JPS6284972U - - Google Patents
Info
- Publication number
- JPS6284972U JPS6284972U JP17687685U JP17687685U JPS6284972U JP S6284972 U JPS6284972 U JP S6284972U JP 17687685 U JP17687685 U JP 17687685U JP 17687685 U JP17687685 U JP 17687685U JP S6284972 U JPS6284972 U JP S6284972U
- Authority
- JP
- Japan
- Prior art keywords
- via section
- pattern
- gap
- obtaining
- sides
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Description
第１図は本考案の実施例を示す断面図、第２図
は本考案の実施例を作成する基板を示す図、第３
図は従来のバイア部のみで接合した多層プリント
基板を示す図である。
第１図、第２図において、１０は基板、１１，
１１′は導体パターン、１２はバイア部、１３は
ギヤツプを得るためのパターン、１４，１４′は
半田である。
Fig. 1 is a sectional view showing an embodiment of the present invention, Fig. 2 is a diagram showing a board for producing an embodiment of the present invention, and Fig. 3 is a sectional view showing an embodiment of the present invention.
The figure shows a conventional multilayer printed circuit board joined only by via portions. In FIGS. 1 and 2, 10 is a substrate, 11,
11' is a conductor pattern, 12 is a via portion, 13 is a pattern for obtaining a gap, and 14 and 14' are solder.
Claims (1)
体パターンの接続を行ない且つその表面に基板間
のギヤツプを得るためのパターン１３を有するバ
イア部１２とが形成された多数枚の基板１０を、
前記バイア部１２のみで半田接合して成る多層プ
リント基板において、 前記ギヤツプを得るためのパターン１３は、そ
の直径がバイア部の直径より小さいことを特徴と
する多層プリント基板。[Claims for Utility Model Registration] Conductor patterns 11 and 11' on both sides and a via section 12 having a pattern 13 on its surface for connecting the conductor patterns on both sides and for obtaining a gap between the boards are formed. A large number of substrates 10,
A multilayer printed circuit board formed by soldering only the via section 12, wherein the pattern 13 for obtaining the gap has a diameter smaller than the diameter of the via section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17687685U JPS6284972U (en) | 1985-11-19 | 1985-11-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17687685U JPS6284972U (en) | 1985-11-19 | 1985-11-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6284972U true JPS6284972U (en) | 1987-05-30 |
Family
ID=31117541
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17687685U Pending JPS6284972U (en) | 1985-11-19 | 1985-11-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6284972U (en) |
-
1985
- 1985-11-19 JP JP17687685U patent/JPS6284972U/ja active Pending
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