JPH01308035A - Molding die for resin-sealed semiconductor device - Google Patents

Abstract

PURPOSE:To make it possible to improve heat transfer to a resin tablet by a method wherein a heating protrusion part, which is force-fitted into the resin tablet, is projected in a pot. CONSTITUTION:A heated pin 12 capable of moving vertically interlocking to a plunger 11 is provided in the bottom part 2 of a pot of a bottom force 1. First, a lead frame 7 mounted with a device is installed at a position set by a positioning pin 6 of the bottom force heated at a constant temperature. Moreover, the bottom force and a top force 8 are clamped in a state that the heated pin 12 is made to ascend. Then, a resin tablet 10 is inserted in the pot by its own weight or the plunger 11 while a through hole 13 is force-fitted in the pin. The tablet undergoes heat transfer not only from the bottom part of the pot and the side part 9 of the pot but also from the interior of the through hole by the heated pin, a uniform fusion becomes possible and the quality of a product is improved.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a molding die used for sealing a resin-sealed semiconductor device.

[Conventional technology]

FIG. 5 is a sectional view of a conventional transfer molding mold 1ji1 (hereinafter referred to as a mold) for a resin-sealed semiconductor device, and FIG. 6 is a perspective view of a lower mold of this mold. In both figures, 1 is -F
A mold, 2 is a hot bottom provided in this lower mold, 3 is a runner communicating with this hot bottom, 5 is a cavity in which the semiconductor device 1a mounted on the frame 7 is housed, 4 is the above-mentioned A gate connecting runner 3 and cavity 5,
Reference numeral 6 denotes a positioning bin for positioning the semiconductor device within the cavity. 8 is an upper mold, 9 is a pot side part provided on this upper mold and forms a pot together with the pot bottom part 2;
0 is a resin tablet for a resin-sealed semiconductor device (hereinafter referred to as a resin tablet) inserted into the pot, and 11 is a plunger that pressurizes this resin tablet.

Next, the operation will be explained. The lead frame 7 carrying the semiconductor device is mounted at a position set by the positioning pin 6 of the lower mold 1 heated to a constant temperature, and the lower mold 1 is heated to a certain temperature.
The mold is clamped by the heated upper mold 8 in the same manner as above.

Next, insert the solid resin tablet 10 into the pot,
Pressurize with plunger 11. At this time, 10 resin tablets
is heated and melted from the bottom by heat transfer from the pot bottom 2. The heated and melted resin is filled into the cavity 5 through the runner 3 and gate 4 by the pressure of the plunger 11, and seals the semiconductor device. This resin is heated for a certain period of time to harden, and the molding is completed.

[Side lighting that the invention attempts to solve]

Since the conventional mold is constructed as described above, the resin tablet is heated only by heat transfer from the bottom and side of the pot when the plunger is pressurized.

Therefore, the internal temperature of the resin tablet increases more slowly than the bottom and sides, which are heated quickly, creating a temperature difference within the resin tablet. This temperature difference caused the problem that the resin tablets were not uniformly melted, which adversely affected the molding process and quality.

[Means to solve the problem]

This invention was made to solve the above-mentioned problems, and an object of the present invention is to obtain a mold that improves the heating element 4 to the resin tablet.

The mold according to the present invention has a heating protrusion that is press-fitted into the resin tablet and protrudes into the pot.

[Function] The heating protrusion is press-fitted into the inside of the resin tablet and heats the resin tablet from the inside as well.

[Embodiment 1] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing a lower mold of a transfer molding mold for a resin-sealed semiconductor device according to the present invention. In the figure, 1 is the lower mold, 2 is the pot bottom provided in this lower mold,
3 is a runner that communicates with the bottom of the pot; 5 is a cavity that houses the semiconductor device mounted on the lead frame 7;
4 is a gate connecting the runner 3 and the cavity 5; 6 is a 1d fixing pin for positioning the semiconductor device in the cavity; 12 is a heating element provided in the pot bottom 2 and movable up and down in conjunction with a plunger to be described later. It is a rounded bottle. 2 and 3 are cross-sectional views showing a state in which the upper mold 8 (il- mold is clamped) to the lower mold 1. In both figures, 9 is provided in the upper mold 8 and is located at the bottom of the pot. The side part of the pot together with 2 forms a pot, and 11 is a plunger that pressurizes the resin tablet inserted into the pot. Figure 4 is an 8+ perspective view of the V-cut of the tree mat used in this example. 10 is a resin tablet, and 13 is a through hole that is provided in this resin tablet, has an outer diameter slightly smaller than the outer diameter of the bottle 12, and is press-fitted into the bottle 12.

Next, the operation will be explained. The lead frame 7 on which the semiconductor device I1 is mounted or the positioning pin 6 of the lower mold 1 heated to a constant temperature is set by the position II! The lower mold 1 and the stopper mold 8 are clamped with the heated pin 12 raised to -F as shown in FIG. next,
A resin taplet 10 is inserted into the pot by the driver or plunger 11 while press-fitting the hole 13 into the pin 12.

Resin tablets are included in pot bottom 2 and pot l111
Heat is transferred not only from the first part 9 but also from the inside by the heated pin 12, allowing uniform melting. As shown in FIG. 3, the pin 12 also descends in conjunction with the descent of the plunger 11, completing the resin filling.

In the above example, the plunger 11 and the heated bottle 12 were shown at the bottom of the pot 2. It may be provided in the pot side part 9 or the plunger 11 and press-fitted into the resin tablet. In this case, the resin tablet has through holes 13
In addition to the shape having the above-described shape, a groove that engages with the protrusion is provided.

〔Effect of the invention〕

As described above, according to the present invention, since the heating protrusion is provided which is press-fitted into the inside of the resin tablet, the temperature difference inside the resin tablet can be reduced by heating the resin tablet from the inside, and the temperature can be uniformly heated. The effect is that the melting process becomes smoother, the molding process progresses smoothly, and the quality of the product improves.

[BRIEF DESCRIPTION OF THE DRAWINGS] FIG. 1 is a perspective view of a lower mold of a mold for a resin-sealed semiconductor device according to an embodiment of the present invention, and FIG. 2 is a sectional view of the mold of FIG. 1. , FIG. 3 is a sectional view showing the operation of the molding die shown in FIG. 2, FIG. 4 is a perspective view of a resin tablet used in an embodiment of the present invention, and FIG. 5 is a conventional resin sealed mold + - A sectional view of a molding die for the gallery pot body device; FIG. 6 is a perspective view of the lower mold of the molding die; 1...Lower mold, 8...Upper mold, 10...Resin tablet, 12...Bin.

Claims (1)

[Claims] A molding die for resin-sealing a semiconductor device with a resin tablet, characterized in that a heating protrusion that is press-fitted into the resin tablet projects into a pot of the mold. Molding mold for semiconductor devices.