JPH0165139U - - Google Patents
Info
- Publication number
- JPH0165139U JPH0165139U JP1987160045U JP16004587U JPH0165139U JP H0165139 U JPH0165139 U JP H0165139U JP 1987160045 U JP1987160045 U JP 1987160045U JP 16004587 U JP16004587 U JP 16004587U JP H0165139 U JPH0165139 U JP H0165139U
- Authority
- JP
- Japan
- Prior art keywords
- airtight
- substrate
- lid
- board
- connector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 3
- 239000011261 inert gas Substances 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Connections Arranged To Contact A Plurality Of Conductors (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は本考案の電子部品収納筐体の断面図、
第２図は気密性基板上に電子部品及びコネクタが
実装されたようすを示す斜視図、第３図はメタル
コアセラミツクス基板の他の例を示す断面図、第
４図は従来の電子部品収納筐体の断面図である。
１……電子部品、２……気密性基板、３……気
密性蓋体、４……導電ピン、５……コネクタ、６
……厚膜印刷された導体、７……ハンダ箔、８…
…ガラス。
Figure 1 is a cross-sectional view of the electronic component storage casing of the present invention.
Figure 2 is a perspective view showing how electronic components and connectors are mounted on an airtight board, Figure 3 is a sectional view showing another example of a metal core ceramic board, and Figure 4 is a conventional electronic component housing. FIG. 1... Electronic component, 2... Airtight board, 3... Airtight lid, 4... Conductive pin, 5... Connector, 6
... Thick film printed conductor, 7... Solder foil, 8...
...Glass.
Claims (1)
された気密性基板上にコネクタが取付けられ、前
記気密性基板を覆う気密性蓋体にはハーメチツク
処理の施された導電ピンが気密性蓋体を貫通して
取付けられ、前記気密性基板と前記導電ピンとは
前記コネクタを介して接続されるとともに気密性
基板と気密性蓋体との空間には不活性ガスを封じ
て気密性基板と気密性蓋体とを気密処理したこと
を特徴とする電子部品収納筐体。 A connector is mounted on an airtight board on which electronic components such as semiconductor chips that are not airtight are mounted, and a hermetic conductive pin is attached to an airtight lid covering the airtight board. The airtight substrate and the conductive pin are connected through the connector, and an inert gas is filled in the space between the airtight substrate and the airtight lid to connect the airtight substrate and the airtight lid. An electronic component storage case characterized by being airtight with the body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987160045U JPH0165139U (en) | 1987-10-20 | 1987-10-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987160045U JPH0165139U (en) | 1987-10-20 | 1987-10-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0165139U true JPH0165139U (en) | 1989-04-26 |
Family
ID=31441773
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987160045U Pending JPH0165139U (en) | 1987-10-20 | 1987-10-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0165139U (en) |
-
1987
- 1987-10-20 JP JP1987160045U patent/JPH0165139U/ja active Pending
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