JPH0138954Y2 - - Google Patents
Info
- Publication number
- JPH0138954Y2 JPH0138954Y2 JP1982200997U JP20099782U JPH0138954Y2 JP H0138954 Y2 JPH0138954 Y2 JP H0138954Y2 JP 1982200997 U JP1982200997 U JP 1982200997U JP 20099782 U JP20099782 U JP 20099782U JP H0138954 Y2 JPH0138954 Y2 JP H0138954Y2
- Authority
- JP
- Japan
- Prior art keywords
- shelf
- shelves
- electronic device
- mounting structure
- fan
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
【考案の詳細な説明】
(1) 考案の技術分野
本考案は電子装置の実装構造に関し、特にシエ
ルフの上下２段積み実装における冷却構造に関す
る。[Detailed Description of the Invention] (1) Technical Field of the Invention The present invention relates to a mounting structure for an electronic device, and in particular to a cooling structure for two stacked upper and lower stacked shelves.
(2) 従来技術と問題点
シエルフの上下２段積み実装における冷却構造
の３つの従来例をそれぞれ第１図から第３図に示
してある。図中、符号は１，２がシエルフ、３が
フアンを示す。(2) Prior Art and Problems Three conventional examples of cooling structures for two-tier stacking of SHIELF are shown in FIGS. 1 to 3, respectively. In the figure, numerals 1 and 2 indicate a shield, and 3 indicates a fan.
第１図の例は下側シエルフ２の下部から吸入さ
れた空気がシエルフ２，１を直列に貫流して上側
シエルフ１の上部から排出されるようにしたもの
である。この場合、下側シエルフ２で加熱された
空気が上側シエルフ１に供給されるので、冷却効
率が悪い欠点がある。また、シエルフの空気抵抗
が２倍となるのでフアン効率が悪いという欠点も
ある。 In the example shown in FIG. 1, air is taken in from the lower part of the lower shelf 2, flows through the shelves 2 and 1 in series, and is discharged from the upper part of the upper shelf 1. In this case, air heated by the lower shelf 2 is supplied to the upper shelf 1, which has the disadvantage of poor cooling efficiency. Another drawback is that the fan efficiency is poor because the air resistance of the shield is doubled.
第２図または第３図の例は、上下のシエルフ
１，２を上下方向または横方向へずらして各シエ
ルフごとにダクト４を設けたものである。これら
の構造は冷却効率やフアン効率は良いが、密装密
度が低下し、且つダクトを必要とするなどの欠点
がある。 In the example shown in FIG. 2 or 3, the upper and lower shelves 1 and 2 are shifted vertically or laterally, and a duct 4 is provided for each shelf. Although these structures have good cooling efficiency and fan efficiency, they have drawbacks such as reduced packing density and the need for ducts.
(3) 考案の目的
本考案の目的は、上記従来技術の欠点に鑑み、
冷却効率およびフアン効率が良く、しかも実装密
度が高く、構造も簡単な冷却構造を提供すること
にある。(3) Purpose of the invention The purpose of the invention is to:
To provide a cooling structure with good cooling efficiency and fan efficiency, high mounting density, and simple structure.
(4) 考案の構成
本考案による冷却構造は、冷風が通るダクトと
電子装置の架構造とが兼用されてなり、且つシエ
ルフを上下２段に実装した電子装置の実装構造に
おいて、上下シエルフの中間に吸気孔を設けると
共に、上側シエルフの真上および下側シエルフの
真下に排気孔を設けたことを特徴とするものであ
る。(4) Composition of the invention The cooling structure according to the invention combines a duct through which cold air flows and a rack structure for electronic equipment, and in a mounting structure for electronic equipment in which the shelves are mounted in two stages, upper and lower. It is characterized in that an intake hole is provided in the upper shelf, and an exhaust hole is provided directly above the upper shelf and directly below the lower shelf.
(5) 考案の実施例
以下、本考案の実施例につき図面を参照して詳
細に説明する。(5) Embodiments of the invention Hereinafter, embodiments of the invention will be described in detail with reference to the drawings.
第４図は本考案による冷却構造を装置の側方か
ら見て示す。上下のシエルフ１，２は上下に離さ
れ、そして両シエルフの中間位置にて筐体５の前
面及び後面に吸気孔６を設けてある。一方、上側
シエルフ１の上部および下側シエルフ２の下部に
フアン３を設けてあり、吸気孔６から吸入された
空気がシエルフ１，２をそれぞれ上方及び下方へ
貫流し、上側シエルフ１の上部および下側シエル
フ２の下部から別個に排出されるようにしてあ
る。 FIG. 4 shows the cooling structure according to the present invention viewed from the side of the device. The upper and lower shelves 1 and 2 are separated vertically, and intake holes 6 are provided on the front and rear surfaces of the housing 5 at an intermediate position between the two shelves. On the other hand, a fan 3 is provided at the upper part of the upper shelf 1 and the lower part of the lower shelf 2, and the air taken in from the intake hole 6 flows upward and downward through the shelves 1 and 2, respectively. It is arranged to be separately discharged from the lower part of the lower shelf 2.
(6) 考案の効果 本考案の効果は以下の如くである。(6) Effect of the idea The effects of the present invention are as follows.
(イ) 第１図の従来例と比較して冷却効率が約２倍
となり、またフアン効率も向上する。(a) Cooling efficiency is approximately doubled compared to the conventional example shown in Figure 1, and fan efficiency is also improved.
(ロ) 第２図または第３図の従来例と比較して実装
密度が高く、またダクトが不要で構造が簡単で
ある。(b) Compared to the conventional example shown in FIG. 2 or 3, the mounting density is higher, and the structure is simpler as no duct is required.
(ハ) 吸気孔が床から離れているため、床の塵埃の
吸込みが少ない。(c) Since the air intake hole is located far from the floor, less dust from the floor is sucked in.
第１図から第３図は従来の電子装置の実装構造
を示す図、第４図は本考案による電子装置の実装
構造を示す図である。
１，２……シエルフ、３……フアン、５……筐
体、６……吸気孔。
1 to 3 are diagrams showing a mounting structure of a conventional electronic device, and FIG. 4 is a diagram showing a mounting structure of an electronic device according to the present invention. 1, 2...Sielf, 3...Fan, 5...Casing, 6...Intake hole.
Claims (1)
されてなり、且つシエルフを上下２段に実装した
電子装置の実装構造において、 上下シエルフの中間に吸気孔を設けると共に、
上側シエルフの真上および下側シエルフの真下に
排気孔を設けたことを特徴とする電子装置の実装
構造。[Scope of Claim for Utility Model Registration] In an electronic device mounting structure in which a duct through which cold air passes and a rack structure for an electronic device are mounted, and in which the shelves are mounted in two stages, upper and lower, an intake hole is provided between the upper and lower shelves. With,
A mounting structure for an electronic device, characterized in that an exhaust hole is provided directly above the upper shelf and directly below the lower shelf.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20099782U JPS59104592U (en) | 1982-12-29 | 1982-12-29 | Electronic device mounting structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20099782U JPS59104592U (en) | 1982-12-29 | 1982-12-29 | Electronic device mounting structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59104592U JPS59104592U (en) | 1984-07-13 |
| JPH0138954Y2 true JPH0138954Y2 (en) | 1989-11-21 |
Family
ID=30426504
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20099782U Granted JPS59104592U (en) | 1982-12-29 | 1982-12-29 | Electronic device mounting structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59104592U (en) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4930430A (en) * | 1972-07-18 | 1974-03-18 | ||
| JPS5466135U (en) * | 1977-10-19 | 1979-05-10 | ||
| JPS56159083A (en) * | 1980-05-08 | 1981-12-08 | Matsushita Electric Industrial Co Ltd | High frequency heater |
-
1982
- 1982-12-29 JP JP20099782U patent/JPS59104592U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59104592U (en) | 1984-07-13 |
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