JPH01318251A - Semiconductor device and assembling method thereof - Google Patents

Abstract

PURPOSE:To reduce the thermal resistance between a semiconductor chip and a heat sink, assure good radiating characteristics, and increase the number of accomodated terminals by joining a semiconductor chip directly with a heat sink, inserting said semiconductor chip from the upper portion into a package, and mounting the same by means of face down bonding. CONSTITUTION:A semiconductor chip 2 is inserted into a cavity 1a from the upper portion of a package 1, and an outer frame 3c of a mount frame 3 is hermetically joined with the upper surface of the package 1 by eutectic bonding. Then, a bonding head of a bonding device is inserted from a space 3b-1 between arms 3b, and all outer leads 4a-2 of a tab frame 4 are simultaneously connected to an internal terminal 1b by compression bonding. The upper surface of the mount frame 3 is covered with a sealing cap 5, and the package 1 is hermetically sealed by eutectic bonding. Hereby, radiating properties can satisfactorily maintained, the number of accomodated terminals can be increased, and wiring length can be shortened. Thus, miniature and high density mounting can be realized and an integrated circuit can be made a high speed.

Description

[Detailed Description of the Invention] [Summary] Regarding a semiconductor device and its assembly method, the purpose is to increase the number of external connection terminals accommodated while having good heat dissipation characteristics. a mounting frame having an island for bonding a semiconductor chip connected to an outer frame by a plurality of arms in the center and having a space between the arms;
It consists of a tab frame that connects the electrodes of the semiconductor chip and the internal terminals, and a seal cap that hermetically seals the space between the arms, and the semiconductor chip connected to the inner lead part of the tab frame is mounted on the mounting frame. The outer frame of the mounting frame is hermetically sealed to the top surface of the package by inserting it into the pan cage. 2. After inserting the bonding head from the space between the arms and bonding the outer lead part of the tab frame to the internal terminal, The mounting frame is covered with a cap to airtightly seal the space between the arms.

[Industrial application field]

The present invention relates to a semiconductor device and a method for assembling the same.

2. Description of the Related Art With the recent demands for higher speed and smaller size of electronic devices, there is an increasing demand for higher integration of semiconductor devices constituting electronic circuits, and more and more highly integrated semiconductor devices are being used.

Therefore, in addition to improving the heat dissipation of the semiconductor device itself,
There is a need to reduce the size of the package that accommodates the semiconductor chip, and to increase the number of packages that can be accommodated by densely arranging the inner and outer terminals of the package that are connected to the electrodes of the semiconductor device knob, and a semiconductor device that satisfies this demand. There is a need for a method for assembling the same.

[Conventional technology]

In the prior art, when assembling the semiconductor chip 12 into the package 11, there are face-up and face-down configurations.

As shown in the side cross-sectional view of FIG. 5, the face-up configuration includes a cavity of a package 11 having an internal terminal 11b on the bottom surface 11a-1 connected to an external terminal C on the bottom outer surface lid (the connection path is as shown in the figure). After inserting the semiconductor chip 12 into the lla with the electrode 12a side facing upward and bonding it to the bottom surface 11a-1, and bonding the electrode 12a of the semiconductor chip 12 and the internal terminals 1b with wires 14,
It is hermetically sealed with a seal cap 15.

In the face-down configuration, as shown in the side view of FIG. 6, the semiconductor chip 22 bonded to the heat sink 23 is placed in the cavity 21 of the package 21 with the electrode 22a side facing downward.
Insert the central part of the package 21 into the hollowed-out through hole 21a-1, bond the heat sink 23 to the top surface of the package 21, and connect the electrode 22a of the semiconductor chip 22 and the external terminal 21 on the bottom outer surface.
internal terminal 21b connected to c (the connection path is as shown)
After bonding with wire 24, package 2]
Airtightly seal the bottom surface with a seal and top 25.

[Problem to be solved by the invention]

However, according to the above-mentioned mounting structure, in the face-up case, the semiconductor chip is bonded to the bottom of the package, so the heat dissipation characteristics from the top of the package are poor. It has the advantage of being able to increase the number of terminals because it can provide terminals, and on the other hand, in the case of face-down, it has the advantage of providing good heat dissipation characteristics by bringing auxiliary heat dissipation fins, cooling jackets, etc. into contact with the heat dissipation plate. Since the seal cap occupies most of the center of the bottom surface of the package, there is a limit to the number of external terminals, and there are also problems in that the length of the bonding wire becomes long.

In view of the above-mentioned problems, an object of the present invention is to provide a semiconductor device that combines the above-mentioned advantages, has good heat dissipation characteristics, and can increase the number of terminals accommodated, and a method for assembling the same.

[Failure to solve the problem]

In order to achieve the above object, the half-quad chip mounting structure of the present invention6. 2, a package having an internal terminal on the bottom surface, an external terminal connected to the internal terminal on the bottom outer surface, and an island F for bonding the semiconductor chip;
a mounting frame which is connected to an outer frame by a plurality of arms at the center and has a space between the arms; a tab frame which connects the electrodes of the semiconductor chip and the internal terminal; and a space between the arms which is hermetically sealed. a seal cap, a semiconductor chip connected to the inner lead portion of the tab frame is bonded to the mounting frame, and the semiconductor chip is inserted into the package and the outer frame of the mounting frame is hermetically sealed to the top surface of the package;
After inserting the bonding head from the space between the arms and joining the outer lead part of the tab frame to the internal terminal,
The seal cap is configured to cover the mounting frame and hermetically seal the space between the arms.

[Effect]

By bonding the semiconductor chip directly to the heat sink, inserting it into the package from the top, and mounting it face down, the thermal resistance between the semiconductor chip and the heat sink is reduced, and the heat dissipation area is increased by bringing the auxiliary heat sink into contact with the heat sink. can be expanded.

Furthermore, since there is no seal cap on the bottom surface of the pancage, the entire surface can be used to provide external terminals, and the distance to the electrodes of the semiconductor chip can be shortened.

〔Example〕

The gist of the present invention will be explained in detail below based on embodiments shown in the drawings.

As shown in the side sectional view of FIG. 1, the semiconductor device includes a package 1, a mounting frame 3 to which a semiconductor chip 2 is bonded,
It is composed of a tab frame 4 and a seal cap 5.

The package 1 is made of a ceramic rectangular parallelepiped, as shown in FIG.
a, and an external terminal IC1, that is, a lead, which is connected to the internal terminal 1b on the bottom outer surface 1d (the connection path is shown), and the upper surface of the package 1 is metalized (the path shown) for eutectic bonding.

The mounting frame 3 is made of metal or ceramic, as shown in the plan view of FIG. Frame 3C
space 3b-1(
A hole (shown with diagonal lines) is formed. Note that if the mounting frame is made of ceramic, the joint surfaces are metalized.

As shown in the plan view of FIG. 3, the tab frame 4 includes a lead frame 4a that connects the electrodes (pads) 2a of the semiconductor chip 2 and the internal terminals 1b of the package 1 on a tape film 4b made of polyimide resin. Therefore, the tape film 4h of the inner lead part 4a-1 and the outer lead part 4a-2 of this lead frame 4a is removed so that the connecting part thereof can be connected.

The seal cap 5 is made of metal, as shown in the plan view of FIG. part), and the mounting frame 3
The upper surface is covered to airtightly seal the space 3b-1 between the arms 3b.

As shown in FIG. 1, the method for assembling the semiconductor device is to first bond the semiconductor chip 2 with the opposite surface of the electrode 2a to the inside of the island 3a of the mounting frame 3 by, for example, eutectic bonding. The inner lead portion 4a-1 of the tab frame 4 is connected to the tab frame 4 by, for example, pressure bonding. Alternatively, first turn the tab frame 4 on.
The semiconductor chip 2 may be joined to the mounting frame 3 after being connected to the mounting frame 3.

Next, this semiconductor chip 2 is inserted into the cavity 1a from the upper part of the package 1, and the outer frame 3c of the mounting frame 3 is hermetically bonded to the upper surface of the package 1 by, for example, eutectic bonding. Note that this tab frame 4 is positioned using an optical device (path shown) so as to face the internal terminal 1b at the time of connecting to the electrode 2a of the semiconductor chip 2 and at the time of bonding the mounting frame 3 to the upper surface of the package l. .

Next, a bonding head (as shown) of a bonding device is inserted into the space 3b-1 between the arms 3b to simultaneously connect all the outer leads 4a-2 of the tab frame 4 to the internal terminals 1b by, for example, crimp bonding. Positioning is performed using an optical device (path shown).

Finally, the upper surface of the mounting frame 3 is covered with the seal cap 5, and the package 1 is hermetically sealed together with the space 3b-1 between the arms 3b by, for example, eutectic bonding, thereby completing the package.

The auxiliary heat radiator 6 shown by the two-dot chain line in Figure 1 is connected to the mounting frame 3 in order to improve heat radiation characteristics, and the heat radiation area is It is an extension of

By assembling the semiconductor chip in a face-down configuration using a mounting frame with a space for bonding and bonding the back of the semiconductor chip directly to the inner surface of the mounting frame, thermal resistance is kept low and heat conduction is maintained extremely well, and heat dissipation characteristics are improved. In addition, the number of external terminals accommodated on the bottom surface of the package can be increased, and the length of wiring inside the package can be further shortened.

Note that the external terminals shown in FIG. 1 in the above description are lead pins that can be inserted and connected, but when surface mounting on a printed circuit board or the like, the external terminals may be formed into bumps.

〔Effect of the invention〕

As described in detail above, according to the present invention, it is possible to maintain good heat dissipation characteristics as in the past, and also to increase the number of terminals accommodated and shorten the wiring length. This has extremely useful effects in industry, such as increasing the speed of circuits.

[Brief explanation of the drawing]

FIG. 1 is a side sectional view of an embodiment of the present invention, FIG. 2 is a plan view of the mounting frame shown in FIG. 1, FIG. 3 is a plan view of the seal camp shown in FIG. 1, and FIG. 4 is a plan view of the seal camp shown in FIG. FIG. 5 is a side sectional view of a face-up configuration according to the prior art, and FIG. 6 is a side sectional view of a face-down configuration according to the prior art. In the figure, 1 is the package, 1a is the cavity, 1b is the internal terminal (land), 1c is the external terminal (lead), 2 is the semiconductor chip, 2a is the electrode (pad), 3 is the mounting frame, 3a is the island, and 3b is the Arm, 3b-1 is a space (hole), 3c is an outer frame 4 is a tab frame, 4a is a lead frame, 4a-1 is an inner lead part, 4a-2 is an outer lead part, 4b is a tape film, 5 is a seal cap, 5a is an escape hole, and 6 is an auxiliary heat radiator. Loading frame 3 Plan view of the mounting frame shown in Figure 1 Plan view of the seal cap shown in Figure 1 Figure 2 Figure 3

Claims (1)

[Claims] [1] A cavity (1) having an internal terminal (1b) on the bottom surface.
a) and an external terminal (1c) connected to the internal terminal (1b).
) on the bottom outer surface, and an island (3a) for bonding a semiconductor chip (2) to an outer frame (3c) with a plurality of arms (3b) in the center, and the arms (3b)
a mounting frame (3) having a space (3b-1) therebetween;
The electrode (2a) of the semiconductor chip (2) and the internal terminal (1)
b) and a seal cap (5) that hermetically seals the space (3b-1) between the arms.
) A semiconductor device comprising: [2] Inner lead part (4a) of the tab frame (4)
-1) is connected to the mounting frame (3), and the semiconductor chip (2) is inserted into the package (1) and the outer frame (3c) of the mounting frame (3) is attached to the top surface of the package (1). After sealing and inserting the bonding head from the space (3b-1) between the arms and bonding the outer lead part (4a-2) of the tab frame (4) to the internal terminal (1b), the seal cap (5) is sealed. 2. The assembly method according to claim 1, wherein the space (3b-1) between the arms is hermetically sealed by covering the mounting frame (3) with the mounting frame (3).