JPH01308043A - Boat replacing device for semiconductor wafer - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a replenishment means using a heat treatment boat for semiconductor wafers.

[Conventional technology]

The third factor is a heat treatment boat that has been widely used in the past, and is made of heat-resistant material such as quartz glass, and is usually stored on a saucer to prevent contamination. When in use, a heat treatment tube such as a quartz tube is heated with F, F4, and high heat treatments necessary for wafer processing, such as diffusion, aqueousization, CVD, and sintering, are performed.

In the figure, (1) is the wafer, (2) is the heat treatment boat,
(3) is viewed using a quartz tube and a (5-flies) quartz crow saucer.

Next, the operation of the conventional boat will be explained. Figures 4-A and 1-8 show the Ueno 1 support rods (2a) and (2b) of the heat treatment boat (2) and the grooves (2C), (2d) and (2).
e), the wafer (1) has grooves (2c), (2
d) and (2e), the wafer (1) is finished with a relatively narrow groove width on a rod that does not tilt as much as possible during heat treatment. In other words, if the groove width is wide, the wafer (1) will tilt and come into contact with the adjacent wafer, or conversely, the wafer (1) will separate greatly and the distance between the wafers will fluctuate, resulting in negative effects such as heat treatment, diffusion, and oxidation. It cannot be done. It is clear that as the diameter of neighboring wafers becomes larger and the diameter of the wafers reaches 8 to 10 inches, even a slight tilt of the wafers will greatly affect the distance between the wafers.

However, if the groove is finished narrowly, the thermal expansion coefficient of the wafer, which is mostly made of silicon, and h
There is a big difference between this and the British boat, as the wafer made of silicon is larger, so the grooves compress and tighten the wafer during heat treatment.

Such a phenomenon is extremely unfavorable due to the material properties of semiconductors, and first of all, it increases defects in the crystal and impairs electrical characteristics.It also causes a masking effect when doping impurities and forming an oxide film, resulting in electrical This leads to defects in characteristics, appearance characteristics, etc.

By the way, if the groove width is made gentler, in addition to the above-mentioned problem of the wafers being tilted, it becomes disadvantageous to hold the wafers on the boat all at once and to rationally transfer the wafers without using a bin set. As shown in Figure 5, the wafer (1
) is difficult to enter. In addition, (4b) is the temporary fixing plate when holding the wafer, and (4C) is the slit that is the entrance and exit of the plate. It is useful for mounting on the boat (2).

[Problem to be solved by the invention]

Therefore, the conventional semiconductor wafer boat reversing device has many problems, such as the existence of irresistible surfaces in the groove shape, and many defects in electrical and external characteristics, especially in the vicinity of the wafer in contact with the boat. Furthermore, when the groove width is relatively wide, there is a problem in that it is not possible to replace the wafer all at once due to the inclination of the wafer.

This invention aims to solve the above-mentioned problem, and the electrical and external characteristics of the wafer holding groove are impaired, and -
The purpose of the present invention is to obtain a semiconductor wafer boat transfer device that allows easy bulk transfer.

[Means to solve the problem]

A semiconductor wafer boat refurbishing device according to the present invention includes a boat consisting of at least three rod-shaped bodies each having a ~-shaped groove that holds both ends and a bottom of a wafer, and a boat on which the boat is placed. A saucer with nine openings formed on the bottom facing the lower opening of the saucer, and a V-shaped groove facing the saucer and coinciding with the V-shaped groove of the boat; The device is equipped with a pushing means for penetrating the opening and pushing the wafer upward.

[Effect]

In the 7-shaped groove according to the present invention, the edge of the wafer is brought into point contact with the ridge of the groove to hold the wafer. In this case, the wafers cannot be held in an upright position unless the wafers are held up to the left and right ends, but if the rod-like body of the heat treatment boat is positioned up to the left and right ends, the collective gripping operation is not possible. For this purpose, the wafers are removed from the heat treatment boat by penetrating the tray and setting a push-up device from below the wafers, and the wafers are collectively gripped. Incidentally, since the above operation is performed while the heat treatment boat is placed on the saucer, the heat treatment boat is not contaminated by being contaminated.

[Embodiments of the invention]

Hereinafter, an embodiment of the present invention will be described. 3. Figure 1 is a perspective view showing an embodiment of the present invention, in which a wafer (1) after heat treatment is transferred to a wafer carrier (6) for transportation to the next process. The series of processes up to this point will be explained.

The wafer (1) after the heat treatment is placed on the heat treatment boat w and placed on the saucer (2). There are 4 at the bottom of the saucer.
There is a book positioning bin (SOa), and this tray β1 is set on the pushing device (7) and the book positioning bin (50a) is placed on the book positioning bin (SOa).
) and the same four positioning larges (7a).

At this stage, the bottom of the saucer (sob) and the push-up attachment (7b) match. In addition, the holding groove (7C) for the wafer (1) is formed in the lifting attachment (7b) in an arc shape, and the pitch thereof is equal to the pitch of each V-shaped groove (20C), (20d), (20d), ( 2oh) and (
20i) It is pre-adjusted to the pitch, and is also made to match the grooves (4a) and (6a) of the bulk gripper (4) and the wafer carrier (6), for example, V16 inch is versatile.

Next, slightly move the heat treatment boat 4 to create each 7-shaped groove (20C).
.

When the pitches of (20d), (2oh) and (20i) are aligned with the holding groove (7C) of the push-up attachment, and the device t (7) is activated, the built-in air cylinder plunger (7d) is pushed up. The wafer (1) is lifted up, placed on the push-up attachment (7C), and removed from the heat treatment boat (2).

After that, the batch gripper (4) is placed in the holding groove (4a) so as to hold the wafer (1) pushed up, and -
Close the fixing plate (4b) and align mutual n (4a) and (6a) on the wafer carrier (6). And -
When the fixing plate is loosened, the wafers (1) are transferred from the collective gripping tool (4) to the wafer carrier.

To replace the wafer carrier (ljJ) with the heat treatment boat handle, the above operations can be reversed.

Figure 2-A, Figure 2-B, Figure 2-C, and Figure 2-6 show a part of the heat treatment board based on the present invention, and Figure 2-A is a plan view, and Figure 2-B is a plan view. The figure is a perspective view, Figure 2-C is a front view,
and z-d are side views.

At the same time, the rod-shaped body of the heat-treated boat (20a), (2
0b), (2Of) and (20g) have ■-shaped grooves (20C), (20d) in the parts that contact the wafer (1).
, (20h) and (20i) are provided, and the wafer (1) is held by point contact with the ridge portion of the inner surface of each ■-shaped groove.

In the above example, the number of rod-shaped bodies constituting the heat treatment boat is 4.
As explained in the book, the minimum left, right,
Those three at the bottom are a good thing.

However, in this case, it is necessary to take measures such as dividing the push-up attachment into two parts. Moreover, although the material of the heat treatment boat and the saucer is described as quartz glass, the same effect can be achieved with materials such as silicon carbide, polycrystalline silicon, and ceramics.

Historically, the bulk gripper is known by the inventor, but other types of bulk grippers may also be used, and this bracket gripper may be directly transferred to other boats.

Furthermore, there is no problem in preparing the 77 sets before, during, or after the advance payment.

Furthermore, the unit amount by which the wafers are pushed up and placed on the heat treatment boat does not exempt the purpose of the present invention, whether it is the whole amount or a portion of the wafers placed on the heat treatment boat, and the mechanism for pushing up is limited to an air cylinder1, and may not be carried out by hydraulic pressure, levers, or other means. It does not matter as long as the wafer is not contaminated or subjected to shock.

〔Effect of the invention〕

As explained above, in this invention, the heat treatment boat loosely holds at least three points E on the left, right and bottom sides of the wafer with the ■-shaped groove, and the wafers are held in bulk from the bottom of the saucer on which the heat treatment boat is placed. The structure is such that the wafers are held all at once after being pushed up, and the wafers are moved upright, which prevents the wafers from tilting and prevents material defects at the groove positions of the wafer boats.
This has the effect of reducing defects in electrical and appearance characteristics, and also facilitates replacement.

[Brief explanation of the drawing]

Fig. 1 is a perspective view showing an embodiment of the present invention, Fig. 2-A,
2-B, 2-C, and z-d are a plan view, a perspective view, a front view, and a side view showing a part of the heat treatment boat of the present invention, and FIG. 3 is a conventional heat treatment boat and a saucer. FIGS. 4-A and 4-B are front and side views showing the state of a conventional heat treatment boat in port, and FIG. 5 is a perspective view showing a wafer batch gripping tool. In the figure, (1) is the wafer, (7) is the pushing device, and ■ is the heat treatment 1t'-to, (20cX20dX20hX20i)
It is a V-shaped groove, -c is a saucer. In the drawings, the same reference numerals indicate the same or corresponding parts.

Claims (1)

[Claims] A boat consisting of at least three rod-like bodies each having a V-shaped groove for holding both ends of the outer periphery of the wafer and the bottom, respectively, on which the boat is placed, and an opening opposite to the lower opening of the boat is formed in the bottom. A semiconductor device comprising: a saucer; and a pushing means formed with a V-shaped groove facing the opening of the saucer and coinciding with the V-shaped groove of the boat, and pushing the wafer upward through the opening of the saucer. Wafer boat transfer equipment.