JPH0145754B2 - - Google Patents

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Publication number
JPH0145754B2
JPH0145754B2 JP57209292A JP20929282A JPH0145754B2 JP H0145754 B2 JPH0145754 B2 JP H0145754B2 JP 57209292 A JP57209292 A JP 57209292A JP 20929282 A JP20929282 A JP 20929282A JP H0145754 B2 JPH0145754 B2 JP H0145754B2
Authority
JP
Japan
Prior art keywords
wax
molten wax
circuit board
printed circuit
valve
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57209292A
Other languages
Japanese (ja)
Other versions
JPS59100594A (en
Inventor
Kenji Kondo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP20929282A priority Critical patent/JPS59100594A/en
Publication of JPS59100594A publication Critical patent/JPS59100594A/en
Publication of JPH0145754B2 publication Critical patent/JPH0145754B2/ja
Granted legal-status Critical Current

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  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

【発明の詳細な説明】 この発明は、はんだ付けされるべき電子部品を
装置したプリント基板に溶融ワツクスを吹き付け
て仮固定するワツクス処理装置の溶融ワツクス塗
布制御部に関するものである。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a molten wax application control section of a wax processing apparatus that sprays molten wax onto a printed circuit board on which electronic components to be soldered are mounted to temporarily fix the wax.

第1図は従来のはんだ付け装置の一例を示すブ
ロツク図で、1ははんだ付け装置の全体を示し、
2は予備はんだ付け処理装置、3はカツテイング
装置、4は仕上げはんだ付け処理装置である。こ
れらの装置で、5,9はフラツクス処理器、6,
10は予備加熱器、7はデイツプ式のはんだ槽、
8,12は冷却器、11は噴流式のはんだ槽であ
る。
FIG. 1 is a block diagram showing an example of a conventional soldering device. 1 shows the entire soldering device;
2 is a preliminary soldering processing device, 3 is a cutting device, and 4 is a finishing soldering processing device. In these devices, 5, 9 are flux processors, 6,
10 is a preheater, 7 is a dip type soldering bath,
8 and 12 are coolers, and 11 is a jet type solder bath.

第2図は電子部品がプリント基板に装着された
態様を示す部分側断面図で、13はプリント基
板、14は抵抗器、コンデンサ、IC等の電子部
品、15は前記電子部品14のリード線(または
リード端子)、16は前記リード線(またはリー
ド端子)15を挿通するスルーホールである。
FIG. 2 is a partial side cross-sectional view showing how electronic components are mounted on a printed circuit board, 13 is a printed circuit board, 14 is an electronic component such as a resistor, capacitor, IC, etc., and 15 is a lead wire ( or lead terminal), 16 is a through hole through which the lead wire (or lead terminal) 15 is inserted.

このように、従来のはんだ付け装置では、予備
はんだ付け処理と仕上げはんだ付け処理の2回に
わたつてプリント基板13を加熱して溶融はんだ
を付着させるためはんだの消耗が多く、プリント
基板13と電子部品14とが熱影響を受け、ま
た、IC部品のリード端子15をプリント基板1
3のスルーホール16に挿通してから仕上げはん
だ付け処理を行うとき、噴流はんだの勢により
IC部品が浮き上がつてしまう等の欠点があつた。
また、予備はんだ付け処理装置2は仕上げはんだ
付け処理装置4と同様の設備を有するため、はん
だ付け装置1全体が大きくなり、はんだ付け装置
1を設置する場合に広い場所を必要とするので経
費がかかる欠点があつた。
In this way, in the conventional soldering device, the printed circuit board 13 is heated twice to attach molten solder to the printed circuit board 13 and the final soldering process, which results in a lot of solder consumption. The components 14 are affected by heat, and the lead terminals 15 of the IC components are connected to the printed circuit board 1.
When performing the final soldering process after inserting it into the through hole 16 of No. 3, the force of the jet solder
There were drawbacks such as IC parts lifting up.
In addition, since the preliminary soldering device 2 has the same equipment as the final soldering device 4, the entire soldering device 1 becomes large, and a large space is required to install the soldering device 1, which reduces costs. There were such shortcomings.

このような欠点を解決する1つの方法として、
溶融したワツクスを吹き付けて固化し、電気部品
をプリント基板に仮固定する方法が提案されてい
る(特開昭52−3164号公報参照)。しかし、ワツ
クス処理部について、特に考慮が払われていない
ため、プリント基板に均一にワツクスが吹き付け
られないという問題があつた。
One way to solve these shortcomings is to
A method has been proposed in which electrical components are temporarily fixed to a printed circuit board by spraying molten wax and solidifying it (see Japanese Patent Laid-Open No. 52-3164). However, since no particular consideration was given to the wax treatment section, there was a problem in that the wax was not evenly sprayed onto the printed circuit board.

この発明は、このような問題点を解決するため
になされたもので、溶融ワツクスをプリント基板
の幅一杯に均一に吹き付けうるようにしたはんだ
付け装置のワツクス処理部を提供するものであ
る。以下、この発明を図面に基づいて説明する。
The present invention was made to solve these problems, and provides a wax processing section of a soldering device that can spray molten wax uniformly over the entire width of a printed circuit board. The present invention will be explained below based on the drawings.

第3図はこの発明の一実施例を示す概略構成図
で、21はキヤリアレスのはんだ付け処理装置の
全体を示す。22Aは固定側の搬送チエン、22
Bは可動側の搬送チエン、23はワツクス付け処
理装置、24はワツクス処理部、25は加熱によ
り液状となつた溶融ワツクスである。また、第1
図、第2図と同じ符号は同一のものを示す。
FIG. 3 is a schematic configuration diagram showing an embodiment of the present invention, and numeral 21 indicates the entire carrierless soldering processing apparatus. 22A is a fixed side conveyance chain, 22
Reference numeral B designates a conveyance chain on the movable side, 23 a waxing processing device, 24 a wax processing section, and 25 a molten wax that has been turned into a liquid by heating. Also, the first
The same reference numerals as in FIG. 2 and FIG. 2 indicate the same parts.

次に、第3図の動作について説明する。 Next, the operation shown in FIG. 3 will be explained.

プリント基板13に電子部品14を装着してリ
ード線15を下方へ突出させる。
An electronic component 14 is mounted on a printed circuit board 13, and a lead wire 15 is made to protrude downward.

次に、ワツクス処理部24でプリント基板13
の上面に溶融ワツクス25が吹き付けられ、その
後、吹き付けられた溶融ワツクス25は冷却器8
で固化されるので、プリント基板13上に電子部
品14は固化したワツクスで覆われて固定され
る。また、IC部品の場合は、リード端子15と
スルーホール16との間にも溶融ワツクス25が
浸透して固定される。
Next, the printed circuit board 13 is processed in the wax processing section 24.
Molten wax 25 is sprayed onto the upper surface, and then the sprayed molten wax 25 is transferred to the cooler 8.
The electronic components 14 are covered with the solidified wax and fixed on the printed circuit board 13. Further, in the case of an IC component, the molten wax 25 also penetrates between the lead terminal 15 and the through hole 16 and is fixed.

次に、カツテイング装置3でリード線15が切
断され、仕上げはんだ付け処理装置4でフラツク
ス処理器9、予備加熱器10、はんだ槽11、冷
却器12の各処理工程を経てはんだ付けされる。
Next, the lead wire 15 is cut by the cutting device 3, and soldered by the final soldering device 4 through the processing steps of a flux processor 9, a preheater 10, a solder bath 11, and a cooler 12.

第4図a,bは第3図のワツクス処理部24を
示すもので、第4図aは一部破断斜視図、第4図
bは第4図aのX−X線による拡大側断面図であ
る。これらの図において、第3図と同一符号は同
じものを示し、26は前記溶融ワツクス25を貯
溜するワツクス槽本体、27は前記溶融ワツクス
25を加圧して送り出すため、ワツクス槽本体2
6の下方に設けた歯車ポンプ、28は前記歯車ポ
ンプ27を駆動するモータ、29は前記溶融ワツ
クス25の流量と圧力を調整する制御弁、30は
前記溶融ワツクス25の通路、31は前記溶融ワ
ツクス25中に混在するごみを取り除くフイル
タ、32は前記フイルタ31でろ過された溶融ワ
ツクス25の通る通路、33は前記通路32から
分岐して並列に接続された複数本のパイプ、34
は前記パイプ33の外周に巻かれたフレキシブル
のテープヒータで、パイプ33の中を通る溶融ワ
ツクス25が固化しないように加熱している。3
5は前記テープヒータ34の外周を覆う保温材、
36は前記溶融ワツクス25を噴射する噴射装置
で、接続金具37を介して複数本のパイプ33の
それぞれに1個ずつ取り付けられており、第3図
のはんだ付け装置21の搬送チエン22A,22
Bにより搬送されるプリント基板13の走行方向
に対して直角方向に複数個配設されている。38
は前記ワツクス槽本体26内における溶融ワツク
ス25の温度を検知するサーモスタツトである。
なお、39は前記フイルタ31の中のごみ等を取
り除くため着脱可能の蓋、40は制御盤である。
4a and 4b show the wax processing section 24 of FIG. 3, FIG. 4a is a partially cutaway perspective view, and FIG. 4b is an enlarged side sectional view taken along the line X-X of FIG. 4a. It is. In these figures, the same reference numerals as in FIG. 3 indicate the same parts, 26 is a wax tank main body for storing the molten wax 25, and 27 is a wax tank main body 2 for pressurizing and sending out the molten wax 25.
6 is a gear pump provided below, 28 is a motor that drives the gear pump 27, 29 is a control valve that adjusts the flow rate and pressure of the molten wax 25, 30 is a passage for the molten wax 25, and 31 is a motor for driving the molten wax 25. 25 is a filter for removing dust mixed in the molten wax 25; 32 is a passage through which the molten wax 25 filtered by the filter 31 passes; 33 is a plurality of pipes branched from the passage 32 and connected in parallel; 34;
is a flexible tape heater wrapped around the outer circumference of the pipe 33, which heats the molten wax 25 passing through the pipe 33 so that it does not solidify. 3
5 is a heat insulating material that covers the outer periphery of the tape heater 34;
Reference numeral 36 denotes an injection device for injecting the molten wax 25, which is attached to each of the plurality of pipes 33 via a connecting fitting 37, and is connected to the conveying chains 22A, 22 of the soldering device 21 in FIG.
A plurality of them are arranged in a direction perpendicular to the running direction of the printed circuit board 13 carried by the motor B. 38
is a thermostat that detects the temperature of the molten wax 25 in the wax tank body 26.
Note that 39 is a removable lid for removing dust and the like from the filter 31, and 40 is a control panel.

歯車ポンプ27において、41は駆動軸で、モ
ータ28に連結されている。42は従動軸であ
る。第4図bにおいて、43は前記歯車ポンプ2
7を組み立てるためのガイドとなるガイド軸、4
4は前記歯車ポンプ27をワツクス槽本体26に
固定するために使用される半円形に形成した固定
具、45は円板状の上ケース、46,47は一対
の平歯車で、第4図b中の斜線部分で互に噛み合
つており、平歯車46は駆動軸41に、平歯車4
7は従動軸42に固着されている。48は前記上
ケース45の下面で平歯車46,47の側面を囲
んで収納する歯車ケース、49は前記歯車ケース
48を載置する円板状の基台、50は前記歯車ポ
ンプ27を組み立てる固定ねじである。また、4
4aは前記固定具44に形成した溶融ワツクス2
5の導入口、45a,48aは前記導入口44a
からの溶融ワツクス25を平歯車46,47へ供
給する供給孔、48b,49aは前記平歯車4
6,47で加圧された溶融ワツクス25を送り出
す送出孔、51は前記歯車ポンプ27からの溶融
ワツクス25を通路30へ供給する供給孔、49
b,52は前記通路30,32から制御弁29を
経て還流される溶融ワツクス25の還流孔であ
る。
In the gear pump 27, 41 is a drive shaft connected to the motor 28. 42 is a driven shaft. In FIG. 4b, 43 is the gear pump 2
A guide shaft that serves as a guide for assembling 7, 4
4 is a semicircular fixture used to fix the gear pump 27 to the wax tank body 26; 45 is a disk-shaped upper case; 46 and 47 are a pair of spur gears; They mesh with each other at the hatched part in the middle, and the spur gear 46 is connected to the drive shaft 41, and the spur gear 46 is connected to the drive shaft 41.
7 is fixed to the driven shaft 42. 48 is a gear case that surrounds and stores the sides of the spur gears 46 and 47 on the lower surface of the upper case 45, 49 is a disc-shaped base on which the gear case 48 is placed, and 50 is a fixture for assembling the gear pump 27. It's a screw. Also, 4
4a is the molten wax 2 formed on the fixture 44;
5, the introduction port 45a and 48a are the introduction port 44a.
Supply holes 48b and 49a supply the molten wax 25 from the spur gears 46 and 47 to the spur gears 4
6 and 47 are delivery holes for sending out the pressurized molten wax 25; 51 is a supply hole for supplying the molten wax 25 from the gear pump 27 to the passage 30;
b, 52 are return holes for the molten wax 25 to be returned from the passages 30, 32 via the control valve 29.

次に、第4図a,bの動作を説明する。 Next, the operations shown in FIGS. 4a and 4b will be explained.

ワツクス槽本体26内に装入された固形ワツク
スはヒータ(図示せず)により加熱されて溶融ワ
ツクス25となり、サーモスタツト38により温
度が検知され、制御盤40での操作により一定温
度に保持される。
The solid wax charged into the wax tank body 26 is heated by a heater (not shown) to become molten wax 25, the temperature is detected by a thermostat 38, and maintained at a constant temperature by operation on a control panel 40. .

モータ28が駆動して歯車ポンプ27の一対の
平歯車46,47が回転すると、ワツクス槽本体
26内の溶融ワツクス25は吸引されて導入口4
4aに入り、供給孔45a,48aを通つて(矢
印A)平歯車46,47により加圧され、さらに
送出孔48b,49a、供給孔51を通つて通路
30内に入る(矢印B)。
When the motor 28 is driven and the pair of spur gears 46 and 47 of the gear pump 27 rotate, the molten wax 25 in the wax tank body 26 is sucked into the inlet 4.
4a, passes through supply holes 45a and 48a (arrow A), is pressurized by spur gears 46 and 47, and further passes through delivery holes 48b and 49a and supply hole 51 into passage 30 (arrow B).

通路30内の溶融ワツクス25はフイルタ31
の内部に入り、ごみ等が取り除かれてから通路3
2を通つて(矢印C)複数本のパイプ33に分岐
され(矢印D)、それぞれの噴射装置36から噴
射してプリント基板13と、その上面に装着され
た電子部品14の全体に吹き付ける。
The molten wax 25 in the passage 30 passes through the filter 31
After entering the inside of the building and removing trash etc.
2 (arrow C), the liquid branches into a plurality of pipes 33 (arrow D), and is injected from each injection device 36 to spray the entire printed circuit board 13 and electronic components 14 mounted on its upper surface.

一方、通路32,30内の溶融ワツクス25は
制御弁29により流量と圧力が制御され、通路3
2,30から第4図bの矢印E,Fで示すように
制御弁29を通つて矢印Gで示すように還流孔5
2を経て平歯車46,47へ還流される。
On the other hand, the flow rate and pressure of the molten wax 25 in the passages 32 and 30 are controlled by the control valve 29.
2, 30 through the control valve 29 as shown by arrows E and F in FIG.
2 and is returned to spur gears 46 and 47.

第5図は歯車ポンプ27を分解して示した拡大
斜視図で、第4図a,bと同一部分は同じ符号で
示し、44c,45cは前記駆動軸41を回転自
在に挿通する挿通孔、49cは前記駆動軸41の
支承孔、44d,45dは前記従動軸42を回転
自在に挿通する挿通孔、49dは前記従動軸42
の支承孔、46cは前記駆動軸41に平歯車46
を固着するための固定孔、47cは前記従動軸4
2に平歯車47を固着するための固定孔、44
e,45e,48e,49eは前記ガイド軸43
を挿通する挿通孔、44f,45f,48f,4
9fは前記固定ねじ50を挿通する挿通孔であ
る。
FIG. 5 is an enlarged perspective view showing the gear pump 27 in an exploded manner, in which the same parts as in FIGS. 49c is a support hole for the drive shaft 41, 44d and 45d are insertion holes through which the driven shaft 42 is rotatably inserted, and 49d is a support hole for the driven shaft 42.
The support hole 46c is connected to the spur gear 46 on the drive shaft 41.
A fixing hole 47c for fixing the driven shaft 4
A fixing hole for fixing the spur gear 47 to 2, 44
e, 45e, 48e, 49e are the guide shafts 43
Insertion holes for inserting, 44f, 45f, 48f, 4
9f is an insertion hole through which the fixing screw 50 is inserted.

組み立てに際しては、駆動軸41、従動軸4
2、ガイド軸43を基台49に取り付け、次に平
歯車46,47を噛合させて駆動軸41、従動軸
42に固着する。次に、歯車ケース48を基台4
9に載置してから平歯車46,47を収納し、次
に、上ケース45を歯車ケース48の上部にかぶ
せて平歯車46,47を密閉し、さらに固定具4
4を載置して固定ねじ50で全体を締め付けて歯
車ポンプ27を形成し、ワツクス槽本体26に取
り付け、駆動軸41をモータ28に接続する。
When assembling, drive shaft 41, driven shaft 4
2. Attach the guide shaft 43 to the base 49, then mesh the spur gears 46 and 47 and fix it to the drive shaft 41 and the driven shaft 42. Next, the gear case 48 is attached to the base 4.
9 and then store the spur gears 46 and 47. Next, the upper case 45 is placed over the top of the gear case 48 to seal the spur gears 46 and 47, and then the fixing tool 4
4 is placed and the whole is tightened with fixing screws 50 to form a gear pump 27, which is attached to the wax tank body 26, and the drive shaft 41 is connected to the motor 28.

なお、第5図の歯車ポンプ27の動作について
は第4図a,bのところで説明したので、ここで
は省略する。
Note that the operation of the gear pump 27 shown in FIG. 5 has been explained in FIGS. 4a and 4b, and will therefore be omitted here.

第6図は制御弁29の詳細を示す拡大側断面図
で、第4図bと同一符号は同じ部分を示し、61
は前記制御弁29の弁箱で、ワツクス槽本体26
に嵌合されている。62は前記弁箱61に螺合さ
れた調整弁で、回動により溶融ワツクス25の流
量を調整する。63は安全弁で、溶融ワツクス2
5の圧力を自動的に調整する。64は前記調整弁
62の弁座、65は前記安全弁63の弁座、66
は前記安全弁63を弁座65に押圧するばね、6
7は前記弁箱61の長手方向の一端に設けた調整
弁62側の導入孔、68は前記弁箱61の長手方
向の他端に設けた安全弁63側の導入孔、69は
前記各導入孔67,68の中間に設けた還流孔5
2側の吐出孔、70は水止用のOリングである。
FIG. 6 is an enlarged side sectional view showing details of the control valve 29, in which the same reference numerals as in FIG. 4b indicate the same parts, and 61
is the valve box of the control valve 29, and the wax tank body 26
is mated to. Reference numeral 62 denotes an adjustment valve screwed into the valve box 61, which adjusts the flow rate of the molten wax 25 by rotation. 63 is a safety valve, melting wax 2
5. Automatically adjust the pressure. 64 is the valve seat of the regulating valve 62, 65 is the valve seat of the safety valve 63, 66
6 is a spring that presses the safety valve 63 against the valve seat 65;
7 is an introduction hole on the regulating valve 62 side provided at one longitudinal end of the valve box 61, 68 is an introduction hole on the safety valve 63 side provided at the other longitudinal end of the valve box 61, and 69 is each of the introduction holes. Reflux hole 5 provided between 67 and 68
The discharge hole 70 on the second side is an O-ring for stopping water.

次に、第6図の動作について説明する。 Next, the operation shown in FIG. 6 will be explained.

歯車ポンプ27の平歯車46,47の回転によ
り加圧された溶融ワツクス25は供給孔51、通
路30から第4図aのフイルタ31を経て通路3
2、各パイプ33を通つて噴射装置36から噴射
されるが、この噴射量を調整したい場合には、調
整弁62を回して調整弁62と弁座64との隙間
をあけると通路32の溶融ワツクス25の一部が
分流して導入孔67から弁箱61内に入り、さら
に弁座64、吐出孔69を経て還流孔52へ送ら
れる。一方、溶融ワツクス25は流量の調整、噴
射の停止等により所定の圧力より高くなつた場
合、通路30内の溶融ワツクス25の一部が分流
して導入孔68内に入り、安全弁63がばね66
の押圧力に抗して押圧され、弁座65をあけるの
で弁箱61内に入り、吐出孔69を経て還流孔5
2へ送られる。
The molten wax 25 pressurized by the rotation of the spur gears 46 and 47 of the gear pump 27 passes through the supply hole 51 and the passage 30, passes through the filter 31 shown in FIG.
2. It is injected from the injection device 36 through each pipe 33, but if you want to adjust the injection amount, turn the adjustment valve 62 to open a gap between the adjustment valve 62 and the valve seat 64, and the passage 32 will melt. A portion of the wax 25 is diverted and enters the valve box 61 through the introduction hole 67, and is further sent to the reflux hole 52 via the valve seat 64 and the discharge hole 69. On the other hand, if the pressure of the molten wax 25 becomes higher than a predetermined value due to flow rate adjustment, stopping of injection, etc., a part of the molten wax 25 in the passage 30 is diverted and enters the introduction hole 68, and the safety valve 63 is closed by the spring 66.
It is pressed against the pressing force of
Sent to 2.

第7図は第4図aの噴射装置36の1個につい
てその詳細を示す拡大側断面図で、第4図aと同
一符号は同じ部分を示し、71は弁箱で、接続金
具37がねじ部72により螺合されている。73
は前記弁箱71の側方に設けた溶融ワツクス25
の導入孔、74は弁軸、75は弁、76は弁座、
77は前記弁座76を備え、弁箱71の一端に係
合する接続金具、78,79は吹口金具、80は
ノズル、81は前記ノズル80の取付金具、82
は前記弁75を弁座76に押圧する方向に作用す
るばね、83はパツキン、84はエアシリンダ、
85は前記弁箱71の他端に突出した弁軸74と
一体に固着したピストンである。
FIG. 7 is an enlarged side sectional view showing details of one of the injection devices 36 in FIG. 4a, where the same reference numerals as in FIG. They are screwed together by a portion 72. 73
is the molten wax 25 provided on the side of the valve box 71.
74 is the valve shaft, 75 is the valve, 76 is the valve seat,
Reference numeral 77 includes a connection fitting that includes the valve seat 76 and engages with one end of the valve box 71; 78 and 79 refer to outlet fittings; 80 is a nozzle; 81 is a mounting fitting for the nozzle 80; 82
83 is a gasket; 84 is an air cylinder;
A piston 85 is fixed integrally with the valve shaft 74 protruding from the other end of the valve box 71.

次に、第7図の動作について説明する。 Next, the operation shown in FIG. 7 will be explained.

第4図aのワツクス槽本体26の歯車ポンプ2
7で加圧された溶融ワツクス25は通路30、フ
イルタ31、通路32を経て、第7図のパイプ3
3内を通り、弁箱71内の導入孔73から弁箱7
1の内部に入る。
Gear pump 2 of wax tank body 26 in Fig. 4a
The molten wax 25 pressurized in step 7 passes through a passage 30, a filter 31, and a passage 32, and then flows into the pipe 3 in FIG.
3 and from the introduction hole 73 in the valve box 71 to the valve box 7.
Go inside 1.

プリント基板13が噴射装置36の下方を通過
すると、図示しない光電管等の検知器の検知によ
りエアシリンダ84内に加圧空気が導入されピス
トン85が作動して弁軸74をばね82の押圧力
に抗して押圧するので、弁75は弁座76から開
放される。弁座76の開放により弁箱71内の溶
融ワツクス25は吹口金具78,79を通つてノ
ズル80から噴射され、プリント基板13に吹き
付けられる。
When the printed circuit board 13 passes below the injection device 36, pressurized air is introduced into the air cylinder 84 by detection by a detector such as a phototube (not shown), and the piston 85 is actuated to apply the pressing force of the spring 82 to the valve stem 74. The valve 75 is released from the valve seat 76 by pressing against it. When the valve seat 76 is opened, the molten wax 25 in the valve box 71 is injected from the nozzle 80 through the nozzle fittings 78 and 79, and is sprayed onto the printed circuit board 13.

なお、ノズル80は接続金具77の弁座76に
直接取り付けてもよい。
Note that the nozzle 80 may be directly attached to the valve seat 76 of the connecting fitting 77.

第8図はこの発明の要部であるワツクス付け処
理装置23のワツクス塗布制御部を示すもので、
まずその概略を説明すると、第4図aに示すワツ
クス処理部24で複数個の噴射装置36をプリン
ト基板13の走行方向に対して直角方向に配設
し、プリント基板13の幅に応じて、所要数の噴
射装置36と対応するリミツトスイツチのオンに
より噴射装置36を作動可能の状態に保持させ、
さらにプリント基板13の通過を検知してから溶
融ワツクス25を噴射させるようにしたものであ
る。以下、第8図に基づいてその詳細を説明す
る。
FIG. 8 shows the wax application control section of the wax application processing device 23, which is the main part of the present invention.
First, to explain the outline, in the wax processing section 24 shown in FIG. The injectors 36 are maintained in an operable state by turning on the limit switches corresponding to the required number of injectors 36;
Further, the molten wax 25 is sprayed after detecting the passage of the printed circuit board 13. The details will be explained below based on FIG.

第8図において、第2図、第3図、第4図aと
同一符号は同一部分を示し、22Aは固定側の搬
送チエン、22Bは前記プリント基板13の走行
方向と直角方向に移動可能の可動側の搬送チエ
ン、361,362,…,36oは前記噴射装置3
6の各個を示す。91は前記プリント基板13の
保持爪で、搬送チエン22A,22Bと一体に固
着されている。92は前記搬送チエン22Bを移
動させるねじ桿、93は前記搬送チエン22B、
保持爪91と一体に移動する作動接片、94はリ
ミツトスイツチで、941,942,…,94oは
前記リミツトスイツチ94の各個を示し、それぞ
れ噴射装置361,362,…,36oと対応して
作動し、かつ同一方向に配列されている。
In FIG. 8, the same reference numerals as in FIGS. 2, 3, and 4 a indicate the same parts, 22A is a fixed conveyance chain, and 22B is a conveyor chain movable in a direction perpendicular to the running direction of the printed circuit board 13. The conveyor chains 36 1 , 36 2 , . . . , 36 o on the movable side are connected to the injection device 3
6 is shown. Reference numeral 91 denotes a holding claw for the printed circuit board 13, which is fixed integrally with the transport chains 22A, 22B. 92 is a screw rod for moving the conveyance chain 22B, 93 is the conveyance chain 22B,
The operating contact piece 94 that moves together with the holding claw 91 is a limit switch, and 94 1 , 94 2 , ..., 94 o indicate each of the limit switches 94, and are connected to the injection devices 36 1 , 36 2 , ..., 36 o , respectively. They operate in a corresponding manner and are aligned in the same direction.

次に、動作について説明する。 Next, the operation will be explained.

はんだ付け装置21の保持爪91の間隔を調整
する調整手段となるハンドル(図示せず)を回し
て、搬送チエン22Bを移動し、プリント基板1
3を保持爪91に装着する。
By turning a handle (not shown) serving as an adjustment means for adjusting the interval between the holding claws 91 of the soldering device 21, the conveyance chain 22B is moved, and the printed circuit board 1 is moved.
3 is attached to the holding claw 91.

このとき、作動接片93がプリント基板13の
幅に応じて、例えば第8図でリミツトスイツチ9
41から944の4個と接触してオンさせると、噴
射装置361から364のそれぞれのエアシリンダ
84(第7図参照)が作動できる状態に保持され
る。
At this time, the actuating contact piece 93 changes depending on the width of the printed circuit board 13, for example, as shown in FIG.
When the four air cylinders 4 1 to 94 4 are contacted and turned on, the air cylinders 84 (see FIG. 7) of the injection devices 36 1 to 36 4 are maintained in an operable state.

次に、プリント基板13が走行してきて噴射装
置361〜364の手前に来ると、光電管等の検知
器(図示せず)の検知により作動できる状態にあ
るエアシリンダ84を動作して噴射装置361〜
364の4個から溶融ワツクス25を噴射し、プ
リント基板13上へ吹き付ける。
Next, when the printed circuit board 13 travels and comes in front of the injection devices 36 1 to 36 4 , the air cylinder 84, which is ready for operation, is activated by detection by a detector (not shown) such as a phototube, and the injection devices are activated. 36 1 ~
The molten wax 25 is sprayed from the four pieces 364 and sprayed onto the printed circuit board 13.

なお、上記の噴射装置365〜36oはリミツト
スイツチ945〜94oがオンしていないため、プ
リント基板13が検知器のところを通過して検知
してもエアシリンダ84は作動状態に保持されな
いため、エアシリンダ84は作動せず、溶融ワツ
クス25は噴射されない。
In addition, since the limit switches 945 to 94o of the above-mentioned injection devices 365 to 36o are not turned on, the air cylinder 84 is not maintained in the operating state even if the printed circuit board 13 passes the detector and is detected. Therefore, the air cylinder 84 does not operate and the molten wax 25 is not injected.

以上説明したようにこの発明は、溶融ワツクス
を貯溜するワツクス槽本体と、このワツクス槽本
体に設けられた溶融ワツクスを送り出す歯車ポン
プと、この歯車ポンプから送り出された溶融ワツ
クスの流量と圧力を制御する制御弁と、プリント
基板の走行方向と直角方向に順次配設された複数
の噴射装置とからなるワツクス処理部において、
各噴射装置をそれぞれ作動させるため各噴射装置
に対応して設けられたリミツトスイツチと、溶融
ワツクスを塗布する基板の幅に応じて移動するプ
リント基板の保持爪と連動しリミツトスイツチの
所要のものをオンにする作動接片を備えた溶融ワ
ツクス塗布制御部とによりはんだ付け装置のワツ
クス付け処理装置を形成したので、あらかじめ設
定した一定の圧力の溶融ワツクスを噴出すること
ができ、しかも、プリント基板の幅一杯に均一に
吹き付けることができ、電子部品を確実に仮固定
することができる。さらに、プリント基板を搬送
チエンの保持爪に装着する動作を行うと同時に作
動接片が所要数のリミツトスイツチをオンするた
め、オンしたリミツトスイツチと同じ数の噴射装
置から溶融ワツクスを自動的に噴射できる状態に
保持させることができるので、プリント基板の幅
に応じて自動的に溶融ワツクスを塗布することが
でき、これらの調整に要する手数を省くことがで
きる利点を有する。
As explained above, the present invention includes a wax tank main body that stores molten wax, a gear pump provided in the wax tank main body that sends out the molten wax, and a control system that controls the flow rate and pressure of the molten wax sent out from the gear pump. In the wax processing unit, which includes a control valve that controls
In order to operate each injection device individually, a limit switch is provided corresponding to each injection device, and a holding claw on the printed circuit board that moves according to the width of the board to which molten wax is applied works in conjunction with the limit switch to turn on the required limit switch. The wax application control unit of the soldering machine is formed by the molten wax application control unit equipped with an actuating contact piece, so that the molten wax can be spouted at a preset constant pressure, and can be applied over the entire width of the printed circuit board. It can be sprayed evenly onto the surface of the screen, and electronic components can be reliably temporarily fixed. Furthermore, when the printed circuit board is attached to the holding claws of the transfer chain, the actuation contact turns on the required number of limit switches, so molten wax can be automatically injected from the same number of injection devices as the limit switches turned on. Therefore, the molten wax can be automatically applied according to the width of the printed circuit board, which has the advantage that the labor required for these adjustments can be saved.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来のはんだ付け装置の一例を示すブ
ロツク図、第2図は電子部品がプリント基板に装
着された態様を示す部分側断面図、第3図はこの
発明の一実施例を示す概略構成図、第4図a,b
は第3図のワツクス処理部を示すもので、第4図
aは一部破断斜視図、第4図bは第4図aのX−
X線による拡大側断面図、第5図は歯車ポンプを
分解して示した拡大斜視図、第6図は制御弁の詳
細を示す拡大側断面図、第7図は噴射装置の詳細
を示す拡大側断面図、第8図はこの発明の要部で
あるワツクス付け処理装置のワツクス塗布制御部
を示す構成図である。 図中、3はカツテイング装置、4は仕上げはん
だ付け処理装置、8は冷却器、9はフラツクス処
理器、10は予備加熱器、11ははんだ槽、13
はプリント基板、14は電子部品、15はリード
線(またはリード端子)、16はスルーホール、
21ははんだ付け装置、22A,22Bは搬送チ
エン、23はワツクス付け処理装置、24はワツ
クス処理部、25は溶融ワツクス、26はワツク
ス槽本体、27は歯車ポンプ、28はモータ、2
9は制御弁、30,32は通路、31はフイル
タ、33はパイプ、34はテープヒータ、35は
保温材、36は噴射装置、37は接続金具、38
はサーモスタツト、39は蓋、40は制御盤、4
1は駆動軸、42は従動軸、43はガイド軸、4
4は固定具、45は上ケース、46,47は平歯
車、48は歯車ケース、49は基台、50は固定
ねじ、51は供給孔、52は還流孔、61は弁
箱、62は調整弁、63は安全弁、64,65は
弁座、66はばね、67,68は導入孔、69は
吐出孔、71は弁箱、72はねじ部、73は導入
孔、74は弁軸、75は弁、76は弁座、80は
ノズル、82はばね、84はエアシリンダ、85
はピストン、91は保持爪、92はねじ桿、93
は作動接片、94はリミツトスイツチである。
FIG. 1 is a block diagram showing an example of a conventional soldering device, FIG. 2 is a partial side sectional view showing how electronic components are mounted on a printed circuit board, and FIG. 3 is a schematic diagram showing an embodiment of the present invention. Configuration diagram, Figure 4 a, b
4 shows the wax treatment section in FIG. 3, FIG. 4 a is a partially cutaway perspective view, and FIG.
Figure 5 is an enlarged perspective view showing the gear pump exploded, Figure 6 is an enlarged side sectional view showing details of the control valve, Figure 7 is an enlarged side view showing details of the injection device. The side sectional view and FIG. 8 are configuration diagrams showing the wax application control section of the wax application processing apparatus, which is the essential part of the present invention. In the figure, 3 is a cutting device, 4 is a finishing soldering processing device, 8 is a cooler, 9 is a flux processing device, 10 is a preheater, 11 is a soldering bath, 13
is a printed circuit board, 14 is an electronic component, 15 is a lead wire (or lead terminal), 16 is a through hole,
21 is a soldering device, 22A and 22B are conveyance chains, 23 is a waxing processing device, 24 is a wax processing section, 25 is a melting wax, 26 is a wax tank body, 27 is a gear pump, 28 is a motor, 2
9 is a control valve, 30 and 32 are passages, 31 is a filter, 33 is a pipe, 34 is a tape heater, 35 is a heat insulating material, 36 is an injection device, 37 is a connecting fitting, 38
is the thermostat, 39 is the lid, 40 is the control panel, 4
1 is a drive shaft, 42 is a driven shaft, 43 is a guide shaft, 4
4 is a fixture, 45 is an upper case, 46 and 47 are spur gears, 48 is a gear case, 49 is a base, 50 is a fixing screw, 51 is a supply hole, 52 is a return hole, 61 is a valve box, 62 is an adjustment Valve, 63 is a safety valve, 64, 65 is a valve seat, 66 is a spring, 67, 68 is an introduction hole, 69 is a discharge hole, 71 is a valve box, 72 is a threaded part, 73 is an introduction hole, 74 is a valve stem, 75 is a valve, 76 is a valve seat, 80 is a nozzle, 82 is a spring, 84 is an air cylinder, 85
is a piston, 91 is a holding claw, 92 is a screw rod, 93
94 is an operating contact piece, and 94 is a limit switch.

Claims (1)

【特許請求の範囲】[Claims] 1 溶融ワツクスを貯溜するワツクス槽本体と、
このワツクス槽本体に設けられ前記溶融ワツクス
を送り出す歯車ポンプと、この歯車ポンプから送
り出された前記溶融ワツクスの流量と圧力を制御
する制御弁と、プリント基板の走行方向と直角方
向に順次配設された複数の噴射装置とを備えたワ
ツクス処理部において、前記各噴射装置をそれぞ
れ作動させるため前記各噴射装置に対応して設け
られたリミツトスイツチと、前記溶融ワツクスを
塗布するプリント基板の幅に応じて移動する前記
プリント基板の保持爪と連動し前記リミツトスイ
ツチの所要のものをオンにする作動接片とからな
ることを特徴とするワツクス付け処理装置の溶融
ワツクス塗布制御部。
1 A wax tank body that stores molten wax;
A gear pump provided in the wax tank body to send out the molten wax, a control valve to control the flow rate and pressure of the molten wax sent out from the gear pump, and a control valve arranged in sequence in a direction perpendicular to the running direction of the printed circuit board. In a wax processing unit equipped with a plurality of spraying devices, a limit switch is provided corresponding to each of the spraying devices to operate each spraying device, and a limit switch is provided corresponding to each spraying device, and a limit switch is provided according to the width of the printed circuit board to which the molten wax is applied. A molten wax application control section of a wax application apparatus, characterized in that it comprises an operating contact piece that is linked with a moving holding claw of the printed circuit board and turns on a required one of the limit switches.
JP20929282A 1982-12-01 1982-12-01 Melting was coating controller for waxing processor Granted JPS59100594A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20929282A JPS59100594A (en) 1982-12-01 1982-12-01 Melting was coating controller for waxing processor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20929282A JPS59100594A (en) 1982-12-01 1982-12-01 Melting was coating controller for waxing processor

Publications (2)

Publication Number Publication Date
JPS59100594A JPS59100594A (en) 1984-06-09
JPH0145754B2 true JPH0145754B2 (en) 1989-10-04

Family

ID=16570523

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20929282A Granted JPS59100594A (en) 1982-12-01 1982-12-01 Melting was coating controller for waxing processor

Country Status (1)

Country Link
JP (1) JPS59100594A (en)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS523164A (en) * 1975-06-27 1977-01-11 Aiwa Co Method of securing electric components printed circuit board
CA1125712A (en) * 1979-04-16 1982-06-15 Walter H. Cobbs, Jr. Method and apparatus for dispensing heat sensitive liquid polymeric compositions
JPS592938Y2 (en) * 1979-12-06 1984-01-26 千住金属工業株式会社 Fluxer

Also Published As

Publication number Publication date
JPS59100594A (en) 1984-06-09

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