JPH0163074U - - Google Patents
Info
- Publication number
- JPH0163074U JPH0163074U JP15952587U JP15952587U JPH0163074U JP H0163074 U JPH0163074 U JP H0163074U JP 15952587 U JP15952587 U JP 15952587U JP 15952587 U JP15952587 U JP 15952587U JP H0163074 U JPH0163074 U JP H0163074U
- Authority
- JP
- Japan
- Prior art keywords
- split portion
- circuit board
- printed circuit
- lead wire
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Multi-Conductor Connections (AREA)
Description
第１図は本考案の一実施例を示す平面図、第２
図は同実施例の断面図、第３図は同実施例におけ
る割取部割取状態の斜視図、第４図及び第５図は
従来例を示す要部斜視図及び断面図である。
１…プリント基板、２…シヤーシ、６…スリツ
ト、７…小基板（割取部）、８…透孔、９…ジヤ
ンパー線（リード線）、１０…ねじ孔、１１…ね
じ。
Figure 1 is a plan view showing one embodiment of the present invention;
The figure is a sectional view of the same embodiment, FIG. 3 is a perspective view of the splitting portion in the split state of the same embodiment, and FIGS. 4 and 5 are a perspective view and a sectional view of a main part showing a conventional example. DESCRIPTION OF SYMBOLS 1... Printed circuit board, 2... Chassis, 6... Slit, 7... Small board (split part), 8... Through hole, 9... Jumper wire (lead wire), 10... Screw hole, 11... Screw.
Claims (1)
取可能な割取部を設け、この割取部周辺の前記プ
リント基板と前記割取部とをリード線で橋絡する
と共にこの割取部を導電性のシヤーシに螺着する
ことによつて前記プリント基板のアース取りを行
なうアース取り装置であつて、 前記割取部にねじ止め用の透孔を穿設すると共
に前記割取部上におけるリード線の接続を前記透
孔からずれた位置にて行ない、前記割取部を前記
シヤーシに螺着する際に前記割取部を前記透孔の
回りに回転させて前記リード線を張架する構成と
したことを特徴とするプリント基板のアース取り
装置。[Scope of Claim for Utility Model Registration] A splittable part is provided on a printed circuit board by providing perforations or the like, and the printed circuit board around this splitting part and the splitting part are connected by a lead wire. A grounding device for grounding the printed circuit board by bridging and screwing this split portion to a conductive chassis, wherein a through hole for screwing is bored in the split portion. At the same time, the lead wire on the split portion is connected at a position offset from the through hole, and when the split portion is screwed onto the chassis, the split portion is rotated around the through hole. A grounding device for a printed circuit board, characterized in that the lead wire is stretched over the lead wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15952587U JPH0163074U (en) | 1987-10-19 | 1987-10-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15952587U JPH0163074U (en) | 1987-10-19 | 1987-10-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0163074U true JPH0163074U (en) | 1989-04-24 |
Family
ID=31440815
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15952587U Pending JPH0163074U (en) | 1987-10-19 | 1987-10-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0163074U (en) |
-
1987
- 1987-10-19 JP JP15952587U patent/JPH0163074U/ja active Pending
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