JPH0136791B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a film laminating device for laminating a photosensitive resist film onto the surface of a printed circuit board.

In all conventional laminating devices, a strip of resist film wound around a roll is sent by a feed roller, and the laminate heated to a predetermined temperature is pressed onto the printed circuit board and bonded. In order to cut the film while the laminating roller is being laminated, the rotation of the laminating roller is temporarily stopped. However, because of this, the temperature rise at the point where the film is in contact with the laminating roller increases the tendency for air bubbles to be generated from the film, which impairs the adhesion of the film during the subsequent film lamination process after cutting the film. I had a problem. This has been a major problem depending on the type of film.

The present invention provides a laminating device in which, when laminating a resist film to a printed circuit board, once the lamination of the film is started, the laminating roll is continuously rotated until the lamination is completed, and the film is cut while the lamination is being performed. We provide a device that can be used simultaneously when

The present invention has a printed circuit board feeding device for transporting a printed circuit board, a film feeding roller for transporting a film, a laminating roller for pasting the film onto a board, a film suction guide for holding the film, and a lower blade cutter. This film laminating device has a suction slide guide that slides while suctioning, and an upper blade cutter that slides together with the suction guide and moves up and down to cut the film.

Embodiments of the present invention will be described based on the drawings: 1
is a printed circuit board, and this printed circuit board 1 is held by left and right clamp holders 2, and while being held, the holders 2 are moved downward to a predetermined position. 3 is a resist film roll, and the film 4 pulled out from this roll 3 is first set through a guide roller 5 to the position of film feed rollers 6 and 7. Film feed rollers 6, 7
is formed by a feed roller 6 and a clamp roller 7, and the clamp roller 7 contacts and separates from the feed roller 6 at set timings. Reference numeral 8 denotes a protective film peeling guide for peeling off the protective film 9 laminated on the resist film 4, and the protective film 9 is collected by a winding roll 10.

Reference numeral 11 denotes a film suction slide guide which incorporates a lower blade cutter 12, and has a suction port 13 opened at an appropriate position on its upper surface for suctioning the film 4. The suction port 13 is connected to a vacuum device (not shown) with a flexible hose 14, and a solenoid valve is installed in the middle of the vacuum piping, and vacuum operation is performed at a predetermined timing by activating the solenoid valve. It will be done. Note that 15 is the upper blade cutter and slide guide 1.
Since it is attached to the mounting board 1 (not shown), it moves together when the slide guide 11 slides, and also moves up and down, so when it moves downward, it aligns with the lower blade cutter 12, Film 4 is cut.

20 is a film adsorption guide, and this guide 20
The film 4 is directed toward the bending portion 21 that changes the feeding direction of the film 4 diagonally downward and the laminating roller 30.
The guide surface 23 has a plurality of vacuum ports 24 for sucking the film 4 at predetermined timing. This vacuum port 24 is connected to a vacuum device (not shown) through a pipe 25, and a solenoid valve is disposed in the middle thereof.
This solenoid valve is operated to switch between vacuum operation and atmospheric pressure operation.

The laminating rollers 30 and 31 are located below this suction guide 20, and the laminating rollers 30 and 31 are located below the suction guide 20.
0 and 31 have a structure that allows contact and separation.
Note that the substrate ejecting rollers 32 and 33 are also structured so that they can come into contact and separate from each other in the same manner.

The operation of the device of the present invention will be explained. In FIG. 2, the tip 4A of the film 4 is connected to the cutters 12, 15.
The state after being cut by is shown. The protective film 9 is separated by a film peeling guide 8 and wound onto a roll 10.

The film may be attached to the printed circuit board 1 on one side or both sides, and as shown in FIG. 1, the film 4 is configured so that it can be attached on both sides of the printed circuit board 1. If the film 4 on one side is not supplied, it is possible to perform film lamination on only one side.
The laminating apparatus of the present invention is arranged symmetrically with respect to the substrate 1, and the operation will be explained for one side. The opposite side also works symmetrically.

In Figure 3, the film feed rolls 6 and 7 are in contact,
The leading end 4A of the film is fed to the position of the laminating roller 30 and stopped by the rotation of the dedicated motor. At this time, the printed circuit board 1 is held by the clamp holder 2, and as the film 4 is fed out, the board 1 held by the holder 2 descends vertically downward with the holder 2 and stops at a predetermined position. do. The stopped position is printed circuit board 1
The leading end 1A of the film is in a relationship such that the leading end 1A of the film slightly protrudes from the leading end 4A of the film. This positional relationship can be achieved by adjusting the stop position of the printed circuit board 1. At this time, laminating roller 3
Since 0 is open, the board 1 can be moved smoothly. When the feeding of the printed circuit board 1 is stopped, the laminating roller 30 presses the film onto the printed circuit board 1 while pressing the leading end 4A of the film. At the same time, the film suction slide guide 11 and the upper cutter 15 move horizontally toward the feed rollers 6 and 7 and stop at a predetermined position (FIG. 5).

When the laminating roller 30 rotates while pressing the film 4 against the substrate 1, the film 4 is pressed against the substrate 1.
is laminated. Rear end 1 of printed circuit board 1
When B is detected by the first detection means 40 such as an optical sensor, the suction ports 13 and vacuum ports 24 of the film suction slide guide 11 and the film suction guide 20 are evacuated and the film is sucked. The slide guide 11 moves to the film cutting position shown in FIG. 2 at the same speed as the film feeding speed at which the laminating roller 30 is pulling the film while still sucking the film. At this time, the upper blade cutter 15 attached to the mounting board of the slide guide 11 also moves to the left at the same time, and also moves downward in the middle of the movement, cutting the film 4 when the slide guide 11 stops. (Figure 8). Since the film 4 is sucked by the vacuum port 24 of the film suction guide 20 and supplied to the laminating roller 30, the film 4 can be bonded to the printed circuit board 1 without flapping.

FIG. 9 shows a state in which the rear end 4B of the cut film is about to be crimped, after which the laminating roller 30 stops rotating and the second detection means 41 detects the rear end 1B of the printed circuit board. , the laminating roller 30 retreats. The substrate discharge roller 32 rotates until the substrate 1 is completely discharged, and then retreats like the laminating roller 30 when the discharge is completed.
By repeating the above operations, the film 4 is continuously laminated onto the substrate 1.

In the cutting process for cutting the film while laminating the film, the conventional apparatus stops the rotation of the laminating roller and cuts the film with a cutter. In this case, local parts of the resist film would overheat and generate bubbles, which would impair the adhesion of subsequent lamination.In order to ensure adhesion, the laminating apparatus of the present invention uses a cutter to cut the film. Since the cutting can now be done without stopping the laminating roller during laminating, it has become possible to obtain a good laminated product. The printed circuit board laminated by the laminating apparatus of the present invention can now be fully adapted to fine-tuning circuits on the circuit board. This invention also contributes to improving the operating rate of the device.

[Brief explanation of drawings]

Fig. 1 is a front view showing an overview of the present invention, Figs. 3 is a front view of the film being fed to a predetermined position, Fig. 4 is a front view of the printed circuit board being fed to a predetermined position, and Fig. 5 is a front view of the film being fed while the laminating roller is rotating. The front view when laminating the film to the substrate, Figure 6 is the front view when the suction ports of the slide guide and suction guide are vacuumed and the film is suctioned, and Figure 7 is the front view when the slide guide and upper blade cutter are moving. Figure 8 is a front view when the film is cut, Figure 9 is a front view with the rear end of the film attached to the board, and Figure 10 is the rear end of the board. FIG. 6 is a front view of the laminating roller when the laminating roller is retracted after the laminate roller is detected. In the drawing, 1 is a printed circuit board, 2 is a clamp holder, 3 is a resist film roll, 4 is a film, 6 and 7 are film feed rollers, 11 is a film suction slide guide, 12 is a lower blade cutter, 13 is a suction port, 15 is the upper blade cutter, 20 is the film suction guide, 24 is the vacuum port, 30,
31 is a laminating roller.

Claims (1)

[Claims] 1 A printed circuit board clamper that sends out a printed circuit board, a film feed roller that sends out a film to be pasted onto a printed circuit board, a film laminating roller that presses and pastes the film onto the printed circuit board, and a film laminating roller that is disposed on top of this film laminating roller and that holds the film. A film suction guide for suction, a suction slide guide that is equipped with a lower blade cutter and that transfers the film while adsorbing the film, and an upper blade cutter that slides along with the suction slide guide and moves up and down to cut the film. Film laminating equipment for printed circuit boards.