JPH0136773B2 - - Google Patents

Info

Publication number
JPH0136773B2
JPH0136773B2 JP17566884A JP17566884A JPH0136773B2 JP H0136773 B2 JPH0136773 B2 JP H0136773B2 JP 17566884 A JP17566884 A JP 17566884A JP 17566884 A JP17566884 A JP 17566884A JP H0136773 B2 JPH0136773 B2 JP H0136773B2
Authority
JP
Japan
Prior art keywords
melting point
metal
alloy
thermoplastic resin
mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP17566884A
Other languages
Japanese (ja)
Other versions
JPS6163426A (en
Inventor
Hiroatsu Tsunoda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Kokusaku Pulp Co Ltd
Original Assignee
Sanyo Kokusaku Pulp Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Kokusaku Pulp Co Ltd filed Critical Sanyo Kokusaku Pulp Co Ltd
Priority to JP17566884A priority Critical patent/JPS6163426A/en
Publication of JPS6163426A publication Critical patent/JPS6163426A/en
Publication of JPH0136773B2 publication Critical patent/JPH0136773B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/16—Making multilayered or multicoloured articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/16—Making multilayered or multicoloured articles
    • B29C2045/1696—Making multilayered or multicoloured articles injecting metallic layers and plastic material layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は電磁波の遮蔽性を有する成形物の製造
方法に関するものであり、殊に低融点金属若しく
は低融点合金(以下単に低融点金属と称する)と
熱可塑性樹脂との多層成形物の射出成形法に関す
るものである。
Detailed Description of the Invention [Field of Industrial Application] The present invention relates to a method for manufacturing a molded article having electromagnetic wave shielding properties, and particularly relates to a method for manufacturing a molded article having electromagnetic wave shielding properties, and particularly relates to a method for manufacturing a molded article having electromagnetic wave shielding properties, and in particular, a method for producing a molded article having electromagnetic wave shielding properties. ) and a thermoplastic resin.

〔従来の技術〕[Conventional technology]

近年、電子機器の急速な普及により、それらが
発する電磁波を防止する電磁波遮蔽材料が注目さ
れ、多くの提案がなされている。
In recent years, with the rapid spread of electronic devices, electromagnetic wave shielding materials that prevent electromagnetic waves emitted by these devices have attracted attention, and many proposals have been made.

中でも、導電性を有する金属の粉末やフレーク
を合成樹脂に練り込む方法や金属繊維を練り込む
方法などが多く提案されている。
Among these, many methods have been proposed, including a method of kneading conductive metal powder or flakes into a synthetic resin, and a method of kneading metal fibers.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

しかし、電磁波を遮蔽するための高度の導電性
を得るためには多量の充填量が必要となるし、ま
た金属繊維の場合には、充填量は比較的少量です
むが、金属を繊維化するのが非能率的であるた
め、金属はその地金に比べて非常に高価なものと
なつている。また、金属の板や金網を合成樹脂板
と貼り合せて用いる提案もなされているが、この
場合には平板状の板もしくはゆるやかな形状にし
か賦型することができないため、一般のOA機器
の筐体などの複雑な形状のものを作ることができ
ない。そのため何れの方法も未だ広く実用化され
るまでには至つていない。
However, in order to obtain a high degree of conductivity to shield electromagnetic waves, a large amount of filling is required, and in the case of metal fibers, a relatively small amount of filling is required, but it is difficult to turn metal into fibers. This inefficiency makes metals very expensive compared to their raw materials. There have also been proposals to use a metal plate or wire mesh bonded to a synthetic resin plate, but in this case, it can only be shaped into a flat plate or a loose shape, so it cannot be used with general OA equipment. It is not possible to make complex shapes such as housings. Therefore, neither method has yet been widely put into practical use.

〔問題点を解決するための手段〕[Means for solving problems]

この様な従来技術の現状に対して、本発明は合
成樹脂の複雑形状の例えば筐体を成形する際に有
利な成形法を提供したもので熱可塑性樹脂を多層
に射出成形するにあたり、低融点金属ないしは合
金を該金属ないしは合金の融点以下で上記の熱可
塑性樹脂層間に圧入して低融点金属ないしは合金
の中間層を少くとも一層形成せしめることを特徴
とする、目的の高度の導電性を与える成形方法を
提供するものである。
In contrast to the current state of the prior art, the present invention provides a molding method that is advantageous when molding complex shapes of synthetic resin, such as housings. To provide the desired high electrical conductivity, characterized in that a metal or alloy is press-fitted between the thermoplastic resin layers at a temperature below the melting point of the metal or alloy to form at least one intermediate layer of a low melting point metal or alloy. The present invention provides a molding method.

本発明に用いる熱可塑性樹脂は射出成形可能な
熱可塑性樹脂であれば特に制約されるものではな
いが、アイオノマー樹脂をブレンドするのがより
好ましい。すなわち、アイオノマー樹脂は低融点
金属と熱可塑性樹脂との密着性を向上させるため
にブレンドされるが、5重量部以上ブレンドさせ
るとその効果が大きい。
The thermoplastic resin used in the present invention is not particularly limited as long as it is an injection moldable thermoplastic resin, but it is more preferable to blend it with an ionomer resin. That is, the ionomer resin is blended in order to improve the adhesion between the low melting point metal and the thermoplastic resin, and the effect is great when it is blended in an amount of 5 parts by weight or more.

射出成形可能な熱可塑性樹脂としてはポリオレ
フイン系、ポリスチレン系、ポリ塩化ビニル系、
ポリアクリル酸エステル系、ポリメタアクリル酸
エステル系、ポリアクリロニトリル系、ポリブタ
ジエン系、ポリアミド類、ポリエステル類もしく
はこれらの変形物、共重合物、混合物などが挙げ
られる。
Thermoplastic resins that can be injection molded include polyolefin, polystyrene, polyvinyl chloride,
Examples include polyacrylic esters, polymethacrylic esters, polyacrylonitrile, polybutadiene, polyamides, polyesters, and modified products, copolymers, and mixtures thereof.

これらは射出成形性や射出成形後の成形物の物
性要求により適宜選択される。
These are appropriately selected depending on injection moldability and physical property requirements of the molded product after injection molding.

低融点金属としては、熱可塑性樹脂の射出成形
可能な温度域以下の融点を有するもので、錫、
沿、ビスマス、亜沿、カドミウム、アンチモン等
の単体もしくは合金を例示することができる。
Examples of low melting point metals include metals with a melting point below the temperature range that allows injection molding of thermoplastic resins, such as tin,
Examples include single substances or alloys of bismuth, bismuth, antimony, cadmium, antimony, and the like.

射出成形可能な温度域は通常400℃以下である。 The temperature range where injection molding is possible is usually below 400℃.

〔作用〕[Effect]

本発明の成形方法を実施態様を示した図面に基
づいて説明する。
The molding method of the present invention will be explained based on drawings showing embodiments.

図面は金型の模式図であり、金型4,5の間隙
2に対して熱可塑性樹脂を射出孔3または1より
射出する。この場合、熱可塑性樹脂中にはアイオ
ノマー樹脂を5重量部以上ブレンドしておくこと
が望ましい。その理由は続いて圧入する金属との
密着性を向上させるためである。次いで間隙2を
わずかに広げて薄層間隙を作り、空間側の射出孔
1または3より、低融点金属または合金をその融
点より十分高い温度にして金型間隙2内に圧入し
固化させる。
The drawing is a schematic diagram of a mold, and the thermoplastic resin is injected into the gap 2 between the molds 4 and 5 through the injection hole 3 or 1. In this case, it is desirable to blend 5 parts by weight or more of an ionomer resin into the thermoplastic resin. The reason for this is to improve the adhesion with the metal that will be press-fitted subsequently. Next, the gap 2 is slightly widened to create a thin layer gap, and the low melting point metal or alloy is heated to a temperature sufficiently higher than its melting point to be press-fitted into the mold gap 2 through the injection hole 1 or 3 on the space side and solidified.

次いで、更に間隙2を広げて金型壁と低融点合
金との間に薄層空間を作り、空間側の射出孔1ま
たは3より該低融点金属の融点以下の融点または
軟化点をもつ熱可塑性樹脂を該低融点金属の融点
以下の温度で射出することによつて、中間層を有
する多層の成形体を得ることができる。
Next, the gap 2 is further widened to create a thin layer space between the mold wall and the low melting point alloy, and a thermoplastic having a melting point or softening point lower than the melting point of the low melting point metal is injected through the injection hole 1 or 3 on the space side. By injecting the resin at a temperature below the melting point of the low melting point metal, a multilayer molded body having an intermediate layer can be obtained.

〔実施例〕〔Example〕

ABS樹脂 JSRABS42(日本合成ゴム社製)
95重量部 アイオノマー樹脂 サーリンA 5重量部 をブレンドして金型の射出孔3より250℃で間隙
2に流し込み、金型温度200℃まで冷却した後、
間隙2を0.2mm更に開き、射出孔1より220℃に加
熱溶融している鉛−錫合金(融点200℃)を圧入
し、更に金型を190℃まで冷却し該金属が固化し
た後、金型間隙2を1mm開き、射出孔1より
ABS樹脂 JSRABS35を190℃で圧入し、冷却固
化した後、金型を全開してカツプ状の成形物を得
た。
ABS resin JSRABS42 (manufactured by Japan Synthetic Rubber Co., Ltd.)
95 parts by weight of ionomer resin Surlyn A and 5 parts by weight were blended and poured into the gap 2 from the injection hole 3 of the mold at 250°C, and after cooling to the mold temperature of 200°C,
Gap 2 is further opened by 0.2 mm, and a lead-tin alloy (melting point: 200°C) heated to 220°C is injected through injection hole 1. After the mold is further cooled to 190°C and the metal is solidified, the metal is Open mold gap 2 by 1mm and insert from injection hole 1.
ABS resin JSRABS35 was press-fitted at 190°C, cooled and solidified, and then the mold was fully opened to obtain a cup-shaped molded product.

この成形物の電気抵抗は4×10-4Ω・cmの比抵
抗を示し、電磁波シールドに充分な電気伝導度で
あつた。
The molded product had a specific resistance of 4×10 −4 Ω·cm, and had sufficient electrical conductivity to shield electromagnetic waves.

〔発明の効果〕〔Effect of the invention〕

本発明は従来の合成樹脂に導電性を有する金属
粉末、フレークおよび金属繊維を練り込む方法と
は異なり、射出成形のみで電磁波シールドに充分
な電気伝導度を有する電磁波遮蔽材料を製造する
方法で、工程が簡略化されると共に複雑な形状の
筐体を成形し得るところに特徴を有するものであ
る。
Unlike the conventional method of kneading conductive metal powder, flakes, and metal fibers into synthetic resin, the present invention is a method of manufacturing an electromagnetic shielding material with sufficient electrical conductivity for electromagnetic shielding by injection molding alone. This method is characterized in that the process is simplified and a housing with a complicated shape can be molded.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の実施例で使用した金型の1例
を示した模式図である。 1,3……射出孔、2……間隙、4,5……金
型。
FIG. 1 is a schematic diagram showing an example of a mold used in an example of the present invention. 1, 3... Injection hole, 2... Gap, 4, 5... Mold.

Claims (1)

【特許請求の範囲】 1 熱可塑性樹脂を多層に射出成形するにあた
り、低融点金属ないしは合金を該金属ないしは合
金の融点以上で上記の熱可塑性樹脂層間に圧入し
て低融点金属ないしは合金の中間層を少くとも一
層形成せしめることを特徴とする射出成形方法。 2 熱可塑性樹脂にアイオノマー樹脂を含む特許
請求の範囲第1項記載の方法。
[Claims] 1. When injection molding a thermoplastic resin into multiple layers, a low melting point metal or alloy is press-fitted between the thermoplastic resin layers at a temperature higher than the melting point of the metal or alloy to form an intermediate layer of the low melting point metal or alloy. An injection molding method characterized by forming at least one layer of. 2. The method according to claim 1, wherein the thermoplastic resin contains an ionomer resin.
JP17566884A 1984-08-23 1984-08-23 Manufacture of molded article of electromagnetic wave shielding material Granted JPS6163426A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17566884A JPS6163426A (en) 1984-08-23 1984-08-23 Manufacture of molded article of electromagnetic wave shielding material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17566884A JPS6163426A (en) 1984-08-23 1984-08-23 Manufacture of molded article of electromagnetic wave shielding material

Publications (2)

Publication Number Publication Date
JPS6163426A JPS6163426A (en) 1986-04-01
JPH0136773B2 true JPH0136773B2 (en) 1989-08-02

Family

ID=16000136

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17566884A Granted JPS6163426A (en) 1984-08-23 1984-08-23 Manufacture of molded article of electromagnetic wave shielding material

Country Status (1)

Country Link
JP (1) JPS6163426A (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0741630B2 (en) * 1990-07-27 1995-05-10 日精樹脂工業株式会社 Molding method for composite molded products
DE19638322A1 (en) * 1996-09-19 1998-03-26 Ver Foerderung Inst Kunststoff Plastics components with a conductive surface
JP4127323B2 (en) 1997-01-29 2008-07-30 イェス トゥガールド グラム Molding method of assembly article
DE19953746C2 (en) * 1999-06-21 2001-10-04 Rasmussen Gmbh Method of making a nozzle
DE10312723A1 (en) * 2003-03-21 2004-09-30 BSH Bosch und Siemens Hausgeräte GmbH Method for producing a tub for a washing machine and tub made thereafter

Also Published As

Publication number Publication date
JPS6163426A (en) 1986-04-01

Similar Documents

Publication Publication Date Title
EP0180383A2 (en) A manufacturing method for housings with a two-layer structure
JPS6320270B2 (en)
JPS6163426A (en) Manufacture of molded article of electromagnetic wave shielding material
JPS59128704A (en) Method of producing conductive filler containing molding material
JPH0419644B2 (en)
JPH0557758B2 (en)
JPS61209121A (en) Manufacture of thermoplastic resin sheet containing metallic layer therein
JPH0144137B2 (en)
JPH0763971B2 (en) Conductive resin molding
JPH0112648B2 (en)
JPS63269407A (en) Conductive sheet molding
US20050204548A1 (en) Low cost electrical fuses manufactured from conductive loaded resin-based materials
JPH0319862B2 (en)
JPS63218310A (en) Electrically conductive resin composition and molded item made thereof
JPH0227137B2 (en)
JP3557831B2 (en) Resin composition, resin molded article using the same, and method for producing the same
JPS5923595A (en) Electromagnetic shielding material
JPS5985746A (en) Sheet-shaped molding material for shielding electromagnetic wave
JPS61293827A (en) Manufacture of electrically conductive plastic molded body
JPH0354711B2 (en)
JPH02127439A (en) Production molded article of thermoplastic resin
JPS58159000A (en) Housing for radio wave shield
JPH03199672A (en) Insulating cap for power distribution device and its manufacture
JPH02199175A (en) Conductive molding resin material
JPH06339921A (en) Conductive resin molded product