JPH0136703B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a wire bonding device, and particularly to a wire bonding device in which a capillary is moved up and down by a cam mechanism.

A conventional wire bonding device has a structure as shown in FIG. That is, a support shaft 2 is rotatably supported on a frame body 1 fixed to an XY table (not shown), and an arm holder 3 is fixed to this support shaft 2. A bonding arm 4 is fixed to one end of the arm holder 3, and a capillary 6 through which a wire 5 is inserted is fixed to the end of the bonding arm 4. Further, a backing plate 7 is fixed to the other end of the arm holder 3.

On the other hand, a camshaft 10 rotatably driven by a drive motor (not shown) is rotatably supported by the frame body 1.
A cam 11 for moving the capillary up and down is fixed to 0. Further, in order to transmit the movement of the capillary vertical movement cam 11 to the capillary 6, a support shaft 12 is rotatably supported on the frame body 1 at an intermediate portion between the capillary vertical movement cam 11 and the backing plate 7. , a lever 13 is fixed to this support shaft 12. The lever 13 is urged by a spring 15 so that a cam follower 14 rotatably attached to one end of the lever 13 comes into pressure contact with the capillary vertical movement cam 11. Further, a height adjusting screw 17 fixed by a fixing screw 16 is screwed onto the other end of the lever 13, and the arm holder is arranged such that the backing plate 7 comes into pressure contact with the height adjusting screw 17. 3 is biased by a bonding load spring 18.

Therefore, when the capillary vertical movement cam 11 rotates, the lever 13 swings about the support shaft 12,
It is transmitted to the backing plate 7 via the height adjustment screw 17. As a result, the arm holder 3 swings about the support shaft 2, and the capillary 6 moves up and down. On the other hand, the frame main body 1 moves horizontally in the XY directions due to the movement of an XY table (not shown) in the XY directions, and the capillary 6 moves horizontally. Then, the wire 5 is connected between the pellet 21 fixed to the lead frame 20 and the lead 22 of the lead frame 20 by the above-described vertical and horizontal movement of the capillary 6.

Incidentally, in the wire bonding apparatus, it is necessary to adjust the level (height) of the capillary 6 when assembling the apparatus and when replacing the capillary 6. For this reason, conventionally, as described above, a lever 13 is provided to transmit the movement of the capillary vertical movement cam 11 to the arm holder 3, and this lever 13 is provided with a height adjustment screw 17. The level of the capillary 6 is adjusted by loosening the fixing screw 16 and turning the height adjusting screw 17 to move it up and down.

However, in this structure, the backing plate 7 and the height adjustment screw 17 are in point contact, and the height adjustment screw 17 moves in an arc around the support shaft 12, and the backing plate 7 is in contact with the height adjustment screw 17. Since the height adjusting screw 17 and the backing plate 7 move in an arc around the center, the movement is transmitted with the height adjusting screw 17 and the backing plate 7 always slipping.
For this reason, the backing plate 7 and the height adjustment screw 17 are severely worn, making it impossible to use them for a long period of time, and the sliding becomes less smooth due to the wear. Furthermore, since vibrations due to slippage are transmitted to the capillary 6, there are disadvantages in that high speed cannot be achieved and bondability deteriorates.

Furthermore, in wire bonding, it is necessary to form a ball on the wire 5 extending from the lower end of the capillary 6, and for this purpose, a torch electrode (not shown) for forming the ball is attached to the frame body 1 so as to be horizontally movable. It is being However, in the conventional method, when the level of the capillary 6 is adjusted as described above, the top dead center position of the capillary 6 changes and its vertical position with respect to the torch electrode changes, so the level adjustment of the torch electrode must also be adjusted separately. It was hot.

SUMMARY OF THE INVENTION An object of the present invention is to provide a wire bonding device that eliminates the drawbacks of the prior art described above.

Hereinafter, the present invention will be explained with reference to illustrated embodiments.
FIG. 2 is a sectional view showing an embodiment of the present invention.
XY driven in the XY direction by a drive means not shown
A frame body 31 of the bonding head is fixed to the movable portion of the drive table 30. The frame body 31 rotatably supports a support shaft 32 and a camshaft 33 which is rotationally driven by a drive motor (not shown). An arm holder 34 is fixed to the support shaft 32. The arm holder 34 has a bonding arm 35 at one end.
is fixed, and a cam follower 36 is rotatably attached to the other end. And camshaft 3
The arm holder 34 is biased by a spring 38 so that the cam follower 36 comes into pressure contact with the capillary vertical movement cam 37 fixed to the arm holder 34 . Further, a capillary 40 through which a wire 39 is inserted is fixed to one end of the bonding arm 35.

On the other hand, the fixed portion of the XY drive table 30 is fixed to an upper height adjustment block 41 having a taper 41a formed at the lower end. The upper block 41 for height adjustment is fitted into a base block 42 having a substantially U-shaped cross section so as to be vertically movable. On the inside of the base block 42, there is a taper 43 that is approximately equal to the taper 41a of the upper block 41 for height adjustment.
A lower block 4 for height adjustment with a formed on the upper surface
3 is arranged, and this lower block 43 for height adjustment
The upper block 41 for height adjustment is supported by. Also, the base block 42 has an adjustment screw 4.
4 is rotatably attached, and a threaded portion formed on this adjustment screw 44 is screwed into a lower height adjustment block 43. Further, the height adjusting upper block 41 is fixed to the base block 42 with a fixing screw 45.

Therefore, when the camshaft 33 is rotated by a drive motor (not shown), the arm holder 34 swings about the support shaft 32 according to the profile of the capillary vertical movement cam 37, and the capillary 40 moves up and down. Furthermore, when the movable portion of the XY drive table 30 is driven by a drive mechanism (not shown) and the frame body 31 is moved horizontally, the capillary 40 is also moved horizontally.

Next, a method for adjusting the height of the capillary 40 will be explained. When the fixing screw 45 is loosened and the adjusting screw 44 is turned, the lower height adjusting block 43 moves horizontally. As a result, the height adjusting upper block 41 moves up and down by the action of the tapers 43a and 41a. When the height adjustment upper block 41 moves up and down, the frame body 31 moves up and down via the XY drive table 30, so the capillary 40 also moves up and down, and the height of the capillary 40 can be adjusted. After adjustment, the upper and lower height adjusting blocks 41 and 43 are fixed to the base block 42 by tightening the fixing screw 45.

In this way, the lever mechanism that transmits the movement of the capillary vertical movement cam 37 to the capillary is not provided with a capillary level adjustment mechanism, but the capillary level adjustment mechanisms 41 to 45 that can adjust the vertical movement are provided below the XY drive table 30. Since the level of the capillary 40 is adjusted by using the capillary 40, the capillary 40 does not vibrate, which increases speed and improves bondability. Further, since the distance from the lower end of the capillary 40 to the ball forming torch electrode (not shown) does not change, there is no need to adjust the level of the torch electrode again.

As is clear from the above description, according to the present invention, speed can be increased, bondability is improved, and there is no need to readjust the level of the torch electrode.

[Brief explanation of drawings]

FIG. 1 is a sectional view of a conventional example, and FIG. 2 is a sectional view showing an embodiment of the present invention. 30...XY drive table, 31...Frame body, 41...Upper block for height adjustment, 42...Base block, 43...Lower block for height adjustment, 4
4...adjustment screw, 45...fixing screw.

Claims (1)

[Claims] 1. A wire bonding device in which a bonding head is fixed on a movable part of an XY drive table, in which the fixed part of the XY drive table is fixed on a capillary level adjustment mechanism capable of vertical movement adjustment.