JPH0144621B2 - - Google Patents

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention is based on the invention, for example, by applying an adhesive film to a wafer such as silicon, which serves as a base for forming an integrated circuit, and a ring frame, such as a circular ring, which serves as a carrier jig for the wafer. The present invention relates to a method and apparatus for semi-automatically or fully automatically winding up unnecessary tape after pasting a tape on the ring frame, cutting the pasted tape into a circular shape on a ring frame, and winding up the tape that is no longer needed.

[Conventional technology]

Conventionally, the above-mentioned ring-shaped carrier jig, that is, the attachment of the film to the ring frame and the attachment of silicon wafers to the film, were all done by hand, and the cutting of the film that protruded from the periphery of the ring frame was also done manually. I was doing it at work.

[Problem that the invention seeks to solve]

The conventional manual pasting method as described above is extremely time-consuming, difficult to apply without wrinkles, and requires skill.

Additionally, there are semi-automatic types, but they have problems such as the need to remove unnecessary tape after pasting.

[Means for solving problems]

In order to solve the above problems, the present invention supports a wafer and a ring frame surrounding the wafer on a table in a fixed position, and then removes the tape sticking unit and unnecessary tape that were waiting behind the table. advance the winding unit of
Pull the tape with the adhesive side down onto the wafer and ring frame, then lower the adhesive unit until the tape on the lower side of its adhesive roller contacts the wafer and ring frame, and then When the unit is moved back to the standby position leaving the winding unit behind, the tape is pasted onto the wafer and ring frame by the pasting roller of this pasting unit, and then the ring is removed by operating the cutting unit on the side of the table. A method for cutting out a circular shape from the tape on a frame and then winding up unnecessary tape other than the portion stuck to the wafer and ring frame on a take-up reel when the take-up unit is retreated to the standby position, and this method The present invention provides an apparatus for implementing the method.

〔Example〕

The drawing shows an example of an apparatus for carrying out the method of the present invention. Reference numeral 1 denotes a support plate supported on a substrate 7 by a plurality of supports 2, and a table is provided above the support plate 1. It consists of a fixed table 4 and a floating table 5.

The fixed table 4 is attached to a plurality of supports 3 on the support plate 1, and the floating table 5 is cylindrical, and the support legs 6 at the lower end of the floating table 5 fit into the guide holes of the support plate 1 so as to be able to move up and down. 4 opening 1
1 with some play, push up the floating table 5 with the spring 8 so that the top surface of the floating table 5 is almost flush with the top surface of the fixed table 4, and press the stopper 9.
to limit the upper limit. Further, this table 5 is provided with an appropriate rotation prevention mechanism.

A shallow recess or mark for positioning the wafer 10 is provided on the table 5, and a plurality of vacuum suction holes are provided so that the wafer 10 on the table 5 is fixed by vacuum suction, and the fixing table 4 is similarly A vacuum suction type is used.

14 in FIG. 1 is a pair of left and right bearings fixed on the substrate 7 in front of the installation part such as the support plate 1;
Reference numeral 15 designates a pair of left and right bearings fixed on the substrate 7 at the rear of the support plate 1 and the like.

Each bearing 14, 15 has a front and rear horizontal shaft 16, 1.
7 is rotatably supported, and each of the horizontal shafts 16, 1
The front ends of levers 18 and 19 facing rearward are fixed to both ends of the lever 7, respectively.

The left and right levers 18 and 19 are connected by left and right rods 20 as shown in FIG.
8 and 19 are made to swing up and down at the same angle at the same time.

21 and 22 are the front and rear lifting frames, and the front lifting frame 21
The lower ends of both side frames 23 are connected to each lever 18 by a shaft.
Both side frames 2 of the rear lifting frame 22 are connected to the rear end.
The lower end of each lever 4 is connected to the rear end of each lever 19 by a shaft.

Further, the front and rear ends of a pair of left and right guide rails 25 are fixed to the upper parts of the front side frames 23 and the rear side frames 24, and both ends of a pair of left and right frame members 26 are fixed to the lower parts of the same side frames 23 and 24. The elevating frames 21 and 22 are fixedly coupled together so that the guide rail 25 can be moved up and down in a horizontal state.

Further, as shown in FIG. 1, a roller 28 is provided in the middle of the rear lever 19, and an actuator 29 such as an electromagnet or an air cylinder is provided on the substrate 7 below the roller 28 to push the lever 19 upward.
Further, a support stand 30 is provided on the substrate 7 to support each of the side frames 23 and 24 at its lower limit.

A is a tape application unit. This unit A has a guide roller 32 and a sticking roller 33 rotatably installed above and below between a pair of left and right side frames 31 that advance and retreat along the guide rail 25.

B is a unit for winding up unnecessary tape. This unit B has upper and lower peeling rollers 36 rotatably installed between a pair of left and right side frames 35 that advance and retreat along the guide rail 25 as a means for peeling off unnecessary tape.

As shown in Fig. 1, both side frames 23 of the front lifting frame 21
A pair of upper and lower horizontal shafts 38, 39 are rotatably supported on the rear lifting frame 22, and a pair of upper and lower horizontal shafts 40, 41 are rotatably supported on both side frames 24 of the rear elevator frame 22.

Pulleys 42 and 43 are fixed to both ends of the upper horizontal shafts 38 and 40, respectively, and an endless timing belt 44 is applied thereto, and a part of the timing belt 44 is connected to the side frame 31 of the tape application unit A by a connecting piece 45. The timing belt 44 is connected by connecting the timing belt 44 with
The adhesion unit A is configured to move forward and backward through.

Both ends of the lower horizontal shafts 39 and 41 are connected to the upper horizontal shaft 3.
Pulleys 47 and 48 are fixed by protruding outward from both ends of the winding units 8 and 40, respectively, and an endless timing belt 49 is applied to the pulleys 47 and 48, and a part of the belt and the side frame 35 of the winding unit B are connected to each other as shown in FIG. The winding unit B is connected by an inverted L-shaped connecting frame 50 such as the one shown in FIG.
It is configured so that it advances and retreats.

Reference numeral 51 in FIGS. 1 to 3 denotes a pair of left and right mounting frames fixed on the board 7 on the sides of the installation part such as the support plate 1, and one end of the support frame 52 is attached to the upper end of both mounting frames 51. The arm 53 is attached to a shaft 54 so as to be able to rise and fall freely.

An opening 55 is provided in the center of the support frame 52, which is concentric with the opening 11 of the table 4 when the frame 52 is horizontal, and a circular guide rail 56 with a T-shaped cross section is provided on the upper outer periphery of this opening 55. .

C in Fig. 3 is the cutting unit, and the guide rail 5
6 and a freely rotating disk-shaped cutter 58 attached to this member 57. A handle 5 is also provided on this moving member 57.
9 will be provided.

In FIG. 1, 60 is a tape reel, 62 is a guide roller, and 64 is a separator winding shaft, all of which are attached to a frame (not shown).

63 is the bearing 3 on the side frame 35 of the winding unit B.
This is a take-up reel for unnecessary tape supported by 7.

A reversal prevention device is provided on either of the rollers 32, 33 of the above-mentioned sticking unit A, so that when the unit A moves forward, the tape 61 is pulled out without rotating, and when it returns, it rotates, and the peeling roller 36
A reversal prevention device is provided on either of the rollers 3 and 3, so that while the adhesive unit A is retreating from the forward position, the adhesive roller 3 of the adhesive unit A is
While applying the tape 61 in step 3, the peeling roller 36
To prevent the tape 61 from loosening, the tape 61 cannot be reversed.

It is pulled out from the reel 60 and the separator 6
The tape 61 from which the tape 5 has been separated passes through the guide roller 62 and over the guide roller 32 of the pasting unit A.
The winding reel 63 goes around the rear part of the lower adhesive roller 33, goes around from the lower side to the front side of the lower roller 36 of the winding unit B with the adhesive side facing down, passes from the lower side to the rear side of the upper roller 36, and then the winding reel 63 The separator 65 is wound around the winding shaft 64.

Next, to explain the operation, the wafer 10 and the ring frame 12 are placed on the floating table 5 and the fixed table 4, respectively, and the wafer 10 and the ring frame 12 are placed on the floating table 5 and the fixed table 4, and the wafer 10 and the ring frame 12 are fixed by vacuum suction or the like, and the cutting unit C is turned upward as shown in Fig. 3. The units A and B are moved to the position shown in FIG. Start moving forward to the right. As a result, the tape 61 is stretched over the wafer 10 and the ring frame 12 as shown in FIG.

Next, the actuator 29 returns and each unit A, B is lowered, and only the sticking unit A returns to its original position. On the way, the sticking roller 33 moves the tape 61 onto the wafer 10 and the ring frame 12. Attach as shown in Figure 5.

Thereafter, the cutting unit C is rotated downward as shown by the chain line in FIG.
7 along the guide rail 56 about twice, and the cutter 58 cuts the tape 61 into a circular shape on the ring frame 12.

After cutting the tape 61 in this manner, the cutting unit C is raised to the position indicated by the solid line in FIG. When the take-up unit B is moved backward and the tape 61 is taken up by the take-up reel 63, the unnecessary tape 61', which leaves the tape attached to the ring frame 12 and the wafer 10, is taken up by the take-up reel 63. Unit B returns to its original position as shown in Figure 1, completing one stroke.

The cutting unit C is moved up and down automatically, and when it is lowered, the cutter automatically rotates to cut the tape, and is moved in conjunction with the operations of the other units A and B. Then it will be fully automatic.

[Effects] As described above, this invention uses an adhesive unit to automatically attach the adhesive tape to the wafer on the table and the ring frame surrounding the wafer, so it is more effective than the conventional manual attachment method. This allows even non-experts to apply tape accurately. In addition, in the illustrated example, only the cutter of the cutting unit is manually operated, but the cutter moves along the guide rail, so cutting is easy, and the excess tape after cutting is automatically peeled off by the winding unit. Therefore, the peeling work can be carried out extremely efficiently, and it has the advantage of being easy to fully automate.

[Brief explanation of drawings]

Fig. 1 is a vertical side view showing an embodiment of the apparatus for carrying out the method of the present invention, Fig. 2 is a plan view of the same, Fig. 3 is a front view of the same, and Figs. 4 and 5 show the operation of the main parts. FIG. 4...Fixed table, 5...Floating table, 10...Wafer, 12...Ring frame, 61
...tape, A...tape sticking unit, B...tape winding unit, C...cutting unit.

Claims (1)

[Claims] 1. After supporting the wafer and the ring frame surrounding the wafer on a table in a fixed position, the tape sticking unit and unnecessary tape winding unit that were waiting behind the table are moved forward. then pull the tape with the adhesive side down onto the wafer and ring frame, then attach the adhesive unit.
After lowering the adhesive roller to a position where the tape on the lower side contacts the wafer and the ring frame, the adhesive unit is moved back to the standby position, leaving the take-up unit behind. The tape is pasted onto the wafer and the ring frame by the rollers, and then the tape on the ring frame is cut out in a circular shape by operating the cutting unit on the side of the table.Then, when the winding unit is retreated to the standby position, the wafer is A method for bonding a wafer and a ring frame, characterized in that unnecessary tape other than the portion affixed to the ring frame is wound onto a take-up reel. 2. The front and rear ends of the pair of left and right guide rails are fixed to the lifting frame, which is placed in front and behind the table that supports the wafer and the ring frame surrounding the wafer, and which are integrally connected by a frame material, and the lifting frame is raised and lowered. A driving means is provided, and a tape adhering unit and a winding unit for unnecessary tape located in front of the tape adhering unit are mounted on the guide rail so as to be able to move forward and backward, and a driving means is provided to drive both of these units separately. When this pasting unit moves up together with the unnecessary tape winding unit and moves forward from the standby position at the rear end,
A guide roller that spreads the tape pulled out from the tape reel behind it over the wafer and ring frame, and a pasting unit in the forward position descending and returning to the standby position, spread the tape over the wafer and ring frame. Adhering rollers for adhering are provided above and below, and a raised position on the side of the table that does not impede the movement of both units, and an elevated position that approaches the tape adhered to the wafer and ring frame. A cutting unit is provided which is movable into two lowered positions, and this cutting unit is provided with a circular guide rail that is concentric with the ring frame in the lowered position, and which guide rail has a circular guide rail that is movable in the lowered position of the cutting unit. A movable member having a cutter for cutting the tape on the ring frame in a circular shape is attached to the unnecessary tape winding unit, and when the pasting unit returns to the standby position and the tape is cut, it is moved back. A wafer and ring frame bonding device characterized by being provided with a peeling means for peeling off unnecessary tape between both units from a ring frame on a table, and a take-up reel for winding up the peeled off unnecessary tape.