりセーフライト性及びボールペン適性
に優れた感光性平版印刷版を提供することができた。In addition, the present invention could provide a photosensitive lithographic printing plate with excellent safelight properties and ballpoint pen suitability.
第1図の(a )〜(h )は本発明の感光性平版印刷
版の感光層中の有機酸の好ましい濃度分布を示す。
図中、u、Sは支持体から遠い側の感光層表面を示し、
L、Sは支持体に近い側の感光層表面を示す。
第 1 図(a) to (h) in FIG. 1 show preferred concentration distributions of organic acids in the photosensitive layer of the photosensitive lithographic printing plate of the present invention. In the figure, u and S indicate the surface of the photosensitive layer on the side far from the support,
L and S indicate the surface of the photosensitive layer closer to the support. Figure 1
Claims (1)
性樹脂及び有機酸を含有する感光層を有する感光性平版
印刷版において、前記感光層中における前記有機酸の含
有量が少なくとも前記支持体に近い側の感光層表面近傍
領域において、前記支持体から遠い側の感光層表面近傍
領域より多いことを特徴とする感光性平版印刷版。In a photosensitive lithographic printing plate having a photosensitive layer containing an o-quinonediazide compound, an alkali-soluble resin, and an organic acid on a support, the content of the organic acid in the photosensitive layer is at least on the side closer to the support. A photosensitive lithographic printing plate characterized in that the area near the surface of the layer is larger than the area near the surface of the photosensitive layer on the side farther from the support.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13897288A JPH01307741A (en) | 1988-06-06 | 1988-06-06 | Photosensitive lithographic printing plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13897288A JPH01307741A (en) | 1988-06-06 | 1988-06-06 | Photosensitive lithographic printing plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01307741A true JPH01307741A (en) | 1989-12-12 |
Family
ID=15234479
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13897288A Pending JPH01307741A (en) | 1988-06-06 | 1988-06-06 | Photosensitive lithographic printing plate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01307741A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06332181A (en) * | 1993-04-30 | 1994-12-02 | Internatl Business Mach Corp <Ibm> | Resist structure and its preparation |
-
1988
- 1988-06-06 JP JP13897288A patent/JPH01307741A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06332181A (en) * | 1993-04-30 | 1994-12-02 | Internatl Business Mach Corp <Ibm> | Resist structure and its preparation |
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