JPH0133886B2 - - Google Patents

Info

Publication number
JPH0133886B2
JPH0133886B2 JP55159056A JP15905680A JPH0133886B2 JP H0133886 B2 JPH0133886 B2 JP H0133886B2 JP 55159056 A JP55159056 A JP 55159056A JP 15905680 A JP15905680 A JP 15905680A JP H0133886 B2 JPH0133886 B2 JP H0133886B2
Authority
JP
Japan
Prior art keywords
mold
transmission member
optical transmission
melting point
optical fiber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55159056A
Other languages
Japanese (ja)
Other versions
JPS5781212A (en
Inventor
Kyoshi Hani
Shigeru Kubota
Norimoto Moriwaki
Shohei Eto
Osamu Fujisawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP55159056A priority Critical patent/JPS5781212A/en
Publication of JPS5781212A publication Critical patent/JPS5781212A/en
Publication of JPH0133886B2 publication Critical patent/JPH0133886B2/ja
Granted legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/02Optical fibres with cladding with or without a coating
    • G02B6/02033Core or cladding made from organic material, e.g. polymeric material

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Fibers, Optical Fiber Cores, And Optical Fiber Bundles (AREA)
  • Organic Insulating Materials (AREA)
  • Insulating Bodies (AREA)
  • Light Guides In General And Applications Therefor (AREA)

Description

【発明の詳細な説明】 [産業上の利用分野] 本発明は、もろくてこわれやすい光伝送部材に
任意の形状の絶縁被覆処理を施す方法に関する。
DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a method for applying an arbitrary shape of insulation coating to a fragile and fragile optical transmission member.

[従来の技術・発明が解決しようとする課題] 最近、光フアイバー、フオトダイオードなどの
応用範囲は、増加の一途をたどり、各種電気機器
あるいは装置への応用が行なわれている。たとえ
ば光フアイバーの高圧電気機器への一応用例とし
て、電気機器本体が、セラミツクまたは樹脂碍子
などで絶縁された架台の上部に設置される電力用
コンデンサーなどの故障検出装置への応用があ
る。
[Prior Art/Problems to be Solved by the Invention] Recently, the range of applications of optical fibers, photodiodes, etc. has been increasing steadily, and they are being applied to various electrical appliances and devices. For example, one example of the application of optical fiber to high-voltage electrical equipment is its application to failure detection devices such as power capacitors, in which the electrical equipment itself is installed on top of a stand insulated with ceramic or resin insulators.

前記応用例を第1図に基づき具体的に説明す
る。
The application example will be specifically explained based on FIG. 1.

第1図において1は電力用コンデンサなどの絶
縁架台を使用した電気機器本体、3は絶縁用碍
子、4,5は絶縁架台のそれぞれ上枠、下枠、6
は電気機器本体1の異常発生を電気的に検出し、
その信号を光信号に変換する機能を有する保護装
置発生部、7はその信号を受け電気接点を動作さ
せる保護装置受光部、8は上記6,7間を連結す
る光伝送部材(以下、光フアイバーコードとい
う)である。
In Fig. 1, 1 is the main body of electrical equipment using an insulating stand such as a power capacitor, 3 is an insulator, 4 and 5 are the upper and lower frames of the insulating stand, and 6
electrically detects the occurrence of an abnormality in the electrical equipment main body 1,
7 is a protection device generating section that has the function of converting the signal into an optical signal, 7 is a protection device light receiving section that receives the signal and operates an electrical contact, and 8 is an optical transmission member (hereinafter referred to as an optical fiber) that connects the above 6 and 7. (referred to as a code).

通常、光フアイバーコード8はポリエチレンな
どのフレキシブルな有機材料で被覆された円柱状
のコードであり、たとえばヒダ状の絶縁被覆を施
して沿面耐電圧を考慮したコードなどは全く市販
されていないのが現状である。また、ヒダ状のよ
うに凹凸のある被覆を施すばあい、押出成形など
による連続生産はほとんど不可能である。
Normally, the optical fiber bar code 8 is a cylindrical code coated with a flexible organic material such as polyethylene. For example, there are no commercially available cords with a pleated insulation coating that takes into account the creepage withstand voltage. This is the current situation. Furthermore, if a coating is applied that has irregularities such as pleats, continuous production by extrusion molding or the like is almost impossible.

しかし、前述したような高圧電気機器に光フア
イバーコード8を適応したばあい、光フアイバー
コードの両端間には絶えず対地電圧が印加される
ため、被覆表面の汚損劣化あるいは降雨時の沿面
絶縁破壊などから保護するために、第2図に示し
たような絶縁処理が施され、使用されているのが
実情である。
However, when the optical fiber barcode 8 is applied to high-voltage electrical equipment as described above, ground voltage is constantly applied between both ends of the optical fiber barcode, resulting in contamination and deterioration of the coating surface or creeping insulation breakdown during rain. In reality, in order to protect the device from damage, it is used with an insulation treatment as shown in FIG.

なお、第2図において、3は貫通穴を有するセ
ラミツクスまたは樹脂碍子、8は碍子3を貫通す
る光フアイバーコード、9はコロナ防止または防
水のため注入された樹脂である。
In FIG. 2, 3 is a ceramic or resin insulator having a through hole, 8 is an optical fiber cord that passes through the insulator 3, and 9 is a resin injected for corona prevention or waterproofing.

第2図のような絶縁処理が施された光フアイバ
ーコード8では、光フアイバーコード8の長さや
径に応じた碍子がその都度必要になり、とくにセ
ラミツク碍子のばあい、地震やその他の振動によ
つてクラツクが生じ易いため、充分な防振対策が
必要である。
For optical fiber barcodes 8 that have been insulated as shown in Figure 2, an insulator is required depending on the length and diameter of the optical fiber barcode 8. Particularly in the case of ceramic insulators, it is difficult to resist earthquakes and other vibrations. As a result, cracks are likely to occur, so sufficient anti-vibration measures are required.

また、光フアイバーコード8を挿入したのち、
碍子貫通穴のエアーギヤツプを埋めることおよび
防水を目的とした樹脂の注入が必要である。
Also, after inserting the optical fiber barcode 8,
It is necessary to fill the air gap in the insulator through hole and inject resin for waterproofing purposes.

上述のような従来の光伝送部材の絶縁被覆方法
では製作期間が長くなり、コストも高く、防水も
充分とは言えない。さらに、接続には常に重量物
である碍子がついてまわることになり、電気機器
などの組立時の作業性を著しく低下させるうえ、
光フアイバーコードを曲がつた状態で接続するこ
とも不可能であつた。
The conventional insulating coating method for optical transmission members as described above takes a long time to manufacture, is expensive, and is not sufficiently waterproof. Furthermore, a heavy insulator is always attached to the connection, which significantly reduces work efficiency when assembling electrical equipment, etc.
It was also impossible to connect the optical fiber barcode in a bent state.

[課題を解決するための手段] 本発明は上記問題を解決するためになされたも
のであり、 (a) 融点40〜130℃のポリヒドロキシブタジエン
重合体の水素添加物および一般式(): (式中、R1、R2およびR3は同じか異なり、そ
れぞれ炭素原子数1〜3個のアルキル基、nは
1〜4の整数を示す)で示されるイソシアネー
ト化合物または (b) 融点40〜100℃で分子内に2個以上のエポキ
シ基を有するエポキシ樹脂および三沸化硼素の
変性アミン からなる作業温度で固形の熱硬化性樹脂組成物
(以下、(a)または(b)の熱硬化性樹脂組成物という)
が真空脱泡され、予め所定形状にプリフオームさ
れたのち光伝送部材と金型に収容され、低圧で加
熱成形されることを特徴とする光伝送部材の絶縁
被覆方法 に関する。
[Means for Solving the Problems] The present invention has been made to solve the above problems, and includes (a) a hydrogenated product of a polyhydroxybutadiene polymer having a melting point of 40 to 130°C and the general formula (): (In the formula, R 1 , R 2 and R 3 are the same or different, each is an alkyl group having 1 to 3 carbon atoms, and n is an integer of 1 to 4) or (b) melting point 40 A thermosetting resin composition (hereinafter referred to as (a) or (b) thermal (referred to as curable resin composition)
The present invention relates to an insulating coating method for an optical transmission member, characterized in that the optical transmission member is vacuum degassed, preformed into a predetermined shape, placed in a mold together with the optical transmission member, and heated and molded at low pressure.

本発明の方法は前記欠点が一掃された新規な簡
易モールド法であり、本発明の方法によると、た
とえば光伝送路を高圧電気機器に組込むなどの際
に、極めて簡便で、かつ信頼性が高くなる。
The method of the present invention is a new simple molding method that eliminates the above-mentioned drawbacks. According to the method of the present invention, it is extremely simple and highly reliable when, for example, incorporating an optical transmission line into high-voltage electrical equipment. Become.

[実施例] 本発明の一実施例を第3図、第4図に基づき説
明する。
[Example] An example of the present invention will be described based on FIGS. 3 and 4.

第3図はプリフオームされた成形材料をうるた
めの製造装置の一例をあげたものであり、10は
通常の真空撹拌装置、11は絶縁被覆に用いる(a)
または(b)の熱硬化性樹脂組成物である。12はプ
リフオームのための金型であるが、離型性のすぐ
れたプラスチツクケースなどを用いることもでき
る。真空撹拌装置10で融点以上の温度で充分真
空脱泡せしめられた熱硬化性樹脂組成物は金型1
2に注入されたのち室温まで冷却せしめられ、金
型から取りはずされ、プリフオームされた成形物
13がえられる。成形物13の製造に用いる熱硬
化性樹脂組成物は作業温度で固形であり、望まし
くは室温または低温(0℃以下を示す)で保持す
ることにより、たとえば1カ月以上の可使時間
(融点付近への加熱によつて流動し、普通に使用
可能なこと)を有する。
Figure 3 shows an example of a manufacturing device for obtaining a preformed molding material, in which 10 is a normal vacuum stirring device, and 11 is a device used for insulation coating (a).
Or the thermosetting resin composition (b). Reference numeral 12 denotes a mold for the preform, but a plastic case or the like with excellent mold releasability may also be used. The thermosetting resin composition, which has been sufficiently vacuum degassed at a temperature above the melting point using the vacuum stirring device 10, is placed in the mold 1.
After being injected into the mold 2, it is cooled to room temperature and removed from the mold to obtain a preformed molded product 13. The thermosetting resin composition used for manufacturing the molded article 13 is solid at working temperature, and is preferably maintained at room temperature or low temperature (below 0°C) to maintain a pot life of, for example, one month or more (near the melting point). It has the ability to flow when heated and can be used normally).

前記熱硬化性樹脂組成物の具体例としては、融
点が40〜130℃のポリヒドロキシブタジエン重合
体の水素添加物よりなる主剤と一般式(): (式中、R1、R2およびR3は同じか異なり、それ
ぞれ炭素数1〜3個のアルキル基、nは1〜4の
整数を示す)で示されるイソシアネート化合物か
らなる硬化剤との混合物、または融点が40〜100
℃で分子内に2個以上のエポキシ基を有するエポ
キシ樹脂からなる主剤と三沸化硼素の変性アミン
からなる硬化剤との混合物があげられる。
A specific example of the thermosetting resin composition includes a main ingredient made of a hydrogenated polyhydroxybutadiene polymer having a melting point of 40 to 130°C, and a general formula (): (In the formula, R 1 , R 2 and R 3 are the same or different, each is an alkyl group having 1 to 3 carbon atoms, and n is an integer of 1 to 4) with a curing agent consisting of an isocyanate compound. , or melting point 40-100
C. and a mixture of a main agent made of an epoxy resin having two or more epoxy groups in the molecule and a curing agent made of a modified amine of boron trifluoride.

本発明に用いられる主剤の1つである分子内に
2個以上のエポキシ基を有するエポキシ樹脂とし
ては、たとえばエピコート1001(シエル社製)、
GY6071(チバ社製)などがあげられ、さらにエ
ピコート828、エピコート1004、エピコート1007
(いずれもシエル社製)、DER438、DER431(いず
れもダウ社製)などを用いて融点を60〜90℃に調
節したエポキシ樹脂などがあげられる。
Examples of the epoxy resin having two or more epoxy groups in the molecule, which is one of the main ingredients used in the present invention, include Epicote 1001 (manufactured by Ciel Corporation),
Examples include GY6071 (manufactured by Ciba), as well as Epicote 828, Epicote 1004, and Epicote 1007.
Examples include epoxy resins whose melting points are adjusted to 60 to 90°C using DER438, DER431 (all manufactured by Dow), etc. (all manufactured by Ciel).

本発明において硬化剤として用いられる一般式
()で示されるイソシアネート化合物としては、
たとえば3−イソシアネートメチル−3,5,5
−トリメチルシクロヘキシルイソシアネート、3
−イソシアネートエチル3,5,5−トリメチル
シクロヘキシルイソシアネート、3−イソシアネ
ートプロピル−3,5,5−トリエチルシクロヘ
キシルイソシアネートなどがあげられる。また、
三沸化硼素の変形アミンブロツク錯塩としては、
たとてばアンカー1170、アンカー1171、アンカー
1040、アンカー1222(いずれもアンカーケミカル
社製)などがあげられる。
The isocyanate compound represented by the general formula () used as a curing agent in the present invention includes:
For example, 3-isocyanatomethyl-3,5,5
-trimethylcyclohexyl isocyanate, 3
-isocyanate ethyl 3,5,5-trimethylcyclohexyl isocyanate, 3-isocyanate propyl-3,5,5-triethylcyclohexyl isocyanate, and the like. Also,
As a modified amine block complex salt of boron trifluoride,
Tateba Anchor 1170, Anchor 1171, Anchor
Examples include 1040 and Anchor 1222 (both manufactured by Anchor Chemical).

本発明に用いられる熱硬化性樹脂組成物の主剤
である前記ポリヒドロキシブタジエン重合体の水
素添加物およびエポキシ樹脂はいずれも熱硬化性
樹脂であり、該ポリヒドロキシブタジエン重合体
の水素添加物と硬化剤である一般式()で示さ
れるイソシアネート化合物との比率は、主剤に存
在する水酸基と硬化剤に存在するイソシアネート
基との割合がNCO/OH=0.8〜1.2であるのが好
ましい。また主剤であるエポキシ樹脂と硬化剤で
ある三沸化硼素の変形アミンブロツク錯塩との比
率は、エポキシ樹脂と硬化剤とが当量比で1/1
になるのが好ましい。
The hydrogenated product of the polyhydroxybutadiene polymer and the epoxy resin, which are the main ingredients of the thermosetting resin composition used in the present invention, are both thermosetting resins, and the hydrogenated product and the epoxy resin of the polyhydroxybutadiene polymer are cured. The ratio of the isocyanate compound represented by the general formula () which is the agent is preferably such that the ratio of the hydroxyl groups present in the main agent to the isocyanate groups present in the curing agent is NCO/OH = 0.8 to 1.2. In addition, the ratio of the epoxy resin as the main ingredient to the modified amine block complex salt of boron trifluoride as the curing agent is such that the equivalent ratio of the epoxy resin to the curing agent is 1/1.
It is preferable to become

前記熱硬化性樹脂は、融点が前記範囲内にあ
り、主剤と硬化剤よりなる成形材料である熱硬化
性樹脂組成物が室温または0℃以下の低温で保存
することにより、1カ月以上の可使時間を有する
ものである。
The thermosetting resin has a melting point within the above range, and the thermosetting resin composition, which is a molding material consisting of a base resin and a curing agent, can be stored for one month or more at room temperature or at a low temperature below 0°C. It has a usage time.

本発明に用いるポリヒドロキシブタジエン重合
体の水素添加物およびエポキシ樹脂の融点が40℃
より低いばあいには、常温で流動しやすく、プリ
フオームされた形状を保つことができない。また
粘着性を有するため、作業性が著しく低下する。
一方、ポリヒドロキシブタジエン重合体の水素添
加物で130℃、エポキシ樹脂で100℃より高いとき
には成形時の溶融温度が高温となるため、溶融中
にゲル化反応が起こり、樹脂欠落部やボイドが残
るなどの外観不良が生じるため、いずれも好まし
くない。
The melting point of the hydrogenated polyhydroxybutadiene polymer and epoxy resin used in the present invention is 40°C
If the temperature is lower, it will flow easily at room temperature and will not be able to maintain its preformed shape. Moreover, since it has adhesive properties, workability is significantly reduced.
On the other hand, when the temperature is higher than 130℃ for hydrogenated polyhydroxybutadiene polymers and 100℃ for epoxy resins, the melting temperature during molding becomes high, so a gelation reaction occurs during melting, leaving resin missing parts and voids. Both are unfavorable because they cause poor appearance.

本発明におけるプリフオームされた成形物は光
伝送部材の所望部分(一部または全部)を覆うよ
うに金型内部に配置されて加熱硬化せしめられ
る。また加熱硬化の際、内部にボイドが生じない
ように、プリフオームされた成形物と光伝送部材
の容積の和を金型の中空部の容積と等しいかまた
は大きくすることが好ましい。
The preformed molded product of the present invention is placed inside a mold so as to cover a desired portion (part or all) of the light transmission member, and is heated and hardened. Further, during heat curing, it is preferable that the sum of the volumes of the preformed molded product and the light transmission member be equal to or larger than the volume of the hollow part of the mold so that voids are not generated inside.

金型は光伝送部材を被覆するためのプリフオー
ムされた成形物をその内部に配置して加熱しさえ
すればよいので、その構造は比較的簡単なもので
充分である。また、プリフオームされた成形物は
前述したように真空脱泡されているためボイドの
混入を防止することができる。
A relatively simple structure is sufficient for the mold, since it is sufficient to place a preformed molded product for covering the light transmission member inside the mold and heat it. Further, since the preformed molded product is vacuum degassed as described above, inclusion of voids can be prevented.

次に本発明の上記一実施例に用いた2つに分割
しうる簡易金型の一部断面図を第4図に示す。
Next, FIG. 4 shows a partial cross-sectional view of a simple mold that can be divided into two parts used in the above embodiment of the present invention.

図中、14aは上金型の本体であり、14bは
下金型の本体である。いずれも図示していないが
加熱装置を備えている。15は型締を行なう締
具、16は光フアイバーコードを固定する締具を
示し、18は熱硬化性樹脂組成物を示す。
In the figure, 14a is the main body of the upper mold, and 14b is the main body of the lower mold. Although not shown, both are equipped with a heating device. 15 is a fastener for clamping the mold, 16 is a fastener for fixing the optical fiber bar code, and 18 is a thermosetting resin composition.

成形を行なうには、まず上金型14aおよび下
金型14bを開いた状態でそれぞれにプリフオー
ムされた成形物を収容し、該成形物の溶融温度に
加熱する。次に光フアイバーコード8を下金型1
4bの上面に載置して締具16a,16bにより
金型に固定し、次いで上金型14aを合わせて締
具15により金型の型締を行ない、所定温度で保
持する(たとえば140〜160℃で1〜2時間)こと
により硬化させる。冷却後、型を開いて成形品を
取り出す。
In order to carry out molding, first, the upper mold 14a and the lower mold 14b are opened, a preformed molded article is placed in each molded article, and the molded articles are heated to the melting temperature of the molded article. Next, insert the optical fiber barcode 8 into the lower mold 1.
4b and fixed to the mold using fasteners 16a and 16b, then the upper mold 14a is placed together and the mold is clamped using the fastener 15, and maintained at a predetermined temperature (for example, 140 to 160°C). Cure for 1-2 hours). After cooling, open the mold and take out the molded product.

第5図は脱型後の光フアイバーコードの絶縁被
覆部を示す断面図である。18は硬化後の絶縁被
覆であり、8a,8bは光フアイバーコード8の
両端部にそれぞれ設けられた感光素子などへの接
続端子を示す。
FIG. 5 is a sectional view showing the insulating coating of the optical fiber bar code after demolding. Reference numeral 18 indicates an insulating coating after curing, and reference numerals 8a and 8b indicate connection terminals provided at both ends of the optical fiber bar code 8, respectively, to a photosensitive element or the like.

上記本発明の方法によれば、第2図に示した従
来法のように碍子の貫通穴に光フアイバーコード
を通したのち樹脂を注入するなどの作業は全く不
要で、しかも、光フアイバーコードの接続端子な
どを接続したのちでも絶縁被覆の形成が可能であ
り、防水性も従来法に比べ一体モールド部品にな
るため極めてすぐれている。そして、第4図に示
すような極めて簡単な金型で成形できるので簡便
であり、加熱源(電気ヒータなど)があれば現地
で作業が可能であるという大きな特徴がある。さ
らに、加熱成形された熱硬化性樹脂組成物にボイ
ドが混入することがない。金型の型締力は、たと
えば指先で締めつける程度のものあるいは上金型
の自重のみで締付具をとくに用いないものなど極
端に低いものでも充分である。
According to the above-mentioned method of the present invention, there is no need for operations such as injecting resin after passing the optical fiber code through the through hole of the insulator as in the conventional method shown in FIG. It is possible to form an insulating coating even after connecting terminals, etc., and the waterproofness is also extremely superior compared to conventional methods because it is an integrally molded part. Moreover, it is easy to mold because it can be molded using an extremely simple mold as shown in FIG. 4, and it has the great feature that it can be worked on site as long as there is a heating source (such as an electric heater). Furthermore, voids are not mixed into the thermosetting resin composition that has been thermoformed. It is sufficient that the mold clamping force of the mold is extremely low, such as one that can be tightened with a fingertip, or one that uses only the dead weight of the upper mold and does not use any particular clamping tool.

本発明による簡易モールド法はあらゆる電気機
器の異電位間の伝送路の絶縁被覆などに好適であ
り、とくに超高圧部から大地電位までの信号伝送
路の絶縁被覆に適用すると安全性の面で大きな効
果がえられる。
The simple molding method of the present invention is suitable for insulating coatings on transmission lines between different potentials in all kinds of electrical equipment, and in particular, when applied to insulating coatings on signal transmission lines from ultra-high voltage parts to ground potential, it has great safety benefits. You can get the effect.

[発明の効果] 本発明の方法によれば、光伝送部材のようなも
ろくてこわれやすい部材にも任意の形状で高性能
の絶縁被覆を簡便に施すことができる。
[Effects of the Invention] According to the method of the present invention, it is possible to easily apply a high-performance insulating coating in an arbitrary shape to a fragile and fragile member such as an optical transmission member.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は光伝送部材の一応用例を示す正面図、
第2図は従来法による絶縁被覆例を示す断面図、
第3図は本発明に用いるプリフオームされた成形
物の製造例を示す説明図、第4図は本発明の一実
施例による製造例を示す断面図、第5図は本発明
の方法によつてえられた絶縁被覆を設けた光伝送
部材を示す断面図である。 図中、8は光伝送部材、13はプリフオームさ
れた成形物、14は金型、18は絶縁被覆であ
る。なお、図中同一符号は同一または相当部分を
示す。
FIG. 1 is a front view showing an example of the application of the optical transmission member;
Figure 2 is a cross-sectional view showing an example of insulation coating using the conventional method.
FIG. 3 is an explanatory diagram showing an example of manufacturing a preformed molded article used in the present invention, FIG. 4 is a sectional view showing an example of manufacturing according to an embodiment of the present invention, and FIG. FIG. 3 is a cross-sectional view showing the optical transmission member provided with the obtained insulating coating. In the figure, 8 is a light transmission member, 13 is a preformed molded product, 14 is a mold, and 18 is an insulating coating. Note that the same reference numerals in the figures indicate the same or corresponding parts.

Claims (1)

【特許請求の範囲】 1 (a) 融点40〜130℃のポリヒドロキシブタジ
エン重合体の水素添加物および一般式(): (式中、R1、R2およびR3は同じか異なり、そ
れぞれ炭素原子数1〜3個のアルキル基、nは
1〜4の整数を示す)で示されるイソシアネー
ト化合物または (b) 融点40〜100℃で分子内に2個以上のエポキ
シ基を有するエポキシ樹脂および三沸化硼素の
変性アミン からなる作業温度で固形の熱硬化性樹脂組成物が
真空脱泡され、予め所定形状にプリフオームされ
たのち光伝送部材と金型に収容され、低圧で加熱
成形されることを特徴とする光伝送部材の絶縁被
覆方法。
[Scope of Claims] 1 (a) A hydrogenated product of a polyhydroxybutadiene polymer having a melting point of 40 to 130°C and the general formula (): (In the formula, R 1 , R 2 and R 3 are the same or different, each is an alkyl group having 1 to 3 carbon atoms, and n is an integer of 1 to 4) or (b) melting point 40 A solid thermosetting resin composition consisting of an epoxy resin having two or more epoxy groups in the molecule and a modified amine of boron trifluoride is vacuum defoamed at ~100°C and preformed into a predetermined shape. 1. A method for insulating an optical transmission member, the method comprising: subsequently placing the optical transmission member in a mold and heat-molding the optical transmission member at low pressure.
JP55159056A 1980-11-10 1980-11-10 Coating method for insulation Granted JPS5781212A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55159056A JPS5781212A (en) 1980-11-10 1980-11-10 Coating method for insulation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55159056A JPS5781212A (en) 1980-11-10 1980-11-10 Coating method for insulation

Publications (2)

Publication Number Publication Date
JPS5781212A JPS5781212A (en) 1982-05-21
JPH0133886B2 true JPH0133886B2 (en) 1989-07-17

Family

ID=15685252

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55159056A Granted JPS5781212A (en) 1980-11-10 1980-11-10 Coating method for insulation

Country Status (1)

Country Link
JP (1) JPS5781212A (en)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54105793A (en) * 1978-02-07 1979-08-20 Showa Electric Wire & Cable Co Method of heattforming insulation body
JPS5577113A (en) * 1978-12-05 1980-06-10 Hitachi Ltd Magnetic part

Also Published As

Publication number Publication date
JPS5781212A (en) 1982-05-21

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