JPH0145280B2 - - Google Patents
Info
- Publication number
- JPH0145280B2 JPH0145280B2 JP2155582A JP2155582A JPH0145280B2 JP H0145280 B2 JPH0145280 B2 JP H0145280B2 JP 2155582 A JP2155582 A JP 2155582A JP 2155582 A JP2155582 A JP 2155582A JP H0145280 B2 JPH0145280 B2 JP H0145280B2
- Authority
- JP
- Japan
- Prior art keywords
- diaphragm
- coating
- substrate
- alloy
- vibrating body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
- H04R7/00—Diaphragms for electromechanical transducers; Cones
- H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Diaphragms For Electromechanical Transducers (AREA)
Description
【発明の詳細な説明】
この発明はスピーカー、マイクロホンの振動
板、ピツクアツプカートリツジのカンチレバー等
の音響変換器用振動体、特にMg又はMg合金を
基体とした前記振動体の改良に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a vibrating body for an acoustic transducer such as a diaphragm of a speaker, a microphone, a cantilever of a pickup cartridge, etc., and particularly relates to an improvement of the vibrating body based on Mg or an Mg alloy.
この種の振動体をたとえばスピーカー用振動板
を例にして以下説明すると、従来スピーカーの振
動板材料として、たとえばAl、Ti等の金属材料
が使用されているが、密度が大きい点、内部ロス
(tanδ)が小さい点でスピーカー用振動板として
必ずしも満足していたものではなかつた。 This type of vibrating body will be explained below using a speaker diaphragm as an example. Conventionally, metal materials such as Al and Ti are used as diaphragm materials for speakers, but they have high density and internal loss ( The material was not necessarily satisfactory as a diaphragm for speakers due to its small value (tan δ).
そこで、低密度で内部ロスの大きい金属として
Mg又はMgを主成分とする合金(以下単にMg合
金と記す)が振動板材料として考えられている。 Therefore, as a metal with low density and large internal loss,
Mg or an alloy containing Mg as a main component (hereinafter simply referred to as Mg alloy) is considered as a diaphragm material.
しかるに周知のごとく、Mg又はMg合金は化
学的に非常に活性であり空気中の酸素、湿気、そ
の他の腐蝕性ガスによつて簡単に腐蝕し実用に供
することができない。 However, as is well known, Mg or Mg alloys are extremely chemically active and are easily corroded by oxygen, moisture, and other corrosive gases in the air, making them unsuitable for practical use.
その為、Mg又はMg合金の表面に耐蝕性の被
膜を形成し、振動板基体であるMg又はMg合金
を空気から遮断する必要がある。 Therefore, it is necessary to form a corrosion-resistant coating on the surface of Mg or Mg alloy to isolate Mg or Mg alloy, which is the base of the diaphragm, from the air.
このような被膜を形成する手段としては合成樹
脂をコーテングする手段、化学メツキ法、真空メ
ツキ法による耐蝕性被膜の形成、あるいは耐蝕性
のすぐれた酸化物、その他の化合物をスパツタリ
ング法又はイオンプレーテング法を用いて基体に
被膜を形成する手段が考えらている。 Methods for forming such a film include coating with synthetic resin, chemical plating, vacuum plating to form a corrosion-resistant film, or sputtering or ion plating of oxides or other compounds with excellent corrosion resistance. A method of forming a film on a substrate using a method has been considered.
しかるに、前記の合成樹脂をコーテングする手
段においては、溶剤に溶かした合成樹脂溶液を塗
付後、乾燥する工程において、合成樹脂溶液が重
力によつて流動し、コーテングの厚さムラが発生
し、かつコーテング属の厚さが比較的大きい事か
ら、振動板の特性に影響を与え、かつ重量増加に
よる変換効率の減少を招く。 However, in the method of coating the synthetic resin described above, in the process of applying and drying the synthetic resin solution dissolved in a solvent, the synthetic resin solution flows due to gravity, causing uneven thickness of the coating. Moreover, since the thickness of the coating is relatively large, it affects the characteristics of the diaphragm and causes a decrease in conversion efficiency due to an increase in weight.
又化学メツキによる手段は有害な処理廃液が工
害の原因となり、処理装置に多大の費用を必要と
する。 In addition, when using chemical plating, harmful processing waste liquid causes construction damage, and a large amount of cost is required for processing equipment.
更に、真空メツキ、スパツタリング、イオンプ
レーテイングによる被膜はピンホールや微少なク
ラツクが発生し、基体と空気とを完全に遮断する
ことができず、又上記手段により得られる被膜は
金属被膜であるため振動板重量が増大し、変換効
率の減少を招く等の欠点を有する。 Furthermore, coatings obtained by vacuum plating, sputtering, and ion plating have pinholes and minute cracks, and cannot completely isolate the substrate from air, and the coatings obtained by the above methods are metal coatings. This has drawbacks such as increased weight of the diaphragm and decreased conversion efficiency.
そこで、この発明では被膜に比較的密度の小さ
いフエノール樹脂を用い、又当該樹脂を被膜する
にあたり高周波スパツタリングを用い、極めて薄
い被膜層を形成した振動板であり、以下実施例に
ついて更に詳しく説明する。 Therefore, in the present invention, a phenolic resin having a relatively low density is used for the coating, and high frequency sputtering is used to coat the resin to form an extremely thin coating layer.Examples will be described in more detail below.
真空度10-2〜10-3TorrのArガス雰囲中におい
て、ターゲツト電極にフエノール樹脂を、基体を
配置すべき他の電極に予め所望の形状、たとえば
ドーム状に形成したMg基体をそれぞれ配置し両
電極間に直流電圧を重畳した周波数13.56MHzの
高周波電力(約200W)を供給する。 In an Ar gas atmosphere with a vacuum degree of 10 -2 to 10 -3 Torr, place the phenol resin on the target electrode, and place the Mg substrate previously formed in a desired shape, for example a dome shape, on the other electrode where the substrate should be placed. Then, high-frequency power (approximately 200W) with a frequency of 13.56MHz with a DC voltage superimposed between both electrodes is supplied.
するとArガスがイオン化されたAr+となりタ
ーゲツトであるフエノール樹脂の表面に弾性又は
非弾性衝突し、この衝突によつてターゲツト表面
のフエノール樹脂破壊されて分子ないしはラジカ
ル状態でたたき出された粒子が振動板基体表面に
堆積する。 Then, the Ar gas becomes ionized Ar + and collides elastically or inelastically with the surface of the target phenolic resin, and this collision destroys the phenolic resin on the target surface, causing the particles ejected in a molecular or radical state to vibrate. Deposits on the surface of the plate substrate.
そして、堆積した粒子は再び重合反応により高
分子化する。 The deposited particles are then polymerized again through a polymerization reaction.
このようにして得られたフエノール樹脂の被膜
は前述のごとく再度高分子化されたものであるの
で極めて密であつてピンホールや微少なクラツク
の発生は全く見られない。 Since the phenolic resin coating thus obtained has been polymerized again as described above, it is extremely dense and shows no pinholes or minute cracks.
又被膜の厚さは0.1μmオーダーで薄く成層でき
るので被膜による振動板の重量増加は無視でき得
る程度であり、実質的に変換効率に影響を与えな
い。 Furthermore, since the coating can be formed as thin as 0.1 μm in thickness, the increase in the weight of the diaphragm due to the coating is negligible and does not substantially affect the conversion efficiency.
このように、この発明によれば上記実施例にお
いて詳細に説明したごとく、振動体表面が高周波
スパツタリングによる極めて薄く、かつ密なフエ
ノール樹脂被膜で被覆されているので、基体であ
るMg又はMg合金と空気とを完全に遮断し基体
の腐蝕を完全に防止でき、かつ当該被膜による重
量増加は無視でき得る程小さく、実質的に変換効
率の減少を防止することができる利点を有する。 In this way, according to the present invention, as explained in detail in the above embodiments, the surface of the vibrating body is coated with an extremely thin and dense phenolic resin film formed by high-frequency sputtering, so that it can be coated with an extremely thin and dense phenol resin film that is formed by high-frequency sputtering. It has the advantage that it can completely block air and completely prevent corrosion of the substrate, and that the increase in weight due to the coating is negligibly small, and that a reduction in conversion efficiency can be substantially prevented.
以上の説明をスピーカー用振動板について説明
したが、マイクロホン用振動板、ピツクアツプカ
ートリツジのカンチレバー等に適用できるもので
ある。 Although the above description has been made regarding a diaphragm for a speaker, it can also be applied to a diaphragm for a microphone, a cantilever for a pickup cartridge, and the like.
Claims (1)
周波スパツタリングによるフエノール樹脂被膜を
形成したことを特徴とする音響変換用振動体。1. A vibrating body for acoustic conversion, characterized in that it has a Mg or Mg alloy base and a phenol resin coating is formed on its surface by high-frequency sputtering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2155582A JPS58139595A (en) | 1982-02-13 | 1982-02-13 | Diaphragm for acoustic transducer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2155582A JPS58139595A (en) | 1982-02-13 | 1982-02-13 | Diaphragm for acoustic transducer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58139595A JPS58139595A (en) | 1983-08-18 |
| JPH0145280B2 true JPH0145280B2 (en) | 1989-10-03 |
Family
ID=12058248
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2155582A Granted JPS58139595A (en) | 1982-02-13 | 1982-02-13 | Diaphragm for acoustic transducer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58139595A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA1253085A (en) * | 1984-10-03 | 1989-04-25 | Masatsugu Maejima | Diaphragm |
| CN100376334C (en) * | 2004-02-25 | 2008-03-26 | 闳晖实业股份有限公司 | Method for manufacturing metal product and product thereof |
| JP2007068017A (en) * | 2005-09-01 | 2007-03-15 | Pioneer Electronic Corp | Structural component for speaker device and speaker device |
| JP2008057483A (en) * | 2006-09-01 | 2008-03-13 | Kayaba Ind Co Ltd | Electric vane pump |
-
1982
- 1982-02-13 JP JP2155582A patent/JPS58139595A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58139595A (en) | 1983-08-18 |
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