JPH0143459B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a dicing jig and a dicing method for fully automatically dicing a wafer.

In the manufacture of semiconductor integrated circuit devices, a dicing method is generally employed in which a semiconductor wafer is cut into semiconductor elements (pellets) using a blade rotating at high speed. However, in conventional dicing, in order to automate the wafer transportation before and after dicing, a method is adopted in which the wafer is not cut completely in the thickness direction, but is left uncut, so that the wafer retains its shape even after dicing. It was getting worse. For this reason, a wafer breaking step is required as a post-process, which complicates the process, and in the direct pellet deposition method, cracks and chips occur in the pellets, causing a decrease in yield.

For this reason, a method has been proposed in which adhesive tape is attached to the back side of the wafer to prevent the cut pellets from falling apart, and then the wafer is completely cut. However, simply pasting the adhesive tape has the problem that the cut wafer curls together with the tape due to curling of the adhesive tape, making post-process operations such as handling troublesome.

Therefore, an object of the present invention is to have a frame body having a notch in a part of its outer periphery, and an adhesive tape that is attached to one side of the frame body and adheres a wafer to the surface of the frame body. It is an object of the present invention to provide a dicing jig that enables cutting, facilitates handling in post-processes, and enables full automation of dicing.

Another object of the present invention is to adhere a wafer in a predetermined positional relationship to a dicing jig, which is formed by attaching an adhesive tape to one side of an annular frame having a notch on a part of its outer periphery. Additionally, the wafer is positioned using the notch of the dicing jig, and then the wafer is completely cut and handled, thereby performing fully automatic dicing of the wafer.

The gist of the present invention is to adhesively house a semiconductor wafer on an adhesive surface inside a frame of a dicing jig so as to have a predetermined positional relationship with respect to the outer periphery of the frame, and to place the semiconductor wafer on the dicing jig. In a method for dicing a semiconductor wafer in which the semiconductor wafer is diced while being held, the dicing jig is pre-aligned for dicing using the outer peripheral shape of the frame of the dicing jig, and the pre-aligned The method of dicing a semiconductor wafer is characterized in that the dicing jig is transported to a dicing position while the dicing jig is held in a dicing position, and the semiconductor wafer is aligned for dicing with reference to the semiconductor wafer.

Hereinafter, the present invention will be explained with reference to illustrated embodiments.

1 and 2 show a dicing jig according to the present invention, and this dicing jig 1 has an inner diameter larger than the outer diameter of a wafer W to be diced, and a thickness slightly larger than the thickness of the wafer W. It has a frame 2 in the shape of a large annular plate. This frame 2
A linear notch 3 similar to the orientation flat of a wafer is formed in a part of its outer periphery, and is used for positioning as will be described later. On the other hand, an adhesive tape 4 formed in the same shape as the outer shape of the frame is attached under tension to the lower surface of the frame 2. This adhesive tape 4 is made of a relatively thick material, and is designed so that it will not be easily torn even if a portion of the tape is cut in the thickness direction.

As shown in FIG. 2, the wafer W is attached to the upper surface of the adhesive tape 4 in the frame 2 of the dicing jig 1 configured in this manner. This wafer W is attached to the jig 1 in a predetermined relative positional relationship. For example, the center of the jig 1 and the center of the wafer W are aligned, and the notch 3 and the orientation flat W0 are aligned. facing the direction. Incidentally, when attaching the wafer W to the dicing jig 1, an apparatus shown in FIG. 3 is used. That is, while setting the dicing jig 1 at a predetermined position on the fixed table 5,
A pair of microscopes 6, 6 is installed above the jig 1 at a predetermined position. Next, the wafer W is vacuum suctioned to the lower surface of an annular suction head 9 supported by the X arm 7 and the Y arm 8, and is moved onto the jig 1. and,
While observing the wafer surface using the microscopes 6 and 6, the X arm 7 and Y arm 8 are operated to set the wafer at a predetermined position. Thereafter, by moving the suction head 9 downward, the wafer W is stuck to a predetermined position on the dicing jig 1.

Next, a dicing method using the dicing jig having the above configuration will be explained. As shown in FIG. 4, the wafer W is attached to the dicing jig 1 and set in the loader 10, and is transported to the pre-alignment 12 by the transport means 11. The pre-alignment 12 has three rollers 13 for positioning the wafer, and while the dicing jig 1 is rotated by the rotation of the three rollers 13, the notch 3 is aligned with the three rollers 13 for positioning. Next, the dicing jig 1 is transferred to a conveying means (not shown).
is transported to the alignment position 15, where it is placed on the dicing table 16. On the dicing table 16, the wafer W is
Fine alignment is performed using the wafer as a reference, but since positioning is performed via jig 1 during pre-alignment, the wafer is almost aligned, and this alignment is completed in a very short time. . After that, dicing tape bull 16
wafer W and jig 1 at dicing position 17
5, and dicing is completed over the entire thickness of the wafer W and a portion of the adhesive tape 4, as shown in FIG.

After completion of dicing, jig 1 is used for spinner cleaning 1.
8 and is cleaned while being rotated at high speed. At this time, since the dicing jig 1 is circular, it will not lose its balance due to high speed rotation. and,
After drying or while being dried, the conveying means 19
The wafer is then moved to the unloader 20, and the entire dicing process is completed.

Therefore, in the above dicing method, the wafer can be diced while the dicing jig 1 is being transported, aligned, and cleaned in the same way as the wafer, so the wafer can be handled easily and the wafer can be easily handled. To facilitate positioning, etc., and to facilitate dicing work. In addition, even if the wafer is completely cut, the wafer can be kept in the same state as before dicing.
Makes handling easier in post-processing,
It is possible to automate not only dicing but also the process up to adding pellets.

Here, the wafer W for the dicing jig 1 is
The adhesion position is not limited to the above example as long as the positional relationship between the two is constant. Furthermore, the shape of the notch formed on the outer periphery of the dicing jig 1 can be changed as appropriate in accordance with the alignment.

As described above, according to the dicing jig of the present invention, the adhesive tape is attached to the annular plate-shaped frame having a notch, and the wafer is attached to the surface of the adhesive tape. Full automation of dicing can be achieved by making handling easy even when complete cutting is performed. Furthermore, according to the dicing method of the present invention, the above-mentioned dicing jig is used to perform pre-alignment, alignment, dicing, cleaning, etc., so that wafer alignment, dicing work, and handling work in subsequent processes can be easily performed. This makes it possible to save labor in the dicing process and improve yield.

[Brief explanation of drawings]

Fig. 1 is a perspective view of the dicing jig of the present invention, Fig. 2 is a sectional view thereof, Fig. 3 is a sectional view showing a device for sticking a wafer to the dicing jig, and Fig. 4 is a step of the method of the present invention. FIG. 5 is a sectional view showing the dicing state. 1... Dicing jig, 2... Frame, 3... Notch, 4... Adhesive tape, 10... Loader, 12
...Pre-alignment, 15...Alignment,
17...Dicing, 18...Spinner cleaning, 2
0...Unloader, W...Wafer.

Claims (1)

[Scope of Claims] 1. A semiconductor wafer is adhesively housed on an adhesive surface inside a frame of a dicing jig so as to have a predetermined positional relationship with respect to the outer periphery of the frame, and the semiconductor wafer is attached to the dicing jig. In the method for dicing a semiconductor wafer, the dicing jig is pre-aligned for dicing using the outer peripheral shape of the frame of the dicing jig, and the pre-alignment transporting the dicing jig to the dicing position while maintaining the dicing jig in the dicing position;
A method for dicing a semiconductor wafer, comprising aligning the semiconductor wafer for dicing using the semiconductor wafer as a reference. 2. A part of the frame has a notch surface corresponding to the orientation flat surface of the semiconductor wafer, and the notch surface and the orientation flat surface of the semiconductor wafer are approximately parallel to each other. Claim 1 characterized by alignment
A method for dicing a semiconductor wafer as described in Section 1. 3. The semiconductor wafer dicing method according to claim 2, wherein the pre-alignment is automatically performed using the notch surface.