JPH01308097A - Electronic component mounting equipment - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to an electronic component mounting device for mounting electronic (chip) components on a printed circuit board, and particularly to miniaturization of the installation area of the device and speed of selecting one component. improvement and replacement of parts supply section,
The present invention relates to an electronic component mounting device suitable for facilitating setup such as replenishment of components and facilitating operation.

[Conventional technology]

A conventional electronic component mounting device is, for example, disclosed in Japanese Patent Application Laid-Open No. 55-11.
As described in Japanese Patent Application No. 8698 and whose main part is shown in FIG.
A linearly driven table 13 that moves to a position corresponding to
It has been proposed that the device be installed on the side opposite to the operator of the device with the component mounting portion 12 in the center.

[Problem to be solved by the invention]

In the above conventional technology, since the chip component supply section 11 is arranged linearly on the rectilinear table, in order to move an arbitrary chip component supply section to the position of the chip component mounting section, the moving distance of the table is A length approximately twice the length of is required.

Therefore, if the number of chip component supply units installed is increased,
Inevitably, the length of the table becomes longer, and a larger installation area is required than the width of the main body of the apparatus.

In addition, the chip component supply unit 1 installed on the far right side
When the chip component supply section 11b to be selected next from 1a is located on the left side of the table, the amount of movement of the table becomes large, resulting in a problem that the time required for movement increases and takt time is lost.

On the other hand, such electronic component mounting equipment has a board feeding device, a solder printing device, or an adhesive coating device as a pre-process, and an adhesive curing device, a solder reflow device, etc. as a post-process on a single line. They are often placed side by side, so that the operating side of the device and the rear side of the device are sometimes separated.

For this reason, when the substrate to be produced changes and the type of parts needs to be changed, the operator must go to the rear of the equipment and operate the chip component supply section, making it difficult to operate the equipment. There is a problem in that the operation is inconvenient and the operating rate of the device is reduced.

An object of the present invention is to reduce the installation area of the device, to quickly select components, and to replace one component supply section and replenish the table at the front of the device, in order to solve the problems of the conventional electronic component mounting device. An object of the present invention is to provide an easy-to-use electronic component mounting device that can be used by an operator (on the operator side).

[Means to solve the problem]

In order to achieve the above object, the electronic component mounting device of the present invention has a plurality of electronic component supply means mounted on the upper surface in a radial manner so as to be detachable, and at the lowest position on the operation side and on the opposite side. The electronic component supplying means is rotated with its top surface tilted so as to reach the uppermost position, and when the electronic component supplying means with no electronic components reaches the lowermost position, the electronic components are replenished and the electronic components that have reached the uppermost position are A rotary table for taking out electronic components from the supply means, a printed circuit board replacement position located above the lowest position of this rotary table on the operation side, and a position for mounting electronic components on the printed circuit board on the opposite side. and a printed circuit board positioning means that moves between and positions the printed circuit board at both positions, and a printed circuit board positioning means that is disposed above the electronic component mounting position of the printed circuit board and the electronic component supply means that has reached the uppermost position, and is arranged above the electronic component supply means that moves the electronic components from the electronic component supply means. It is provided with means for mounting electronic components to take them out and mount them on a printed circuit board.

Furthermore, the rotary table is configured to be able to rotate in both forward and reverse directions in order to shorten the time it takes for the electronic component supply means, which places the electronic components to be next mounted on the printed circuit board, to reach the uppermost position. .

In addition, the printed circuit board positioning means includes two horizontal lines perpendicular to each other in order to position the printed circuit board at the electronic component mounting position.
It is configured so that it can be positioned in the direction of 1=mo.

Further, the electronic component mounting means is provided with an index driving means in order to drive the electronic component supply means to take out the electronic component when it reaches the uppermost position, and to take out the electronic component in a timely manner.

In addition, in order to reduce takt time, the synchronous drive means includes a cam that drives the electronic component supply means that reaches the uppermost position on the same rotating shaft so that it can take out the electronic component, and a mounting/detachment means included in the electronic component mounting means. The cam is equipped with a cam that takes out electronic components from the electronic component supplying means that has reached the uppermost position and mounts them on the printed circuit board, and rotates in a constant relationship with the rotating shaft, and connects the mounting means between the uppermost electronic component supplying means and the printed circuit board. It is equipped with a means for forwarding between the two.

[Effect]

In the electronic component mounting device configured as above,
A plurality of electronic component supply means, printed circuit board positioning means, and electronic component mounting means, which are arranged radially on a rotary table whose upper surface is tilted and rotates, are vertically arranged three-dimensionally, thereby reducing the installation area of the entire device. can be made smaller,
In addition, since electronic components are supplied and printed circuit boards are replaced by the operator, ease of use can be improved.

In addition, since the rotary table rotates in both forward and reverse directions, the electronic component supply means on which the next electronic component is placed can be moved to the uppermost position in a short time, reducing the takt time of the device. Therefore, productivity can be improved.

Further, since the printed circuit board positioning means can position the printed circuit boards in the horizontal direction perpendicular to each other, the printed circuit boards can be easily and accurately positioned at the electronic component mounting position.

In addition, since the electronic component mounting means is provided with a synchronized drive means, the electronic component supplying means that has reached the uppermost position is driven so as to be able to take out the electronic component, and the mounting and dismounting means of the electronic component mounting means takes out the electronic component at the same time. be able to.

The synchronous drive means has a plurality of cams on the same rotating shaft, and one cam drives the electronic component supply means to take out the electronic component when it reaches the uppermost position, and the other cam drives the electronic component mounting means. The electronic component is taken out from the electronic component supply means which has reached the uppermost position by the attachment/detachment means, and is mounted on the printed circuit board, and the attachment/detachment means is connected to the electronic component supply means at the uppermost position by the means that rotates in a constant relationship with the rotation axis. Since the electronic component supplying means and the electronic component mounting means which have reached the uppermost position can be driven in a fixed relationship with a simple configuration, since the electronic component supplying means and the electronic component mounting means are transferred between the printed circuit board and the printed circuit board.

〔Example〕

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be explained below with reference to FIGS. 1 to 4, in which the present invention is implemented in a chip component mounting apparatus.

As shown in FIGS. 1 and 2, the chip component mounting apparatus 1 of the present invention includes a rotary table 3 that rotates in both forward and reverse directions with its upper surface inclined in a diagonal direction within a frame 2, and a rotary table 3 that rotates the rotary table 3. A driving means 4, a plurality of chip component supply means 5 detachably mounted radially on the rotary table 3, a printed circuit board positioning means 6 disposed above the lowermost position of the rotary table 3, and a printed circuit board positioning means 6 disposed above the lowermost position of the rotary table 3; It is composed of a chip component mounting means 7 arranged above the chip component supply means 5 and the printed circuit board positioning means 6 which have reached the position, and a synchronous drive means 8.

Note that 9 in the figure is a printed circuit board.

Next, the configuration of each part will be explained in more detail.

The frame 2 has a sealed box shape, and on the operation side on the left side in FIG. An upper stand 23 is fixed to the upper part of the interior, and a center stand 24 is fixed to the left side of the center of the dome.

The rotary table 3 has its upper surface inclined so that the left side is at the lowermost position and the right side is at the uppermost position with respect to FIG.
The rotary table driving means 4 rotates the table in both forward and reverse directions. Chip component supply means 5 is detachably attached to each of these jigs 31.

The rotary table driving means 4 includes a forward and reverse DC motor 42 fixed to the bottom of the frame 2 via a bracket 41.
When the driven pulley 45 is driven, the driven pulley 45 rotates via the drive pulley 43 and the timing belt 44, and moves to the lower rotation center position of the rotary table 3 via the bearing box 47 fixed to the bottom of the frame 2 via the bracket 46. A fixed shaft 48 rotates.

As shown in FIG. 4, the plurality of chip component supply means 5 has a paper tape (or plastic tape) 501 for storing both ends of a plurality of chip components (not shown) at equal intervals in the sprocket holes (in the figure) at both ends. (not shown) to the sprocket wheel 502. This sprocket wheel 502 is moved when the tip of a lever 503 connected to the index drive means 8 is pushed down, and the ratchet lever 5
When the paper tape 501 is rotated by the rotation of 04, the paper tape 501 is fed, and the upper tape 505, which is adhered to the paper tape 501 with a certain adhesive force to prevent the chip components from falling off, is attached to the presser plate 506 that presses the paper tape 501 from above. The tip is peeled off from the paper tape 501 and wound onto a reel 507. Therefore, at the tip of the tip of the presser plate 506.

The chip component stored in the paper tape 501 is now in a state where it can be taken out by the chip component mounting means 7. Thereafter, when the sprocket wheel 502 rotates at a constant pitch, the tip of the fixed pawl 508 engages and stops rotating. Note that, as shown in FIG.
It is swingably supported via a pin 510 by a bracket 509 fixed to the bracket 509 and abuts against the lower end of the bracket 509 . This lever 511 is connected at its upper end via a bar 512 and a flexible joint 513 to a lever 514 as shown in FIG. A cam follower 516 that can be pushed down is fixed to the end.

Therefore, when the chip component supply means 5 reaches the uppermost position, the lever 503 is automatically moved downward by the rotation of the cam 515 supported by the camshaft 814 of the synchronous drive means 8, and the chip component supply means 5 is transferred to the chip component mounting means. When the lever 50 is rotated from the uppermost position as the rotary table 3 rotates, the lever 50
Even if the lever 503 is disconnected from the lever 511 and the lever 511 moves downward due to the rotation of the cam 515, the lever 503
is no longer working.

The printed circuit board positioning means 6 includes a mouth-shaped base 601 on the central stand 24, two X-direction guide bars 602 having both ends fixed to the base 601, and two X-direction guide bars 602 having both ends rotatably attached to the base 601. An X-direction feed screw (not shown) is supported and rotated by an X-direction DC servo motor 603, and the X-direction feed screw is screwed into the X-direction feed screw via a nut 604, and slides on two X-direction guide bars 602 in the X direction. An X-direction moving table 605 is movably supported, two Y-direction guide bars 606 are fixed at both ends to the X-direction table 605, and two Y-direction guide bars 606 are rotatably supported by the X-direction table 605 in the Y-direction DC. A Y direction feed screw 60g rotated by a servo motor 607 and this Y direction feed screw 60
8 via a nut (not shown), is supported by two Y-direction guide bars 606 so as to be slidable in the Y-direction, and has a printed circuit board 9 removably mounted on its upper surface.
09.

Therefore, the printed circuit board positioning means 6 can move and position the printed circuit board 9 in the X direction between the solid line position and the two-dot chain line position shown in FIG. 1, and also move and position it in the Y direction perpendicular thereto. Therefore, the mounting positions of the chip components that are sequentially mounted on the printed circuit board 9 can be sequentially determined.

The chip component mounting means 7 includes a shaft 701 that is rotatably loosely fitted into the upper stand 23 and connected to the index drive means 8.
Two disks 7 arranged parallel to each other with an interval at the lower end of the
02,703 are fixedly supported. These two discs 7
02,703 has four bushings 7 equally spaced in the circumferential direction.
04 is press-fitted therein, and a nozzle 705 is provided in the center of each of these four bushings 704 so as to be movable in the vertical direction for sucking the chip components of the chip component supplying means 5 at the tip using vacuum air. Each of these nozzles 705 is connected via a spring 706 to a Ron door 08 whose upper flat plate 707 is always pressed upward. Above the two opposing flat plates 707 among these four flat plates 707 is one end of a lever 711 that is swingably supported on the lower surface of the upper table 23 via a bracket 709 and a pin 710. Cam followers 712 are in contact. A lever 714 is connected to the other end of this lever 711 via a flexible joint 713 as shown in FIG.
One end of this lever 714 is connected, and the swinging center of this lever 714 is supported by the upper stand 23, and a cam follower 715 at the other end is connected to two cams 716 supported by a camshaft 814 of the index drive means 8. ing.

Therefore, in the chip component mounting means 7, two cams 716 are rotated by the camshaft 814 of the synchronous drive means 8,
When the cam follower 712 at one end of the lever 711 moves downward, the two opposing rods 708 and the nozzle 7
05 moves downward against the elastic force of the spring 706. Therefore, the nozzle 705 on the side of the chip component supply means 5 located at the uppermost position attracts the chip component at its lower end, and at the same time, the nozzle 705 on the side of the printed circuit board 9 mounts the chip component on the printed circuit board 9.

After that, when one nozzle 705 has completed suctioning the chip component and the other nozzle 705 has completed mounting the chip component onto the printed circuit board 9 and the cam follower 712 moves upward, the rod 708 and the nozzle 705 are moved by the elastic force of the spring 706. to the original upper position.

Next, when the shaft 701 is rotated by the synchronous drive means 8, the two discs 702, 703, the four rods 708, and the nozzle 705 rotate 90', and the other two opposing flood plates 707 are moved as cam followers. 712
The above operations are then repeated, and the chip components are taken out from the chip component supplying means 5 that reaches the uppermost position one by one and mounted on the printed circuit board 9.

The synchronous drive means 8 is supported on the upper stand 23 as shown in FIG. 804 is two pulleys 805,
806 and the input shaft 8 via the timing belt 807
08 and transmits it to the synchronization unit 809. This synchronization unit 809 is connected to the shaft 7 of the chip component mounting means 7.
01 and the output shaft 810 rotates the two pulleys 8.
11, 812 and a timing belt 813, the camshaft 814 is rotated in a constant relationship with the shaft 701. This camshaft 814 is rotatably supported at both ends by two brackets 815, and the three cams 515, 716 rotate the chip component supplying means 5 and the chip component mounting means 7 in a relational manner as described above. When the chip component supply means 5 reaches the uppermost position as the table 3 rotates, the tip of the lever 503 of the chip component supply means 5 is pushed down to transfer the chip components onto the paper tape 5.
01, the chip component is sucked at the lower end of the nozzle 705 of the chip component mounting means 7, and the chip component is mounted on the printed circuit board 9 at the same time.

Since the chip component mounting apparatus 1 according to the present invention is configured as described above, its operation will be explained next.

When the rotary table 3 is rotated by the rotary table drive means 4, the chip component supply means selects and mounts the types of chip components one after another according to the order in which the chip component supply means 5 on the rotary table 3 are sequentially mounted on the printed circuit board 9. 5 to the uppermost position. Furthermore, by making the rotary table 3 rotatable in both forward and reverse directions, the required chip component supply means 5 can be transferred to the uppermost position at the minimum rotation angle.

When the chip component supplying means 5 sequentially reaches the uppermost position in this manner, the index driving means 8 drives the chip components to be peeled off from the paper tape 501 and taken out, and the nozzle 705 of the chip component mounting means 7 At the same time, the chip components are sequentially mounted on the printed circuit board 9 which is waiting at a predetermined position.

After that, when the mounting of the predetermined chip components on the printed circuit board 9 is completed, the printed circuit board 9 is moved by the printed circuit board positioning means 6 to the solid line position to the left with respect to FIG. The printed circuit board 9 is replaced with the printed circuit board 9, and the printed circuit board positioning means 6 moves it to the position indicated by the two-dot chain line in the right direction with respect to FIG.

On the other hand, when the chip component supply means 5 with no chip components reaches the lowest position, the door 21 is opened and the chip component supply means 5 is replaced with a new chip component supply means 5. In the above embodiment, a case has been described in which chip components are supplied by replacing the chip component supply means, but the present invention is not limited to this, and it is also possible to supply only chip components.

〔Effect of the invention〕

Since the present invention is configured as described above, it produces the effects described below.

A plurality of electronic component supply means, electronic component mounting means, and printed circuit board positioning means are vertically arranged three-dimensionally on a rotary table that rotates with an inclined top surface, so that the installation area of the entire device can be extremely small. In addition, the electronic components and printed circuit boards can be replaced on the operating side, making it easy to use.

In addition, since the rotary table rotates in both forward and reverse directions, the chip component supply means for supplying the next electronic component to be mounted can be transferred to the uppermost position in a short time, making it possible to shorten the takt time of the device. Productivity can be improved.

Further, since the printed circuit board positioning means can position the printed circuit board in two horizontal directions perpendicular to each other, the electronic component mounting position on the printed circuit board can be easily and accurately positioned.

In addition, since the electronic component mounting means is provided with a synchronized drive means, the electronic component supplying means that has reached the uppermost position is driven so as to be able to take out the electronic component, and the mounting and dismounting means of the electronic component mounting means takes out the electronic component at the same time. be able to.

The synchronous drive means has a plurality of cams on the same rotating shaft, and one cam drives the electronic component supply means to take out the electronic component when it reaches the uppermost position, and the other cam drives the electronic component mounting means. The electronic component is taken out from the electronic component supplying means that has reached the uppermost position by the mounting means, and is mounted on the printed circuit board, and the mounting means is moved to the electronic component supplying means at the uppermost position by the means that rotates in a constant relationship with the rotation axis. Since the electronic component supplying means and the electronic component mounting means which have reached the uppermost position can be driven in a fixed relationship with a simple configuration, since the electronic component supplying means and the electronic component mounting means are transferred between the printed circuit board and the printed circuit board.

[Brief explanation of the drawing]

FIG. 1 is a side view showing a chip component mounting apparatus which is an embodiment of the present invention, FIG. 2 is a front view of the embodiment, and FIG.
FIG. 4 is an enlarged perspective view of a chip component supply means, and FIG. 5 is a perspective view of a conventional chip component mounting device. 1... Chip component mounting device, 2... Frame, 3...
...Rotary table, 4...Rotary table driving means, 5
... Chip component supply means, 6... Printed board positioning means, 7... Chip component mounting means, 8... Synchronous drive means, 9... Printed board, 10... Chip parts.

Claims (5)

[Claims] 1. A plurality of electronic component supply means are mounted on the upper surface in a radially detachable manner, and the upper surface is rotated with an inclination so that the operation side is at the lowest position and the opposite side is at the uppermost position. A rotary table for replenishing electronic components when the electronic component supplying means that is empty of components reaches the lowest position and taking out the electronic components from the electronic component supplying means that has reached the uppermost position; a printed circuit board positioning means disposed above the position for moving the printed circuit board between a printed circuit board mounting position on the operation side and a position for mounting electronic components on the printed circuit board on the opposite side, and positioning the printed circuit board in both positions; and an electronic component mounting means that is arranged above the electronic component mounting position of the printed circuit board and the electronic component supply means that has reached the uppermost position, and takes out the electronic component from the electronic component supply means and mounts it on the printed circuit board. Parts mounting device. 2. 2. The electronic component mounting apparatus according to claim 1, wherein the rotary table is configured to be able to rotate in both forward and reverse directions. 3. Claim 1: The printed circuit board positioning means is configured to be capable of positioning the printed circuit board in two horizontal directions perpendicular to each other.
The electronic component mounting device described. 4. The electronic component mounting means includes a disk that rotates in a horizontal direction, a mounting/detachment means installed on the disk that takes out the electronic component from the electronic component supplying device that has reached the uppermost position, and mounts it on the printed circuit board, and a 2. The electronic component mounting apparatus according to claim 1, further comprising synchronized drive means for driving the electronic component supply means that has reached the electronic component so that the electronic component can be taken out and for driving the attachment/detachment means in a related manner. 5. The synchronous drive means includes a cam that allows the same rotating shaft to take out electronic components from the electronic component supply means that has reached the uppermost position, and a cam that allows the electronic component supply that has reached the uppermost position to be taken out by the attachment/detachment means included in the electronic component mounting means. A cam that takes out the electronic component from the means and attaches it to the printed circuit board, and rotates in a certain relationship with the rotating shaft, and transports the attachment/detachment means between the electronic component supply means and the printed circuit board that have reached the uppermost position. The electronic component mounting apparatus according to claim 1 or 4, further comprising means.