JPH0140202Y2 - - Google Patents
Info
- Publication number
- JPH0140202Y2 JPH0140202Y2 JP1983166136U JP16613683U JPH0140202Y2 JP H0140202 Y2 JPH0140202 Y2 JP H0140202Y2 JP 1983166136 U JP1983166136 U JP 1983166136U JP 16613683 U JP16613683 U JP 16613683U JP H0140202 Y2 JPH0140202 Y2 JP H0140202Y2
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- circuit board
- printed circuit
- terminal
- pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Transceivers (AREA)
Description
【考案の詳細な説明】
（産業上の利用分野）
本考案はプリント基板への電子部品の実装構造
に係り、特にハンドヘルドトランシーバー等のよ
うな小型電子機器における電子部品の実装に最適
な実装構造に関する。[Detailed description of the invention] (Field of industrial application) The present invention relates to a mounting structure for electronic components on a printed circuit board, and in particular to a mounting structure that is optimal for mounting electronic components in small electronic devices such as handheld transceivers. .
（従来技術）
近時の電子部品は小型化されていて高密度な又
は超小型化した電子回路の実装が可能となつてい
るが、電子部品のなかにはいまだ小型化の困難な
部品もある。例えば、ケミカルコンデンサーやコ
イル等は小型化により５〜６mm程度の高さである
のに対して通信機等に使用されるセラミツクフイ
ルターは８mm程度であり、配置スペースがミリ単
位で設計されるべき小型電子機器においてはその
２〜３mmの差が実装上大きな障害となることがあ
る。(Prior Art) Electronic components have recently been miniaturized, making it possible to mount high-density or ultra-miniaturized electronic circuits, but some electronic components are still difficult to miniaturize. For example, chemical capacitors and coils are miniaturized and have a height of about 5 to 6 mm, while ceramic filters used in communication devices are about 8 mm, so the installation space is small and should be designed in millimeters. In electronic equipment, a difference of 2 to 3 mm may cause a major obstacle in mounting.
上記したセラミツクフイルター等の電子部品を
小型電子機器のプリント基板に実装する場合に、
第１図に示す従来例のように単にプリント基板１
１上に電子部品１２を配置して実装したのでは電
子部品１２の高さが他の電子部品に比較して突出
することとなり、上記したような配置スペース上
の制約がある場合には実装に困難を極める。 When mounting electronic components such as the ceramic filter mentioned above on the printed circuit board of a small electronic device,
As in the conventional example shown in FIG.
If the electronic component 12 is placed and mounted on the top of the electronic component 1, the height of the electronic component 12 will protrude compared to other electronic components. Extremely difficult.
（考案の目的）
本考案の目的は上記した従来の実装構造の欠点
を解消し、実装が容易であるのは勿論電子部品の
実装高さを可及的低くできて小型ハンドヘルドト
ランシーバー等の電子機器の実装に最適な実装構
造を提供することにある。(Purpose of the invention) The purpose of the invention is to eliminate the drawbacks of the conventional mounting structure described above, and to make it easy to mount, as well as to reduce the mounting height of electronic components as much as possible for electronic devices such as small handheld transceivers. The objective is to provide an optimal implementation structure for the implementation of
（考案の構成）
本考案の電子部品の実装構造は、プリント基板
１には電子部品２を倒した状態で嵌合配置する配
置孔３を穿設すると共に該配置孔３の口縁近くに
おいてプリント基板１の一側面側からその基端部
が配線パターンに接続されたピン４を突設し、電
子部品２をその両側の端子５，６でプリント基板
１を挟む形態で上記配置孔３に嵌合配置し、該電
子部品２の一方の端子５を上記ピン４にハンダ付
け接続すると共に他方の端子６をプリント基板１
の他側面側の面の配線パターン８にハンダ付け接
続したものである。(Structure of the invention) The electronic component mounting structure of the invention is such that the printed circuit board 1 is provided with a placement hole 3 in which the electronic component 2 is fitted and placed in an inverted state, and the electronic component 2 is printed near the mouth edge of the placement hole 3. A pin 4 whose base end is connected to the wiring pattern is provided protruding from one side of the board 1, and the electronic component 2 is fitted into the arrangement hole 3 with the printed circuit board 1 sandwiched between terminals 5 and 6 on both sides of the pin 4. One terminal 5 of the electronic component 2 is connected to the pin 4 by soldering, and the other terminal 6 is connected to the printed circuit board 1.
This is connected to the wiring pattern 8 on the other side by soldering.
（実施例）
本考案の電子部品の実装構造をその実施例とし
て示す第２図乃至第５図に基づいて説明する。(Example) The electronic component mounting structure of the present invention will be explained based on FIGS. 2 to 5, which show examples thereof.
図において、１はプリント基板、２はプリント
基板１に実装されるべき電子部品であり、実施例
ではセラミツクフイルターが示されている。３は
電子部品２を嵌合配置するためにプリント基板１
に穿設された配置孔であつて、電子部品２を横に
して配置できる程度の大きさとする。４は上記配
置孔３の口縁近くにおいてプリント基板１の一側
面から突出させたピンであつて、その基端部はプ
リント基板１に形成された配線パターンに接続さ
れている。上記電子部品２は配置孔３内に横に配
置されるが、電子部品２の一方の端子５と他方の
端子６，７でプリント基板１を挟むように配置さ
れ、一方の端子５は上記ピン４にハンダ付け接続
されると共に他方の端子６，７はプリント基板１
の他側面側に形成された配線パターン８にハンダ
付け接続される。 In the figure, 1 is a printed circuit board, 2 is an electronic component to be mounted on the printed circuit board 1, and in the embodiment, a ceramic filter is shown. 3 is a printed circuit board 1 for fitting and arranging electronic components 2;
This is a placement hole drilled in the hole, and is large enough to allow the electronic component 2 to be placed horizontally. Reference numeral 4 denotes a pin protruding from one side of the printed circuit board 1 near the edge of the arrangement hole 3, and its base end is connected to a wiring pattern formed on the printed circuit board 1. The electronic component 2 is placed horizontally in the placement hole 3, and one terminal 5 of the electronic component 2 and the other terminals 6, 7 are placed so as to sandwich the printed circuit board 1, and one terminal 5 is connected to the above-mentioned pin. 4 and the other terminals 6 and 7 are connected to the printed circuit board 1 by soldering.
It is connected by soldering to the wiring pattern 8 formed on the other side.
（考案の効果）
本考案に係る電子部品の実装構造によれば、プ
リント基板１に穿設された配置孔３内に電子部品
２を横にして一方の端子５と他方の端子６とでプ
リント基板１を挟むように配置されると共に一方
の端子５はプリント基板１の一側面側に突設され
たピン４に接続され、他方の端子６はプリント基
板１の他側面側に形成された配線パターン８に接
続されるように構成されているから、電子部品２
は安定的に配置固定されると共に電子部品２が縦
長であつても電子部品２の高さを実質的に低く実
装することができ、電子部品２の実装に高さ制限
を受けるような小型電子機器等の実装構造として
最適である。(Effect of the invention) According to the electronic component mounting structure according to the present invention, the electronic component 2 is placed horizontally in the placement hole 3 drilled in the printed circuit board 1 and printed with one terminal 5 and the other terminal 6. They are arranged to sandwich the board 1, and one terminal 5 is connected to a pin 4 protruding from one side of the printed board 1, and the other terminal 6 is connected to a wiring formed on the other side of the printed board 1. Since it is configured to be connected to pattern 8, electronic component 2
The electronic component 2 can be stably arranged and fixed, and even if the electronic component 2 is vertically long, the height of the electronic component 2 can be mounted substantially low. It is ideal as a mounting structure for equipment, etc.
第１図は従来の電子部品の実装構造を示す側面
図、第２図乃至第５図は本考案に係る電子部品の
実装構造の実施例を示し、第２図は断面側面図、
第３図は平面図、第４図は他の構成例を示す平面
図、第５図は同上底面図である。
１……プリント基板、２……電子部品、３……
配置孔、４……ピン、５……一方の端子、６，７
……他方の端子、８……配線パターン。
FIG. 1 is a side view showing a conventional electronic component mounting structure, FIGS. 2 to 5 show an embodiment of the electronic component mounting structure according to the present invention, and FIG. 2 is a cross-sectional side view;
3 is a plan view, FIG. 4 is a plan view showing another configuration example, and FIG. 5 is a top and bottom view of the same. 1...Printed circuit board, 2...Electronic components, 3...
Arrangement hole, 4... Pin, 5... One terminal, 6, 7
...The other terminal, 8...Wiring pattern.
Claims (1)
嵌合配置する配置孔３を穿設すると共に該配置孔
３の口縁近くにおいてプリント基板１の一側面側
からその基端部が配線パターンに接続されたピン
４を突設し、電子部品２をその両側の端子５，６
でプリント基板１を挟む形態で上記配置孔３に嵌
合配置し、該電子部品２の一方の端子５を上記ピ
ン４にハンダ付け接続すると共に他方の端子６を
プリント基板１の他側面側の面の配線パターン８
にハンダ付け接続したことを特徴とする電子部品
の実装構造。 A placement hole 3 is formed in the printed circuit board 1 in which the electronic component 2 is fitted and arranged in a tilted state, and the base end of the printed circuit board 1 is formed into a wiring pattern from one side of the printed circuit board 1 near the edge of the placement hole 3. The connected pin 4 is provided protrudingly, and the electronic component 2 is connected to the terminals 5 and 6 on both sides.
The electronic component 2 is fitted into the arrangement hole 3 with the printed circuit board 1 sandwiched therebetween, and one terminal 5 of the electronic component 2 is connected to the pin 4 by soldering, and the other terminal 6 is connected to the other side of the printed circuit board 1. Surface wiring pattern 8
An electronic component mounting structure characterized by soldering connection to the electronic component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1983166136U JPS6076058U (en) | 1983-10-28 | 1983-10-28 | Electronic component mounting structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1983166136U JPS6076058U (en) | 1983-10-28 | 1983-10-28 | Electronic component mounting structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6076058U JPS6076058U (en) | 1985-05-28 |
| JPH0140202Y2 true JPH0140202Y2 (en) | 1989-12-01 |
Family
ID=30363795
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1983166136U Granted JPS6076058U (en) | 1983-10-28 | 1983-10-28 | Electronic component mounting structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6076058U (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014143379A (en) * | 2013-01-25 | 2014-08-07 | Canon Inc | Mounting substrate and mounting method of electronic component |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5243970Y2 (en) * | 1972-05-04 | 1977-10-05 | ||
| JPS5243970U (en) * | 1975-09-25 | 1977-03-29 | ||
| JPS57136389A (en) * | 1981-02-17 | 1982-08-23 | Pioneer Electronic Corp | Wiring method |
-
1983
- 1983-10-28 JP JP1983166136U patent/JPS6076058U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6076058U (en) | 1985-05-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS5874399U (en) | Electrical component mounting structure | |
| JPH06101615B2 (en) | Component mounting structure on printed circuit board | |
| JPH02134890A (en) | Circuit element mounting board | |
| JPH0439668Y2 (en) | ||
| JPH0737360Y2 (en) | Integrated circuit parts | |
| JPS598370Y2 (en) | electric circuit unit | |
| JPH0533068Y2 (en) | ||
| JPH0710516Y2 (en) | Hybrid integrated circuit board module | |
| JPH02239577A (en) | Hybrid integrated circuit for surface mounting | |
| JP2524535Y2 (en) | Dielectric filter | |
| JP2510466Y2 (en) | High-density mounting structure | |
| JPH0543601U (en) | Filter mounting structure | |
| JPS6390882U (en) | ||
| JP2002217513A (en) | Connection board structure | |
| JPS59157397U (en) | piezoelectric vibrator | |
| JPH0459182U (en) | ||
| JPH01104731U (en) | ||
| JPH0523568U (en) | Small module mounting device | |
| JPS6076058U (en) | Electronic component mounting structure | |
| JPS60109358U (en) | Block board connection structure | |
| JPH04196396A (en) | Electronic device | |
| JPS5820531U (en) | Leadless single plate ceramic capacitor | |
| JPS5896654U (en) | High frequency switching relay mounting device | |
| JPS6022764U (en) | Connector for printed circuit board mounting | |
| JPS6364391A (en) | Method of high density mounting of electronic parts |