JPH0136687B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a chip capacitor that is small and has a large capacitance.

Conventional configuration and its problems Conventionally, non-laminated rectangular chips of ceramic capacitors have been used. As is well known, chip capacitors do not require lead wires and can be bonded directly onto printed wiring boards, and are much smaller than regular capacitors, but there is a demand for further miniaturization. . Non-laminated rectangular chip capacitors have the advantage that they can be manufactured at a much lower cost than multilayer chip capacitors, but it has been extremely difficult to obtain capacitance equal to or higher than that of multilayer chip capacitors.

OBJECTS OF THE INVENTION It is an object of the present invention to provide a non-laminated chip type capacitor with large capacity and small size.

Structure of the Invention The present invention provides a capacitor body having a U-shape or a U-shape.
electrodes are provided on the inner main surface and the outer main surface thereof so as to face each other through at least a part of the element body, and to be placed opposite each other at a predetermined interval on at least one outer main surface. Therefore, if the external dimensions are made the same as those of conventional non-layered capacitors, the capacitance can be greatly increased, and if the capacitance is made the same, the capacitance can be significantly reduced in size.

DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments of the chip capacitor of the present invention will be described with reference to the drawings.

FIG. 1 is a perspective view of essential parts of the first embodiment. In the figure, reference numeral 1 denotes a U-shaped or U-shaped capacitor body, which is made of, for example, porcelain. If a particularly large capacity is required, a semiconductor ceramic capacitor body may be used as the capacitor body 1. Reference numerals 2 and 3 denote electrodes, which are opposed to each other with the capacitor body 1 interposed therebetween. One electrode 2 is mainly formed continuously on the three outer principal surfaces of the capacitor body 1, and the other electrode 3 is mainly formed continuously on the inner three principal surfaces. One ends of the electrodes 2 and 3 are opposed to each other at a constant interval on one of the outer main surfaces of the capacitor body 1, and the other end thereof is the inner main surface of the capacitor body 1. They are opposed to each other at a predetermined interval on the main surface in the same direction as the main surface. Further, electrodes 2 and 3 are not provided on the two parallel end faces of the capacitor body 1.

According to this embodiment, if the thickness of the capacitor body 1 is made equal to that of a conventional non-laminated capacitor body, the electrode area related to capacitance will be more than double, and the outer principal surface of the width t will be If the area is the same as that of the two main surfaces, the electrode area will be approximately four times as large. Therefore, when the external dimensions are the same, the capacity can be significantly increased compared to the conventional product, and when the capacity is the same, the size can be significantly reduced compared to the conventional product.

In addition, since the pair of electrodes 2 and 3 are placed opposite each other at a predetermined distance on one main surface on the outside, when a chip capacitor is mounted on a printed wiring board, soldering work is easy and the bonding process is easy. It has features such as strong strength and stability.

FIG. 2 is a perspective view of essential parts of the first embodiment. As is clear from the figure, the shape of the capacitor body 1 is basically the same as that of the embodiment shown in FIG. 1, and the only difference is the state in which the electrodes 4 and 5 are provided. That is, the electrodes 4 and 5 are formed on one end surface of the capacitor body 1 and other surfaces other than the two end surfaces that are continuous and orthogonal to this, and are formed on the three outer principal surfaces as described above. They are placed opposite each other at a constant interval near one end face.

In this embodiment as well, the same effects as in the embodiment shown in FIG. 1 can be obtained.

When the capacitor body 1 is made of porcelain,
The fired product may be cut with a diamond cutter and then grooved, or as shown in FIG.
It can be manufactured by embedding a combustible material 7 such as carbon powder or a polymeric material therein, scattering it during firing, and then cutting the fired product along broken lines.

Of course, the external shape of the ceramic capacitor body 1 is not limited to that shown in the drawings, and can be arbitrarily changed depending on the intended use. Further, the capacitor body is not limited to a ceramic capacitor or a semiconductor ceramic capacitor, and many types of capacitor materials such as organic capacitors can be used.

Effects of the Invention As is clear from the above explanation, according to the present invention, a non-laminated chip capacitor can be made large without impairing the characteristics of a chip capacitor such as no need for lead wires and easy direct bonding onto a printed wiring board. Not only can the capacitance be increased and the size reduced extremely easily, but it also has the advantage of being easier to manufacture than multilayer chip capacitors.

[Brief explanation of drawings]

1 and 2 are respectively perspective views of embodiments of the chip capacitor of the present invention, and FIG. 3 is a diagram for explaining an example of a method of manufacturing the capacitor body. 1... Capacitor body, 2, 3... Electrodes.

Claims (1)

[Claims] 1 U-shaped or U-shaped capacitor body,
are mainly provided on the inner main surface and the outer main surface of the capacitor body, and are opposed to each other with at least a portion of the capacitor body interposed therebetween;
What is claimed is: 1. A chip capacitor characterized in that the chip capacitor has electrodes disposed opposite each other at a predetermined interval on at least one outer principal surface.