JPH0154249B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a device for taking out plated objects, particularly strip-shaped plated objects such as IC lead frames.

In order to efficiently plate a large amount of plated items, various techniques have been adopted in the past in which the plated items are conveyed on a plating line and subjected to pre-treatment, plating treatment (for example, partial plating treatment), and post-treatment. Depending on the shape and structure, normal conveying means cannot be used and special racks or the like are required.Also, when jet plating is used as the plating process, the plated material is transferred from the inlet conveying line onto the plating device. It is necessary to transfer the plated items and take them out to the conveyance line on the exit side, and the plated items must be IC
In the case of a lead frame having a strip shape, it is necessary to simultaneously process a plurality of these strip-shaped plated objects from the viewpoint of efficiency. Therefore, the applicant arranged and placed a plurality of strip-shaped plated items on a cart in advance, transported the plated items together with the cart, pre-processed, plated and post-processed them, and automatically processed a large number of plated items. We have previously proposed an efficient plating device [see Japanese Patent Laid-Open No. 56-99127]. Although this proposal significantly improves processing speed, it is difficult to increase the processing speed any further because the plated material is transported via a trolley. For this reason, the present applicant has newly investigated a technique for plating a plurality of objects to be plated at the same time by arranging and transferring the objects to be plated directly on a roller comparer without using a cart.

This invention was developed under these circumstances, and includes a take-out device for simultaneously taking out a plurality of strip-shaped plated objects that have been plated from the plating device and transferring them onto a conveyance line for post-processing. This is what we intend to provide. Specifically, the plating object retrieval device according to the present invention operates in a state in which a strip-shaped plating object is supported by a plurality of stretched wires and is positioned by a plurality of positioning pins provided around the strip. This is a device for taking out a plated object in a plating device that performs plating processing, in which a girder is constructed between a pair of left and right base plates that can move forward and backward, and a fixed chuck having an upper claw portion with an inclined surface and a fixed chuck having an upper claw portion with an inclined surface are provided. A plurality of chucks are provided at predetermined intervals on the above-mentioned girder material by combining a movable chuck having a lower claw portion with an inclined surface corresponding to the inclined surface, and both the upper and lower claw portions can be brought into contact with and separated from each other. When the chuck facing the short side of the plating object holds the short side of the plating object between the upper and lower claws with inclined surfaces, the other short side of the plating object is lifted up, and this state By retracting the base plate, the plated object can be taken out without the plated surface touching the wire.

The details will be explained below with reference to the illustrated embodiments. This plating object removal device 1 mainly comprises a pair of left and right base plates 2, a fixed chuck 3, a movable chuck 4, and a chuck 6 having opening/closing means 5 for both chucks.

The base plate 2 has a bearing 8 on the rail 7.
It is attached so that it can freely move forward and backward (in the left and right directions in FIG. 1) via a driving pressure cylinder 30, and there are a pair of left and right units. [However, in the figure, the left and right base plates 2 are shown, and the right base plate is omitted because its shape and structure are completely symmetrical to the left side. ] A fixing plate 9 is attached to the lower part of the base plate 2, and two hollow girder members 10 with a square cross section are installed between both base plates 2 via this fixing plate 9.

A plurality of fixed chucks 3 constituting the chuck 6 are positioned on the beam member 10 via upper and lower mounting plates 11, 12. That is, the chucks 6 are provided on the beam member 10 according to the number of plated items 13 to be taken out and the alignment positions of these plated items 13, and are attached to both the upper and lower mounting plates 11, 12 with screws 14.
is fixed to the beam member 10. Reference numeral 15 denotes a vertical portion of the upper mounting plate, which is provided so as to protrude from the upper surface of the flat upper mounting plate 11 and to protrude rearward for attachment of an opening/closing means 5 to be described later.

The upper part of the fixed chuck 3 is the lower mounting plate 12
It is fixed in a hanging state through screws 16, and as shown in FIGS. 2 and 4, the lower part has a gate shape and is provided with a pair of left and right upper claw portions 17 therein. Reference numeral 18 denotes an inclined surface, which is provided on the lower surface side of the upper claw portion 17, so to speak. Reference numeral 19 is a bearing portion that protrudes from the back side.

The movable chucks 4 are a pair of left and right having a generally L-shape as a whole, and their upper portions are rotatably supported on both sides of a bearing portion 19, and the tip bent into the L-shape has the above-mentioned fixed portion. Upper claw part 17 of chuck 3
A lower claw part 21 with an inclined surface 20 corresponding to the lower claw part 21 is provided.

A pressure cylinder serving as the opening/closing means 5 has its upper end connected to the vertical part 15 of the upper mounting plate 11 and its lower end connected to the lower part of the movable chuck 4, and both the upper and lower claw parts 17 and 21 are brought into contact and separated by this pressure cylinder. It is something that can be done freely.

FIG. 6 is a partial plan view of the partial plating device 22, in which three wires 2 are placed between a rack 24 that is vertically movable around the upper cover 23 of the plating liquid injection box.
5 is stretched, and positioning pins 26 are provided on the upper surface of the upper lid 23 (six positioning pins in the illustrated example).
The plated part [IC lead frame 13] is protruded and placed between the plurality of positioning pins 26 and supported on the wire 25.
After the plating process, the plated object 13 is moved up and down by the wire 25 as the vertically movable rack 24 rises.
A plurality of sheets are lined up and waiting for removal at the upper limit position, that is, above the upper lid 23 at an appropriate height h (see FIG. 5). Also, in Figure 5,
27 is a plating liquid spray nozzle, and 28 is a peg for applying tension to the wire.

Next, the action will be explained.

Using a pressure cylinder as the opening/closing means 5, the lower claw part 21 of the movable chuck 4 is separated from the upper claw part 17 of the fixed chuck 3.
], move the entire chuck 6 together with the girder 10 and base plate 2 on the rail 7 via the bearing 8 and the driving pressure cylinder 30, and hold one end of the plated object 13 between the claws 17 and 21. Advance it as far as possible [Fig. 5, direction of arrow A].
At this time, as shown in FIGS. 5 and 6, the lower claw part 21 avoids the positioning pin 26a at the end,
It is located on the bottom side of one end of 3. Next, the pressure cylinder 5 is operated, the movable chuck 4 is rotated in the opposite direction, and the lower claw part 21 is pushed up against the upper claw part 17, and the object to be plated 13 is clamped between both claw parts 17 and 21.
figure〕. Both claw parts 17 and 21 have inclined surfaces 18 and 2, respectively.
0, the plated object 13 is placed in a state where the other end is lifted, that is, the entire plated object 13 is placed in an inclined state, so that it can be easily taken out from between the positioning pins 26, and the entire object including the other end does not come into contact with the wire 25. In other words, the plated surface will not be damaged by coming into contact with the wire 25 and being rubbed. As mentioned above, the lower part of the fixed chuck 3 has a gate shape, and there is also a gap in the lower part of the movable chuck 4, so that the base plate 2, despite the presence of the positioning pin (26a in FIGS. 5 and 6), If the girder 10 and the chuck 6 are moved (backward) in the opposite direction (in the direction of arrow B in FIG. 5), the plating object 13 will be taken out from above the partial plating device 22. Then, the object to be plated 13 is placed on an appropriate post-processing conveyance line, for example, a group of roller conveyors, and the previous operation is repeated again. Incidentally, in the above, a plurality of chucks 6 are provided on the girder material 10, and as a result, a number of plating objects 13 corresponding to the number of chucks 6 are taken out at the same time. It is also possible to form a plurality of movable chucks 4 in another material (for example, by cutting or molding a synthetic resin material), and open and close them simultaneously using one or two pressure cylinders 5. good.

As explained above, according to the present invention, the claw portion of the fixed chuck is provided with an inclined surface, and the claw portion of the movable chuck is provided with an inclined surface corresponding to the claw portion, so that both claw portions come into contact with each other.
A chuck, which is a combination of a fixed chuck and a movable chuck, is installed on the girder material installed between the base plates so that it can be separated freely, so the movement of these chucks back and forth and the contact and separation of both claws allows multiple strips to be separated. It is possible to take out the plating object by holding it in place and lifting the entire object in an inclined manner, thereby making it possible to take out the plating object with high efficiency. Since a plurality of sheets can be taken out at the same time, it is expected that the processing speed of the entire plating line will be improved accordingly.

[Brief explanation of drawings]

Fig. 1 is a side view showing an example of a device for taking out plated materials, Fig. 2 is a partial side view seen from the direction of the arrow in Fig. 1, and Fig. 3 is a side view shown from the direction of the arrow in Fig. 2. FIG. 4 is a partial perspective view of both the fixed and movable chucks seen from the rear, FIG.
The figure is a partial plan view of the partial plating device. 2... Base plate, 3... Fixed chuck,
4...Movable chuck, 5...Opening/closing means [pressure cylinder], 6... Entire chuck, 7... Rail,
10... Girder material, 13... Plated item, 17... Upper claw part, 18, 20... Inclined surface, 19... Bearing part, 2
1... Lower claw portion, 22... Partial plating device, 23...
...Top lid, 25...Wire, 26, 26a...Positioning pin.

Claims (1)

[Claims] 1. A plating device in which a rectangular plating object is supported by a plurality of tensioned wires and positioned by a plurality of positioning pins provided around the plating device. A device for taking out plated items, which has a girder installed between a pair of left and right base plates that can move forward and backward, and has a fixed chuck with an upper claw portion with an inclined surface and an inclined surface corresponding to the inclined surface of the upper claw portion. A plurality of chucks are provided at predetermined intervals on the girder material, in which a movable chuck having a lower claw part is combined, and both the upper and lower claw parts can be brought into contact with and separated from each other. By holding the short side of the plated object between the upper and lower claws with inclined surfaces, the other short side of the plated object is lifted up.
In this state, the base plate is moved back, so that the plated object is taken out without the plated surface touching the wire.