JPH0145733B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a capacitor device using a solid capacitor.

For example, when a plurality of solid capacitors 3 having electrode layers 2 integrally provided on both sides of a substrate 1 made of glass fiber reinforced plastic, epoxy resin, ceramic, etc. as shown in FIG. 1 are assembled and connected, Conventionally, as shown in the figure, a connecting terminal 4 having a threaded portion 41 was adhered to the electrode layer 2, and the connecting terminals 4-4 were connected using a stud 5 or the like.

However, according to this configuration, when the number of solid capacitors 3 increases, the number of connection points also increases, which disadvantageously increases the size of the configuration of this type of device.

As a countermeasure for this, for example, instead of using the connection terminal 4 in FIG.
It is also possible to collect and connect the substrates by stacking them, but in this case, distortion of the substrate 1 becomes a problem as the number of stacks increases.

This invention was proposed in view of the above-mentioned problems, and it absorbs the distortion of the substrate by stacking solid capacitors with elastic auxiliary electrodes having conductive layers on both sides of thin sheets. Moreover, this type of device is intended to be miniaturized.

An embodiment of the present invention will be described below with reference to FIGS. 2 to 5. Note that parts given the same reference numerals as in FIG. 1 indicate the same or corresponding parts. Reference numeral 6 denotes an assembly in which a plurality of solid capacitors 3 are stacked, and between each solid capacitor 3, aluminum or the like is coated on both sides of an elastic thin film made of insulating paper, non-woven fabric, plastic film, etc. An auxiliary electrode 7, integrally provided with a conductive layer by vapor deposition, is interposed. This auxiliary electrode 7 is appropriately used as a lead. 8 is
The assembly plate of the assembly 6 is tightened using studs, nuts, bands, etc. (not shown). The solid capacitor 3 is made by baking or baking gold, silver, nickel, aluminum, etc. on both sides of the substrate 1 made of glass fiber reinforced plastic, epoxy resin, porcelain, etc., with a slight shift from side to side as shown in FIG. Even if the electrode layer 2 is provided by vapor deposition, the electrode layer 2 is provided symmetrically on both sides as shown in FIG. 4, or the electrode layer 2 has rounded ends r as shown in FIG. Of course, the substrate 1 may be molded so as to have the same shape. In addition, as a solid capacitor 3, the thickness of the substrate 1 is 0.1 to 0.5 mm,
When the thickness of the electrode layer 2 is about 5 to 50 μm, the thickness of the auxiliary electrode 7 may be about 6 to 50 μm. Further, since the solid capacitor 3 generally has excellent heat resistance, when this type of device is used in a high temperature atmosphere, it is preferable to use a material with high heat resistance as the auxiliary electrode 7.

The assembly 6 configured in this way can be used as is, but in consideration of insulation etc., it is molded with a synthetic resin 9 such as polyurethane resin or epoxy resin, as shown in FIG. You may. 10 is a lead terminal. Also, the seventh
As shown in the figure, SF ₆ , Co ₂ ,
Of course, the insulating medium 12 may be filled and sealed with an insulating gas such as N ₂ or an insulating oil such as mineral oil, aromatic hydrocarbon oil, ester oil, or silicone oil. Note that 13 is a lead.

In the above embodiment, the solid capacitors 3 were connected in parallel, but as shown in FIG.
The solid capacitors 3 may be connected in series by interposing, for example, an elastic auxiliary electrode 7' having conductive layers on both sides electrically connected between the solid capacitors 3-3.
Furthermore, it is easily understood that series-parallel connections can be easily made by combining these devices.

In the above configuration, since the elastic auxiliary electrodes 7, 7' are interposed between the solid capacitors 3-3, the strain on the solid capacitor 3 can be absorbed, and as a result, when assembled, the In addition to eliminating electrical and mechanical weaknesses, the structure can be made smaller than the conventional structure shown in FIG.

As described in detail above, according to the present invention, this type of capacitor device can be miniaturized with an extremely simple configuration, and the effect is particularly great when a solid capacitor is used for electric power.

[Brief explanation of drawings]

FIG. 1 is a schematic front view showing a conventional example. Second
The figure is a schematic front view showing one embodiment of the present invention.
5 to 5 show different examples of solid capacitors, and in each figure, A is a side view and B is a plan view. FIG. 6 is a front view showing an example of a molded capacitor device, and FIG. 7 is a partially cutaway front view showing an example of an insulating medium-filled capacitor device. FIG. 8 is a schematic front view showing another embodiment of the invention. 1: Substrate, 2: Electrode layer, 3: Solid capacitor, 6: Assembly, 7, 7': Auxiliary electrode.

Claims (1)

[Claims] 1. A capacitor device characterized in that solid capacitors having electrode layers integrally provided on both sides of a substrate are stacked and assembled via elastic auxiliary electrodes having conductive layers integrally provided on both sides of a thin film body. .