JPH0136246Y2 - - Google Patents

Description

[Detailed Description of the Invention] The present invention relates to an electric wire varnish coating device that can obtain a uniform coating film even from a highly concentrated and highly viscous electric wire varnish. .

(Background Art) As shown in FIG. 1, there is a conventional floating die electric wire consisting of a floating die 1 having a varnish aperture hole 2 inside, and a die stopper 3 arranged above the die at an appropriate interval. A varnish applicator was known. In this device, when the wire to be coated 8 is pulled up by sequentially passing through the varnish bath 9, the hole 6 of the die stand 5, the varnish aperture hole 2 of the die, and the coated wire extraction hole 4 of the die stopper, the wire 8 is pulled up due to resistance in the varnish aperture hole. The lifting force acting on the die and the weight of the die are balanced, the die 1 is held in a floating state, and a varnish coating is formed while maintaining the free movement of the die in the floating state. When the die is lifted because the resistance during pulling is greater than its own weight and collides with the die stopper, the resulting varnish coating may have uneven thickness due to deflection or local bending of the wire to be coated. This will result in an uneven coating and will not form a uniform coating. Therefore, in this dice floating method,
It is necessary to maintain free movement of the die as it floats on the varnish. Therefore,
If the varnish has a high concentration or viscosity, and the resistance during pulling is greater than the die's own weight and the die is being lifted, reduce the viscosity of the varnish by adding a solvent to the varnish or increasing the temperature of the varnish bath. In addition, it becomes necessary to reduce the pulling speed of the wire to be coated to lower the resistance, and while this has disadvantages such as an increase in the amount of solvent required, an increase in the amount of heating energy required, and a decrease in the application speed, Since the varnish bath, etc. must be controlled in response to pot life and changes over time, there are drawbacks such as complicated process control.

(Disclosure of the invention) The present invention overcomes the above drawbacks and improves varnish properties.
The present invention provides a wire varnish coating device that can be applied under a wide range of coating conditions, such as coating speed conditions.

That is, the device of the present invention, as illustrated in FIG.
The head of a die 16 (Fig. 3) for applying wire varnish, which has a varnish aperture hole 20 inside, is interposed therebetween, and a pair of protruding pins 10 for holding the die in contact with the upper surface of the skirt portion are fixed. It is formed from a die holder 11 and a support body 14 that rotatably supports the die holder.

The die holder 11 in the embodiment shown in FIG.
2, and is rotatable in the horizontal direction. Further, a pair of protruding pins 10 are fixed to the die holder in parallel with the plane of the support, and the pins protrude in the direction of the electric wire 8 to be coated.
The distance between the pair of protruding pins is larger than the maximum diameter of the head of the die 16 used, and smaller than the outer diameter of the skirt. The die is held by the die holder with its head placed between the pair of protruding pins and the upper surface 18 of the skirt portion in contact with the protruding pins.
In the above embodiment, the guide groove 15 is provided so that the die holder can move on the support body in addition to rotational movement. Of course, this transition movement means is not essential to the invention.

On the other hand, the die 16 used in the present invention
As shown in FIG. 3, the head 19 and skirt portion 17
and an internal varnish aperture hole 20. The skirt portion has a flange shape so as to be locked by a pair of projecting pins. The upper surface 18 of the skirt portion has a spherical or conical radius of curvature, and is adapted to make point contact with the protruding pin. . This allows the die to move while being held in response to the deflection or local bending of the wire to be coated, thereby preventing uneven thickness of the coating film caused by the deflection or the like. In the present invention, a die is used which is lifted by the lifting force of the die based on the resistance when the wire to be coated with the varnish after leaving the varnish bath is introduced into the varnish aperture hole and passes through. In other words, dice whose own weight is smaller than the lifting force are used. .

To form a wire insulating coating film using the device of the present invention, the wire to be coated is introduced from the varnish bath into the varnish aperture hole via the hole in the die stand, if desired, and is passed between the protruding pins. This is done by positioning the When the wire to be coated with varnish is introduced into the varnish aperture, the die is lifted, the head of the die first enters between the protruding pins, and then the upper surface of the skirt collides with the protruding pins and stops. At this time, since the die is lifted in accordance with the movement of the wire to be coated, the varnish aperture hole of the die moves concentrically with the pulling direction of the wire to be coated, and the die is held in this state by the protruding pin. Thereafter, the contact state between the skirt portion of the die and the protruding pin is maintained based on the lifting force caused by the resistance, and the die continues to be held. During this time, if the pulling position of the wire to be coated moves, the die holder rotates and the die accompanies the movement, maintaining a concentric relationship between the pulling direction of the wire to be coated and the varnish aperture. Uneven thickness of the coating film is prevented.

According to the apparatus of the present invention, the die held in the die holder changes in response to changes in the state of the wire to be coated, so uneven thickness of the coating film can be prevented and a uniform coating film can be formed. In addition, since the die is held in a die holder, it is not affected by viscosity changes even if the varnish is changed, and can be applied to a wide range of varnishes, from relatively low concentration and low viscosity varnish to high concentration and high viscosity varnish. It is possible to form a coating film at high speed, and it is possible to form a coating film efficiently with simple process control.

[Brief explanation of drawings]

FIG. 1 is a conventional coating device, FIG. 2 is an explanatory diagram of an embodiment of the coating device of the present invention, and FIG. 3 is a sectional view of a die in the embodiment. 7...Varnish, 8...Wire to be coated, 10...Protruding pin, 11...Dice holder, 14...Support, 16...Dice, 17...Skirt portion, 19
...Head, 20...varnish aperture hole.

Claims (1)

[Scope of utility model registration request] The upper surface 18 consists of a flange-like skirt part 17 and a head part 19 having a spherical or conical radius of curvature, and the head part of a die 16 for applying wire varnish having a varnish aperture hole 20 therein is interposed, and the skirt part A varnish coating device for electric wires is formed of a die holder 11 to which a pair of protruding pins 10 which hold the die are fixed in contact with the upper surface of the die, and a support body 14 which rotatably supports the die holder.