JPH0158680B2 - - Google Patents
Info
- Publication number
- JPH0158680B2 JPH0158680B2 JP58109021A JP10902183A JPH0158680B2 JP H0158680 B2 JPH0158680 B2 JP H0158680B2 JP 58109021 A JP58109021 A JP 58109021A JP 10902183 A JP10902183 A JP 10902183A JP H0158680 B2 JPH0158680 B2 JP H0158680B2
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- reference plate
- width
- thin plates
- bending
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 41
- 238000005452 bending Methods 0.000 claims description 32
- 239000003086 colorant Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 210000003811 finger Anatomy 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 210000003813 thumb Anatomy 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Supply And Installment Of Electrical Components (AREA)
Description
【発明の詳細な説明】
本発明はリード線端子(P型)付の固定抵抗
器・コンデンサなどの回路部品を印刷配線板に組
付ける際、そのリード線端子を組付け位置の穴間
隔に合せてコ字形に折曲げるのに用いる治具に関
するものである。[Detailed Description of the Invention] When assembling circuit components such as fixed resistors and capacitors with lead wire terminals (P type) on a printed wiring board, the present invention is designed to align the lead wire terminals with the hole spacing at the assembly position. This relates to a jig used for bending into a lever shape.
1種類の回路ユニツトを大量生産する場合は、
各回路部品のリード線端子をそれぞれの組付け位
置の穴間隔に合せて折曲げたものを予め大量に用
意する必要があるので、各々異なる折曲げ幅に設
定された自動折曲げ機、あるいは折曲げ幅調節式
の自動折曲げ機によつて成形して供給している。 When mass producing one type of circuit unit,
Since it is necessary to prepare in advance a large amount of lead wire terminals for each circuit component bent to fit the hole spacing of each assembly position, an automatic bending machine set to a different bending width or a folding It is molded and supplied using an automatic bending machine with adjustable bending width.
ところが試作あるいは家内工業などのように多
機種・少中量生産の場合、上記大量生産のときの
ように、リード線端子を折曲げた各種折曲げ幅の
回路部品を予め多数用意しておくと余剰を生じて
無駄になることがあるので、組付けの都度、必要
数の回路部品のリード線端子を曲げるのが一般で
ある。 However, in the case of prototyping or small-to-medium-volume production of many models, such as in a cottage industry, it is better to prepare in advance a large number of circuit parts with various bending widths with bent lead wire terminals, as in the case of mass production mentioned above. Since excess leads may be wasted, it is common practice to bend the lead wire terminals of the required number of circuit components each time they are assembled.
その場合、回路部品1個毎にリード線端子を曲
げるのは面倒であるため、リード線端子の折曲げ
幅に合せた幅を有する台木を用い、その上に数個
の回路部品を載せて、リード線端子の台木の両側
に突き出ている部分を台木の外側面に倣つて折曲
げることが行われている。しかし各種寸法の幅の
台木が必要である。又台木の幅をテーパ状にして
1個の台木で間に合せることもできるが、何れの
場合も台木上における回路部品の本体の位置が不
安定であるため、リード線端子の折曲げ位置が非
対称になることがある。 In that case, since it is troublesome to bend the lead wire terminal for each circuit component, a rootstock with a width that matches the bending width of the lead wire terminal is used, and several circuit components are placed on it. , the protruding parts of the lead wire terminal on both sides of the basestock are bent to follow the outer surface of the basestock. However, rootstocks of various dimensions and widths are required. It is also possible to make do with a single rootstock by tapering the width of the rootstock, but in either case, the position of the main body of the circuit component on the rootstock is unstable, making it difficult to fold the lead wire terminal. The bending position may be asymmetrical.
本発明はリード線端子付回路部品のリード線端
子の折曲げ加工における上記の問題点を解決する
折曲げ治具を提供することを目的とする。 An object of the present invention is to provide a bending jig that solves the above-mentioned problems in bending lead wire terminals of circuit components with lead wire terminals.
図面に示す実施例について構造作用を説明する
と、第1図・第2図に示すように、片方の手で握
り得る握り部1の一端に一定厚さの基準板2を一
体に突設し、その基準板2の両側に、リード線折
曲げ幅及び本体受溝幅設定用薄板3を同数ずつ数
多重ね合せ、握り部1寄りの端部においてそれら
の薄板3及び基準板2を貫く共通軸4により、薄
板3を基準板2に回動可能に取付けている。そし
て基準板2の先端部分に、基準板2と平行してい
る薄板3に係脱させてその薄板3の位置決めをす
る固定部材5を備えている。 To explain the structure and function of the embodiment shown in the drawings, as shown in FIGS. 1 and 2, a reference plate 2 of a constant thickness is integrally protruded from one end of a grip portion 1 that can be gripped with one hand. On both sides of the reference plate 2, the same number of thin plates 3 for setting the lead wire bending width and body receiving groove width are stacked, and a common shaft passes through the thin plates 3 and the reference plate 2 at the end near the grip part 1. 4, the thin plate 3 is rotatably attached to the reference plate 2. A fixing member 5 is provided at the tip of the reference plate 2 for positioning the thin plate 3 by engaging and disengaging it from the thin plate 3 parallel to the reference plate 2.
実施例の固定部材5は、各薄板3の先端部下縁
に形成した切欠部6に係脱する共通1個のフツク
で、板ばね7により常時係止方向に付勢されてい
る。フツク状固定部材5に代えてボルト・ナツト
でもよい。 The fixing member 5 of the embodiment is a common hook that engages and disengages from a notch 6 formed at the lower edge of the tip of each thin plate 3, and is always urged in the locking direction by a leaf spring 7. Instead of the hook-shaped fixing member 5, a bolt or nut may be used.
上記基準板2は、リード線端子付回路部品の本
体Pを横にして入れる溝の最小幅を決め、且つそ
の溝の底となるもので、現在有る最も小さい固定
抵抗器の本体部分の長さは略3.5mmであるから、
基準板2は厚さ3.5mmとする。 The reference plate 2 determines the minimum width of the groove into which the main body P of the circuit component with lead wire terminals is laid horizontally, and also serves as the bottom of the groove, which is the length of the main body of the smallest fixed resistor currently available. is approximately 3.5mm, so
The reference plate 2 has a thickness of 3.5 mm.
基準板2の両側に重なる薄板3は、規格化され
ている各種回路部品の本体Pの長さ、及び印刷配
線板の穴間隔によつて決まるリード線端子の折曲
げ幅を勘案すると、厚さ1mmの板を用いるのが適
している。 The thin plates 3 that overlap on both sides of the reference plate 2 have a thickness that is determined by taking into account the length of the main body P of various standardized circuit components and the bending width of the lead wire terminal determined by the hole spacing of the printed wiring board. It is suitable to use a 1mm plate.
上記薄板3は同形同大に形成し、該板3の上縁
に、その上縁に載るリード線端子lの位置決めを
する浅い切欠部8A,8B,8Cを設けている。
例えば切欠部8Aは直径約2.5mmの回路部品を5
個、切欠部8Bは直径約3.5mmの回路部品を5個、
切欠部8Cは更に太い直径約4mmの回路部品を3
個をそれぞれ並べて受けることができる長さに設
定する。 The thin plates 3 are formed to have the same shape and size, and shallow cutouts 8A, 8B, and 8C are provided on the upper edge of the plate 3 for positioning the lead wire terminals 1 placed on the upper edge.
For example, the notch 8A can hold 5 circuit components with a diameter of approximately 2.5 mm.
The notch 8B has 5 circuit parts with a diameter of approximately 3.5 mm.
The notch 8C has a thicker circuit component of approximately 4 mm in diameter.
Set the length so that each piece can be received side by side.
又上記薄板3は、となり合う板どうし色違いと
し、且つその色の順を基準板2を中心にして対称
に配置するを可とする。その場合各薄板の色に固
定抵抗のカラーコードを利用すると、その色がリ
ード線端子の折曲げ幅及び本体受溝幅の大体の寸
法を示す利点がある。 Further, the thin plates 3 may have different colors between adjacent plates, and the order of the colors may be arranged symmetrically with respect to the reference plate 2. In this case, if a color code of the fixed resistor is used for the color of each thin plate, there is an advantage that the color indicates the approximate dimensions of the bending width of the lead wire terminal and the width of the main body receiving groove.
第1図に示すように、基準板2の両側に全部の
薄板3を揃えた状態(全部の薄板3の切欠部6に
フツク5が係合している)で、その薄板3の列の
先端を、回路部品を組付けようとする印刷配線板
B(第2図示)上の一対の穴H1,H2の脇に、
同じ色の薄板31,32がそれぞれ穴H1,H2
に合うように当てがい、その薄板31,32を含
む外側の薄板群3L,3Rを第3図のように、フ
ツク5の係合を解いて引起し、更に握り部1の両
側に並ぶまで反転させる。 As shown in FIG. 1, when all the thin plates 3 are aligned on both sides of the reference plate 2 (the hooks 5 are engaged with the notches 6 of all the thin plates 3), the tip of the row of thin plates 3 is , next to a pair of holes H1 and H2 on the printed wiring board B (second figure) where the circuit components are to be assembled,
Thin plates 31 and 32 of the same color are holes H1 and H2, respectively.
The outer thin plate groups 3L and 3R, including the thin plates 31 and 32, are disengaged from the hook 5 and pulled up as shown in FIG. let
次に基準板2の両側に残つている薄板3の内、
最外側のもの33,34(同色)と、組付けるべ
き回路部品の本体Pを横にして入れる溝を基準板
2の上方に形成するため、その本体Pの長さの外
側に当る薄板35,36(同色)とを、前記第3
図の要領で一旦引起し、これを第4図に示すよう
に、各薄板33,34,35,36のフツク係合
切欠部6に連続する段部9がフツク5に当るまで
倒すもので、上記薄板33,34,35,36の
上縁は、フツク5の係合によつて基準板2に位置
決め固定されている他の薄板3よりも高くなる。 Next, of the thin plates 3 remaining on both sides of the reference plate 2,
In order to form a groove above the reference plate 2 in which the outermost parts 33 and 34 (same color) and the main body P of the circuit component to be assembled are inserted horizontally, a thin plate 35, which is on the outside of the length of the main body P, 36 (same color) and the third
Once raised as shown in the figure, it is then pushed down until the stepped portions 9 of each of the thin plates 33, 34, 35, and 36 that are continuous with the hook engaging notches 6 touch the hooks 5, as shown in FIG. The upper edges of the thin plates 33, 34, 35, and 36 are higher than the other thin plates 3 that are positioned and fixed to the reference plate 2 by engagement with the hooks 5.
以上のようにして基準板2の側に、第5図に示
すようにその基準板2を底の一部とし、内側の一
対の薄板35,36によつて溝幅を設定された本
体受溝Cが形成され、又外側の一対の薄板33,
34によつてリード線端子lの折曲げ幅が設定さ
れる。 As described above, a main body receiving groove is formed on the side of the reference plate 2, with the reference plate 2 serving as a part of the bottom and the groove width set by the pair of inner thin plates 35 and 36, as shown in FIG. C is formed, and a pair of outer thin plates 33,
34 sets the bending width of the lead wire terminal l.
上記のようにセツトされた内外2対の薄板3
3,34,35,36の上にリード線端子lが載
り、溝Cに本体Pが収まるように、数個の回路部
品を該当する切欠部8Bの位置に並べ、その並ん
でいる回路部品の本体Pを、握り部1を不要の薄
板群3L,3Rと共に握つている手の親指Fの腹
で上から押えておいて、他方の手の2本の指で、
リード線端子lの外側薄板33,34より外方に
突出している部分に下方に向つてしごくように力
f1,f2を加えるもので、リード線端子lは第
6図鎖線示l′のように外側薄板33,34の外側
面に倣つてコ字形に曲る。 Two pairs of inner and outer thin plates 3 set as above
3, 34, 35, 36, and the main body P is placed in the groove C. Arrange several circuit components at the corresponding notch 8B, and then Hold the main body P from above with the pad of the thumb F of the hand that is gripping the grip part 1 together with the unnecessary thin plate groups 3L and 3R, and with the two fingers of the other hand,
Forces f1 and f2 are applied downward to the parts of the lead wire terminal l that protrude outward from the outer thin plates 33 and 34, and the lead wire terminal l is connected as shown by the chain line l' in FIG. It is bent into a U-shape following the outer surfaces of the outer thin plates 33 and 34.
第7図は、本体Pの長さが長い回路部品を加工
するため本体受溝Cの幅を広げ、又組付け穴間隔
も広いためリード線端子lの折曲げ幅を大きくし
た場合の折曲げ状態を示したものである。 Figure 7 shows the bending process when the width of the main body receiving groove C is increased in order to process a circuit component with a long length of the main body P, and the bending width of the lead wire terminal l is increased because the assembly hole spacing is also wide. It shows the condition.
以上の実施例は、本体受溝幅及びリード線折曲
げ幅を決めるのに、所要の薄板の上縁を他の薄板
よりも高くセツトする構成であるが、第8図の実
施例は、リード線折曲げ幅を決める薄板33,3
4よりも外側の不要の薄板群3L,3Rを握り部
1の両側に反転させる点は前記実施例と同じであ
るが、本体受溝幅及びリード線折曲げ幅を決める
薄板は動かさなくてもよいように構成したもので
ある。 In the above embodiment, the upper edge of the required thin plate is set higher than the other thin plates in order to determine the main body receiving groove width and the lead wire bending width, but the embodiment shown in FIG. Thin plate 33, 3 that determines the line bending width
The point that the unnecessary thin plate groups 3L and 3R on the outside of 4 are reversed to both sides of the grip part 1 is the same as in the previous embodiment, but the thin plates that determine the body receiving groove width and the lead wire bending width do not need to be moved. It has been constructed in a good manner.
前記の実施例の場合各薄板3は全く同形同大で
あつたが、第8図例の場合は、内側寄りの数枚の
薄板の上縁の切欠部の深さを異ならせている。 In the embodiment described above, the thin plates 3 had exactly the same shape and size, but in the case of the example shown in FIG. 8, the depths of the notches at the upper edges of the inner several thin plates are made different.
本体Pが最も小さい回路部品を載せる位置の切
欠部8Aは全部の薄板共リード線端子lが載るだ
けの極く浅いもので、第9図に示すように最も内
側の薄板37,38の間の溝Cに本体Pが収ま
る。 The notch 8A in the position where the smallest circuit component of the main body P is placed is extremely shallow enough to hold the lead wire terminal l of all the thin plates, and as shown in FIG. The main body P fits into the groove C.
本体Pが中間の大きさの回路部品を載せる位置
の切欠部8Bは、内側の各2枚の薄板37,37
1及び38,381の切欠部8B1が更に深くな
つていて、第10図に示すように内側から3枚目
の薄板372,382間の溝Cに本体Pが収まつ
て位置決めされる。 The cutout portion 8B at the position where the main body P places an intermediate-sized circuit component is formed by two inner thin plates 37, 37.
The notches 8B1 of 1, 38, and 381 are deeper, and the main body P is positioned in the groove C between the third thin plate 372 and 382 from the inside as shown in FIG.
本体Pが大きい回路部品を載せる位置の切欠部
8Cは、内側の各3枚37,371,372及び
38,381,382の切欠部8C1が他の切欠
部8Cより深くて、第11図に示すように内側か
ら4枚目の薄板373,383間の溝Cに本体P
が収まつて位置決めされる。上記深い切欠部8B
1及び8C1の内、外側のものの底面は内側に低
く傾斜する斜面に形成すると、溝の中の本体が安
定する。 The notches 8C in the positions where the main body P places large circuit components are shown in FIG. As shown, insert the main body P into the groove C between the fourth thin plate 373 and 383 from the inside.
is fitted and positioned. Above deep notch 8B
1 and 8C1, the bottom surface of the outer one is formed into a slope that slopes low inward, thereby stabilizing the main body in the groove.
要するに最も内側の薄板37,38とその次の
薄板371,381は、3個所の切欠部の内2個
所の切欠部8B1,8C1が深く、次の内側から
3枚目の薄板372,382は1個所の切欠部8
C1のみが深くなつている。 In short, in the innermost thin plates 37, 38 and the next thin plates 371, 381, two of the three notches 8B1, 8C1 are deep, and the third thin plate 372, 382 from the next inner side is 1 Notch part 8
Only C1 is deeper.
図中1Aは握り部1及び基準板2の下縁に沿つ
て形成した台座にして、机上に置いても折曲げ加
工ができるようにしたものである。8Dは各薄板
3の下縁に形成した長い切欠部で所要の薄板3を
握り部1の側に反転させた状態において、その切
欠部8Dの上に回路部品を置けるようにしたもの
で、多数の回路部品のリード線端子を折曲げる場
合に用いる。 In the figure, 1A is a pedestal formed along the lower edges of the grip portion 1 and the reference plate 2 so that bending can be performed even when placed on a desk. 8D is a long notch formed on the lower edge of each thin plate 3, and when the desired thin plate 3 is turned over to the grip part 1 side, circuit components can be placed on the notch 8D. Used when bending lead wire terminals of circuit components.
本発明リード線折曲げ治具は上記のようにリー
ド線端子付回路部品の本体Pを横にして入れる溝
Cの最小幅を決め、且つその溝Cの底となる一定
厚さの基準板2を握り部1の一端に一体に突設
し、その基準板2の両側に、リード線端子lを載
せるリード線折曲げ幅及び本体受溝幅設定用薄板
3を同数ずつ数多重ね合せ、それらの薄板3を握
り部寄りの端部で基準板2に共通軸4で取付け
て、リード線端子lの所要折曲げ幅より外側の薄
板3L,3Rを握り部側に反転可能とし、基準板
2と平行している薄板3を位置決めする固定部材
6を基準板2の先端部分に備えたものであるか
ら、多機種の回路ユニツトを少中量生産する場
合、回路部品組付けの都度、必要個数の部品のリ
ード線端子を所要の幅に折曲げることができて回
路部品が無駄になることがない。そして一つの治
具で各種容量の回路部品のリード線折曲げがで
き、そのとき治具上に回路部品が安定して載るの
で正確に折曲げることができる。又リード線端子
の折曲げ幅を印刷配線板の穴間隔に合せて自由に
変えることができて回路部品の組付け能率を向上
する効果がある。 As described above, the lead wire bending jig of the present invention determines the minimum width of the groove C into which the main body P of the circuit component with the lead wire terminal is placed horizontally, and also has a reference plate 2 of a constant thickness that forms the bottom of the groove C. is integrally protruded from one end of the grip part 1, and on both sides of the reference plate 2, the same number of thin plates 3 for setting the lead wire bending width and body receiving groove width on which the lead wire terminals 1 are placed are stacked. The thin plate 3 is attached to the reference plate 2 with a common shaft 4 at the end near the grip, so that the thin plates 3L and 3R on the outside of the required bending width of the lead wire terminal l can be reversed toward the grip, and the reference plate 2 Since the fixing member 6 for positioning the thin plate 3 parallel to the reference plate 2 is provided at the tip of the reference plate 2, when producing various types of circuit units in small to medium quantities, the required number of circuit parts can be adjusted each time the circuit parts are assembled. The lead wire terminals of the parts can be bent to the required width, so no circuit parts are wasted. Lead wires for circuit components of various capacities can be bent using one jig, and since the circuit components are stably placed on the jig, the bending can be performed accurately. Furthermore, the bending width of the lead wire terminal can be freely changed according to the hole spacing of the printed wiring board, which has the effect of improving the efficiency of assembling circuit components.
第1図は本発明リード線折曲げ治具の平面図、
第2図は側面図、第3図は薄板を反転させる状態
の側面図、第4図は本体受溝幅及びリード線折曲
げ幅を設定した状態の側面図、第5図は回路部品
を載せた平面図、第6図は第5図―線に沿う
縦断面図、第7図は異なる大きさの回路部品を載
せた場合の縦断面図、第8図は他の実施例の本体
受溝幅及びリード線折曲げ幅設定状態の側面図、
第9図、第10図、第11図は第8図―線、
―線及びXI―XI線に沿う拡大縦断面図。
1は握り部、2は基準板、3は薄板、4は薄板
取付軸、5は固定部材、Pは回路部品の本体、l
はリード線端子、Bは印刷配線板、H1,H2は
穴。
FIG. 1 is a plan view of the lead wire bending jig of the present invention;
Figure 2 is a side view, Figure 3 is a side view with the thin plate reversed, Figure 4 is a side view with the main body receiving groove width and lead wire bending width set, and Figure 5 is a side view with circuit components mounted. 6 is a vertical sectional view taken along the line of FIG. 5, FIG. 7 is a vertical sectional view when circuit components of different sizes are mounted, and FIG. Side view of the width and lead wire bending width settings,
Figure 9, Figure 10, Figure 11 are Figure 8 - line,
- Enlarged longitudinal cross-sectional view along line and XI-XI. 1 is a grip part, 2 is a reference plate, 3 is a thin plate, 4 is a thin plate mounting shaft, 5 is a fixing member, P is the main body of the circuit component, l
is a lead wire terminal, B is a printed wiring board, and H1 and H2 are holes.
Claims (1)
れる溝の最小幅を決め、且つその溝の底となる一
定厚さの基準板を握り部の一端に一体に突設し、
その基準板の両側に、リード線端子を載せるリー
ド線折曲げ幅及び本体受溝幅設定用薄板を同数ず
つ数多重ね合せ、それらの薄板を握り部寄りの端
部で基準板に共通軸で取付けて、リード線端子の
所要折曲げ幅より外側の薄板を握り部側に反転可
能とし、基準板と平行している薄板を位置決めす
る固定部材を基準板の先端部分に備えたリード線
端子付回路部品のリード線折曲げ治具。1. Determine the minimum width of the groove into which the main body of the circuit component with lead wire terminals is laid horizontally, and provide a reference plate of a certain thickness that will form the bottom of the groove and protrude integrally from one end of the grip,
On both sides of the reference plate, stack the same number of thin plates for setting the lead wire bending width and body receiving groove width on which the lead wire terminals are placed, and align the thin plates with a common axis to the reference plate at the end near the grip. Comes with a lead wire terminal that allows the thin plate outside the required bending width of the lead wire terminal to be flipped toward the grip, and has a fixing member at the tip of the reference plate that positions the thin plate parallel to the reference plate. Lead wire bending jig for circuit components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58109021A JPS601899A (en) | 1983-06-17 | 1983-06-17 | Lead wire bending jig of circuit part with lead wire terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58109021A JPS601899A (en) | 1983-06-17 | 1983-06-17 | Lead wire bending jig of circuit part with lead wire terminal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS601899A JPS601899A (en) | 1985-01-08 |
| JPH0158680B2 true JPH0158680B2 (en) | 1989-12-13 |
Family
ID=14499577
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58109021A Granted JPS601899A (en) | 1983-06-17 | 1983-06-17 | Lead wire bending jig of circuit part with lead wire terminal |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS601899A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA1274633A (en) * | 1985-06-13 | 1990-09-25 | Melvin Richard Toub | Composite materials prepared from cork and silicone rubber |
| JPS6265810U (en) * | 1985-10-16 | 1987-04-23 |
-
1983
- 1983-06-17 JP JP58109021A patent/JPS601899A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS601899A (en) | 1985-01-08 |
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