JPH0145122Y2 - - Google Patents
Info
- Publication number
- JPH0145122Y2 JPH0145122Y2 JP1983198763U JP19876383U JPH0145122Y2 JP H0145122 Y2 JPH0145122 Y2 JP H0145122Y2 JP 1983198763 U JP1983198763 U JP 1983198763U JP 19876383 U JP19876383 U JP 19876383U JP H0145122 Y2 JPH0145122 Y2 JP H0145122Y2
- Authority
- JP
- Japan
- Prior art keywords
- line
- metal casing
- board
- microstrip
- microstrip line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Waveguides (AREA)
Description
【考案の詳細な説明】
〔考案の技術分野〕
本考案は金属筐体の表裏面にネジ止めされたマ
イクロストリツプ線路基板のマイクロストリツプ
線路同士を同軸線路にて接続して得られるマイク
ロストリツプ線路装置に関する。[Detailed description of the invention] [Technical field of the invention] The invention is obtained by connecting microstrip lines on a microstrip line board screwed to the front and back surfaces of a metal casing using a coaxial line. This invention relates to a microstrip line device.
従来より、金属筐体上に取着されたマイクロス
トリツプ線路基板を用いマイクロ回路を形成する
場合、スペースの有効利用ならびに回路実装密度
を高めるために、前記金属筐体の表裏面に前記線
路基板を取着し、マイクロ波回路を構成すること
が行われてきた。このとき金属筐体を挾んで対向
する前記線路基板上のマイクロストリツプ線路同
士を接続する際には、同軸線路が用いられてい
る。
Conventionally, when forming a microcircuit using a microstrip line board mounted on a metal casing, the lines are placed on the front and back surfaces of the metal casing in order to effectively utilize space and increase circuit mounting density. A microwave circuit has been constructed by attaching a substrate. At this time, a coaxial line is used to connect the microstrip lines on the line boards facing each other with the metal casing in between.
第１図に上記従来のマイクロストリツプ線路装
置における同軸線路接続部の断面図を示す。図に
おいて、金属筐体１の表裏面にはマイクロストリ
ツプ線路基板２がネジ３により取着されている。
この線路基板２の裏面、すなわち金属筐体１と接
触する面には接地導体４が被着されており、また
表面にはマイクロストリツプ線路５が形成されて
いる。このストリツプ線路同士５，５は、同軸線
路６により接続されている。この同軸線路６は金
属筐体１に穿設された孔７に挿入される誘電体
８、ならびにこの誘電体８の中心に位置する内導
体９により構成されており、誘電体８の周縁に接
触する金属筐体１０自身が同軸線路６の外導体と
なつている。 FIG. 1 shows a cross-sectional view of a coaxial line connection portion in the above-mentioned conventional microstrip line device. In the figure, a microstrip line board 2 is attached to the front and back surfaces of a metal casing 1 with screws 3.
A ground conductor 4 is adhered to the back surface of the line board 2, that is, the surface in contact with the metal casing 1, and a microstrip line 5 is formed on the front surface. The strip lines 5, 5 are connected to each other by a coaxial line 6. This coaxial line 6 is composed of a dielectric 8 inserted into a hole 7 drilled in the metal casing 1, and an inner conductor 9 located at the center of the dielectric 8, and is in contact with the periphery of the dielectric 8. The metal casing 10 itself serves as the outer conductor of the coaxial line 6.
上記において使用される同軸線路６はその特性
インピーダンスが、定在波の影響を防ぐために、
接続されるマイクロストリツプ線路５の特性イン
ピーダンスと等しいものが用意される。このと
き、前記特性インピーダンスを確保する上で特に
留意しなければならない点は、線路基板２の接地
導体４の端部１１が金属筐体１と確実に接触する
ようにすることである。これが満たされない場
合、同軸線路６と端部１１との接触部における特
性インピーダンスは所望の値とはならない。この
ため、第１図に示した従来例では、端部１１の接
地を確保をするため、端部１１の近傍において線
路基板２を金属筐体１にネジ止めしている。 The characteristic impedance of the coaxial line 6 used in the above is such that in order to prevent the influence of standing waves,
A line having the same characteristic impedance as the microstrip line 5 to be connected is prepared. At this time, in order to ensure the characteristic impedance, special attention must be paid to ensuring that the end 11 of the ground conductor 4 of the line board 2 is in reliable contact with the metal casing 1. If this is not satisfied, the characteristic impedance at the contact portion between the coaxial line 6 and the end portion 11 will not have a desired value. Therefore, in the conventional example shown in FIG. 1, the line board 2 is screwed to the metal casing 1 near the end 11 in order to ensure that the end 11 is grounded.
しかしながら、このような工夫を凝らしても第
２図に示す如く、筐体１の基板取付面１２の凹凸
や、第３図に示す線路基板２のそり１３により、
端部１１の接地は確保し難いものであつた。特に
線路基板２は、その裏面には接地導体４として銅
箔が一面に被着されており、さらに誘電体基材１
４が貼り合わされた構造となつている。すなわ
ち、熱膨張率の異なる物質同士が貼り合わされた
構造であるため、温度変化に対する線路基板２の
そり１３は、顕著に発生するものであり、このそ
り１３による端部１１の接地不良は是非とも改善
しなくてはならない問題点であつた。 However, even with these efforts, the unevenness of the board mounting surface 12 of the housing 1 as shown in FIG. 2 and the warpage 13 of the line board 2 shown in FIG.
It was difficult to ensure that the end portion 11 was grounded. In particular, the line board 2 is coated with copper foil as a ground conductor 4 on its back surface, and further has a dielectric base material 1
4 are glued together. In other words, since it has a structure in which materials with different coefficients of thermal expansion are bonded together, warpage 13 of the line board 2 due to temperature changes occurs significantly, and grounding failure of the end portion 11 due to this warp 13 is inevitable. This was a problem that needed to be improved.
本考案は上記の問題点に鑑み成されたものであ
り、マイクロストリツプ線路基板の端部の接地を
確実に行い得るマイクロストリツプ線路装置を提
供することを目的とする。
The present invention has been developed in view of the above-mentioned problems, and an object of the present invention is to provide a microstrip line device in which the end of a microstrip line board can be reliably grounded.
本考案は上記の目的を果すため、金属筐体に穿
設された同軸線路嵌合用の孔の周縁に隆起部を設
け、この隆起部において線路基板端部との接触を
はかり、以つて端部の接地を確実なものとするも
のである。
In order to achieve the above object, the present invention provides a raised part on the periphery of a hole for fitting a coaxial line drilled in a metal casing, and makes contact with the end of the line board at this raised part. This is to ensure that the ground is securely grounded.
以下、本考案の一実施例を第４図を用いて説明
する。本考案の特徴は、同軸線路６が挿入される
金属筐体１の孔７の周縁に隆起部１５を設けたこ
とにあり、この隆起部１５により線路基板２の端
部１１の接地を行う点にある。このとき隆起部１
５の高さは、金属筐体１の基板取付面１２の面精
度（凹凸）、ならびに温度変化による基板２のそ
り等を考慮し、十分な高さに設定される。
An embodiment of the present invention will be described below with reference to FIG. The feature of the present invention is that a raised part 15 is provided on the periphery of the hole 7 of the metal housing 1 into which the coaxial line 6 is inserted, and the end part 11 of the line board 2 is grounded by this raised part 15. It is in. At this time, the raised portion 1
The height of 5 is set to a sufficient height in consideration of the surface precision (unevenness) of the board mounting surface 12 of the metal casing 1 and warping of the board 2 due to temperature changes.
また、上記隆起部１５は、第４図に示すとお
り、孔１４の周縁側つまり線路基板２の端部１１
側から傾斜を有して形成されている。そのため、
端部１１での接地が基板取付面１２の面精度によ
らず確実に行なえるという効果を有するものであ
る。 Further, as shown in FIG.
It is formed with a slope from the side. Therefore,
This has the effect that grounding at the end portion 11 can be performed reliably regardless of the surface accuracy of the board mounting surface 12.
上述の如く、孔７の周縁に隆起部１５を設け、
これにより端部１１を接地することにより、基板
取付面１２に凹凸があつたり、また温度変化によ
り基板２にそりが発生しても、端部１１は常に確
実に接地されることになる。これにより、同軸線
路６と端部１１との接触部における特性インピー
ダンスは一定の所望の値にすることができ、確実
にインピーダンス整合をとることができる。
As mentioned above, the raised portion 15 is provided on the periphery of the hole 7,
By grounding the end 11, the end 11 can always be reliably grounded even if the board mounting surface 12 is uneven or the board 2 warps due to temperature changes. Thereby, the characteristic impedance at the contact portion between the coaxial line 6 and the end portion 11 can be set to a constant desired value, and impedance matching can be achieved reliably.
また、同軸線路６の内導体９を例えば発振回路
の電源ラインとして用いる場合には、内導体９に
は不要輻射等が混入しないようにする必要があ
る。この場合、誘電体８０を高誘電率な物質に選
べば、貫通タイプのコンデンサと同様の機能を同
軸線路６にもたせることができる。このとき、本
考案では誘電体８０が隆起部１５の部分まで伸長
挿入されているため、従来の誘電体８に比べ、そ
の内導体９の挿入方向の誘電体長が長くなつてい
る。これにより、不要輻射等を除去するフイルタ
効果が従来に比べ増すという効果も併せ持つてい
る。 Furthermore, when the inner conductor 9 of the coaxial line 6 is used, for example, as a power supply line for an oscillation circuit, it is necessary to prevent unnecessary radiation from entering the inner conductor 9. In this case, if a material with a high dielectric constant is selected for the dielectric 80, the coaxial line 6 can have the same function as a feed-through type capacitor. At this time, in the present invention, the dielectric 80 is inserted in an extended manner up to the raised portion 15, so the length of the dielectric in the insertion direction of the inner conductor 9 is longer than that of the conventional dielectric 8. This also has the effect of increasing the filter effect for removing unnecessary radiation etc. compared to the conventional method.
第１図、第２図、第３図は従来のマイクロスト
リツプ線路装置の断面図、第４図は本考案のマイ
クロストリツプ線路装置の一実施例に係る断面図
である。
１……金属筐体、２……マイクロストリツプ線
路基板、３……ネジ、４……接地導体、５……マ
イクロストリツプ線路、６……同軸線路、７……
孔、１５……隆起部。
1, 2, and 3 are sectional views of a conventional microstrip line device, and FIG. 4 is a sectional view of an embodiment of the microstrip line device of the present invention. 1...Metal casing, 2...Microstrip line board, 3...Screw, 4...Grounding conductor, 5...Microstrip line, 6...Coaxial line, 7...
Hole, 15... Protuberance.
Claims (1)
板をネジ止めし、前記線路基板の表面に形成され
たマイクロストリツプ線路同士を前記線路基板な
らびに金属筐体を貫通する同軸線路にて接続して
得られるマイクロストリツプ線路装置において、 前記同軸線路が挿入されている前記金属筐体に
穿設された孔の周縁に該周縁側から傾斜を有する
隆起部を設け、この隆起部の前記周縁側と前記線
路基板裏面に被着された接地導体とを接触させる
ことを特徴とするマイクロストリツプ線路装置。[Claims for Utility Model Registration] A microstrip line board is screwed to the front and back surfaces of a metal casing, and the microstrip lines formed on the surface of the line board are connected to each other between the line board and the metal casing. In a microstrip line device obtained by connecting with a penetrating coaxial line, a raised portion having an inclination from the periphery side is provided on the periphery of a hole drilled in the metal casing into which the coaxial line is inserted. A microstrip line device characterized in that the peripheral edge side of the raised portion is brought into contact with a ground conductor attached to the back surface of the line substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19876383U JPS60108001U (en) | 1983-12-27 | 1983-12-27 | Microstrip line equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19876383U JPS60108001U (en) | 1983-12-27 | 1983-12-27 | Microstrip line equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60108001U JPS60108001U (en) | 1985-07-23 |
| JPH0145122Y2 true JPH0145122Y2 (en) | 1989-12-27 |
Family
ID=30758056
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19876383U Granted JPS60108001U (en) | 1983-12-27 | 1983-12-27 | Microstrip line equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60108001U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015050534A (en) * | 2013-08-30 | 2015-03-16 | 日立金属株式会社 | Antenna device |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5116704U (en) * | 1974-07-24 | 1976-02-06 | ||
| JPS56701A (en) * | 1979-06-15 | 1981-01-07 | Fujitsu Ltd | Microwave module |
-
1983
- 1983-12-27 JP JP19876383U patent/JPS60108001U/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015050534A (en) * | 2013-08-30 | 2015-03-16 | 日立金属株式会社 | Antenna device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60108001U (en) | 1985-07-23 |
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