JPH0165171U - - Google Patents
Info
- Publication number
- JPH0165171U JPH0165171U JP1987159344U JP15934487U JPH0165171U JP H0165171 U JPH0165171 U JP H0165171U JP 1987159344 U JP1987159344 U JP 1987159344U JP 15934487 U JP15934487 U JP 15934487U JP H0165171 U JPH0165171 U JP H0165171U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- flexible
- flexible circuit
- land
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims 1
- 238000007747 plating Methods 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Description
第１図乃至第２図はこの考案の実施例を示し、
第１図はプリント基板とフレキシブル基板との接
続前の状態を示す断面図、第２図は接続後の断面
図である。第３図は従来の接続構造の断面図であ
る。
主要部分の符号の説明、１：フレキシブル基板
、２，５：接続ランド、３：半田メツキ、４：プ
リント基板、６，７：半田。
Figures 1 and 2 show an embodiment of this invention,
FIG. 1 is a cross-sectional view showing the printed circuit board and flexible circuit board before they are connected, and FIG. 2 is a cross-sectional view after they are connected. FIG. 3 is a sectional view of a conventional connection structure. Explanation of symbols of main parts: 1: flexible board, 2, 5: connection land, 3: solder plating, 4: printed circuit board, 6, 7: solder.
Claims (1)
ント基板に設けた接続用ランドとを対向するよう
に配設し熱圧着による半田付けで接続するプリン
ト基板とフレキシブル基板との接続構造において
、 プリント基板に設けたランドサイズよりフレキ
シブル基板に設けたランドサイズの方を大きく形
成し、隣接するパターンとの半田ブリツジの発生
を防止するように構成したことを特徴とするプリ
ント基板とフレキシブル基板との接続構造。[Scope of Claim for Utility Model Registration] Connection between a printed circuit board and a flexible circuit board, in which a connecting land provided on a flexible circuit board and a connecting land provided on a printed circuit board are arranged so as to face each other and are connected by thermocompression soldering. A printed circuit board and a flexible flexible circuit board characterized in that the land size provided on the flexible circuit board is formed larger than the land size provided on the printed circuit board to prevent the occurrence of solder bridging with adjacent patterns. Connection structure with the board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987159344U JPH0165171U (en) | 1987-10-20 | 1987-10-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987159344U JPH0165171U (en) | 1987-10-20 | 1987-10-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0165171U true JPH0165171U (en) | 1989-04-26 |
Family
ID=31440473
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987159344U Pending JPH0165171U (en) | 1987-10-20 | 1987-10-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0165171U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018014437A (en) * | 2016-07-21 | 2018-01-25 | キヤノン株式会社 | Component mounting method and electronic module |
-
1987
- 1987-10-20 JP JP1987159344U patent/JPH0165171U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018014437A (en) * | 2016-07-21 | 2018-01-25 | キヤノン株式会社 | Component mounting method and electronic module |
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