JPH0131688B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a transportation method, and more particularly to an improvement in a transportation method for a workpiece in an assembly apparatus used for semiconductor assembly.

[Technical background of the invention]

Conventionally, the production method for semiconductor assembly equipment was a group management method for single devices, but in order to improve device performance and production efficiency, it has been improved to create a line that connects processes before and after. It's coming. In this case, based on the production throughput of the line for the previous and subsequent processes (equipment), this process is divided into parts using multiple processing devices to match the previous and subsequent processes, and the processing of the workpiece is The conveyance system had a two-line configuration, each with a dedicated supply line and a discharge line.

Next, the above description will be explained with reference to FIG. 1, taking as an example a line configuration of a die bonding device and a wire bonding device. In the figure, 1 is a die bonder, 2a, 2b, . . . are wire bonders, and 3 is a molding device. These are connected by two independent lines of conveying devices: a supply-only conveying device 4 and a discharge-only conveying device 5. ing.

[Problems with background technology]

According to the technology described above, the configuration is complicated because the supply line and the discharge line are each independent of the conveyance system, and there is a space constraint, and the equipment group is easy to repair, maintain, remove, update, etc. Not, but
There are also serious problems such as changes in the type of workpiece, etc., which are difficult in terms of workability, and the operating rate is significantly reduced.

[Purpose of the invention]

The present invention has been made in view of the above-mentioned conventional problems, and provides a conveyance system that provides productivity flexibility in line configuration, improves workability, and is simple and requires a minimum amount of space.

[Summary of the invention]

The conveyance system according to the present invention includes a feed/discharge mechanism for workpieces that feeds and discharges workpieces in conjunction with an assembly device, a buffer mechanism that temporarily stores workpieces before and after processing, and timing for supply and discharge. It is equipped with a control unit that controls the workpieces to be fed and discharged all at once at a predetermined timing without placing any restrictions on the supply of workpieces, minimizing the time required for discharge. The feature is that the workpieces are shared and conveyed in one line.

[Embodiments of the invention]

Hereinafter, one embodiment of the present invention will be explained in detail with reference to the drawings. As shown in FIG. 1 showing one embodiment, a plurality of wire bonders 2a, 2b... are connected and inserted in parallel between the die bonder 1 and the molding device 3 to form a line, and further as shown in FIG. The wire bonder is connected to the die bonder at the front stage and the molding device at the rear stage by a single-row conveyor device 10, and this conveyor device is also connected to the wire bonder for supplying and discharging the workpieces provided in each wire bonder. It is equipped with a device 11 (11a, 11b), and is independently constructed by support columns 12a, 12b. Next, a control device 13 is provided which performs timing control of supply and discharge of the conveyance device and a series of controls between connected devices. Further, details of the supply/discharge device in the wire bonder will be explained with reference to FIG. In the figure, reference numeral 14 denotes a feed guide device, along which a feed belt 15 is installed, and a motor 1
6. At the supply position A, an opening/closing stopper 18 for positioning the lead frame 17 to be processed such as wire bonding and a supply position confirmation sensor 19 are arranged, and 20 indicates the lead frame transferred by the supply device. It is a confirmation sensor for buffer position B, and also,
21 is a conveyor belt that transports the lead frame to the pitch feed position C of the wire bonder, 22 is a pitch feed device of the wire bonder, 23 is a bonding head, and 24 is a conveyor belt that transports the lead frame from the pitch completion position D to the discharge standby point E through the bonding process. 25 is a discharge standby point confirmation sensor, and 26 is a discharge position F confirmation sensor transferred by the discharge device and returned to the transfer device. Therefore, at the positions indicated by B and E, one or more of the corresponding lead frames for supply/discharge can be stored as a buffer.

Next, the operation of this device will be explained with reference to FIGS. 2 and 3. First, when the sensor 20 at the supply buffer position B runs out of lead frames, a lead frame request signal is output to the die bonder 1. Thereby, the lead frame is transferred to the requested wire bonder by the feed belt 15 of the transfer device. At the same time, the opening/closing stopper 18 of the corresponding supply section protrudes, the supply position confirmation sensor 19 senses this, the supply device transfers it to the lead frame position B at the supply buffer position, and the supply operation is completed when the buffer position confirmation sensor 20 detects it. .

After the completion of the above operation, the next request signal is sequentially supplied. On the other hand, when the wire-bonded lead frame is detected by the confirmation sensor 25 at the discharge standby point E, the discharge device moves the conveyor to the discharge position in synchronization with the discharge interval clock T (FIG. 4) generated by the control device 13. F, and is transferred to the molding device 3 by the conveying device 10. This discharge operation is performed by wire bonder 2.
The same clock is used for the number of connected devices a, 2b, etc., and if the condition allows the clock to be discharged, the same clock is used for the number of connected devices. At this time, if the lead frame to be supplied to the conveyance device 10 is being transferred, the discharge operation is started after the completion of the supply operation, and the control is controlled so that the discharge operation and the supply start of the next frame are permitted at the same time. (Figure 4). Here, the discharge interval clock T is a variable determined by the conveyance speed, the number of connected wire bonders, the buffer capacity of the supply/discharge section, and the average processing time per frame of the wire bonder. If the average processing time per sheet is (t _w ) and the maximum supply time is (t _c4 ), then if the ejection interval clock T is generated at a cycle of (t _w - t _c4 ), the lead frames to be ejected will be delayed. It can be processed without any problems.

As is clear from the above, when the number of wire bonders that are normally connected is n, the frequency of supply and discharge occurs on average at intervals of t _w /2 overlap, etc., which places restrictions on the supply operation.

〔Effect of the invention〕

According to this invention, since the discharging operation is performed all at once at regular intervals, the control method minimizes the exclusive time for discharging and does not impose any restrictions on the supply operation. Secondly, supply frames and discharge frames can be managed in groups without mixing, there is no need to control the interval between discharge frames (overlapping prevention), and the single-row configuration is simple and requires minimal space. This has the effect of increasing flexibility such as improving performance and updating equipment. In this method, the conveyance method is shown as having an independent structure, but the present invention is not limited to the embodiment, and the same effect can be obtained even if the conveyance method is built into the wire bonding apparatus as a conveyance unit and connected to the wire bonding apparatus.

[Brief explanation of drawings]

Fig. 1 is a block diagram showing a conventional conveyance system, Fig. 2 is a block diagram showing a conveyance system of one embodiment, Fig. 3 is a block diagram showing some details of Fig. 2, and Fig. 4 is a time block diagram. It is a diagram showing a chart. DESCRIPTION OF SYMBOLS 1...Die bonder, 2a, 2b...Wire bonder, 3...Mold device, 10...Transfer device, 11 (11a, 11b...)...Supply/discharge device, 13...Control device, 14...Feed guide Device,
15...Feeding belt, 18...Opening/closing stopper, 1
9... Supply position (A) confirmation sensor, 20... Buffer position (B) confirmation sensor, 21... Conveyor belt, 22...
...Pitch feeding device, 24...Transfer belt, 25...
...Discharge standby point (E) confirmation sensor, 26... Discharge position (F)
Confirmation sensor.

Claims (1)

[Claims] 1 A workpiece supply/discharge mechanism that feeds and discharges workpieces in conjunction with the assembly device, a buffer mechanism that temporarily stores workpieces before and after processing, and a control unit that controls the timing of supply and discharge. Prepare,
The workpieces to be fed are discharged all at once at a predetermined timing without any restrictions, minimizing the time required for discharge, and the workpieces to be supplied and discharged can be fed and discharged in one line. A transportation method characterized by shared transportation.