JPH0167745U - - Google Patents

Info

Publication number
JPH0167745U
JPH0167745U JP1987163388U JP16338887U JPH0167745U JP H0167745 U JPH0167745 U JP H0167745U JP 1987163388 U JP1987163388 U JP 1987163388U JP 16338887 U JP16338887 U JP 16338887U JP H0167745 U JPH0167745 U JP H0167745U
Authority
JP
Japan
Prior art keywords
bonding
clamp
arm
wire
holds
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1987163388U
Other languages
Japanese (ja)
Other versions
JPH0525240Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987163388U priority Critical patent/JPH0525240Y2/ja
Publication of JPH0167745U publication Critical patent/JPH0167745U/ja
Application granted granted Critical
Publication of JPH0525240Y2 publication Critical patent/JPH0525240Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07168—Means for storing or moving the material for the connector
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案実施例のワイヤボンデイング装
置の構成図、第２図は本考案実施例のワイヤボン
デイング装置のワイヤフイード量決定手段の動作
説明図、第３図は従来のワイヤボンデイング装置
のワイヤフイード量決定手段の動作説明図である
。 １……クランプアーム、３……ボンデイングア
ーム、４……ストツパ、４ａ……ストツパアーム
、５ａ……接点、５ｂ……バネ、５ｃ……接点、
６……支軸、７……揺動アーム、１１，１１ａ…
…ワイヤ、１４……リード、１５……キヤピラリ
、１６……カツトクランプ、１７……スパークロ
ツド、１８……パツド、１９……ボール、Ｄ０…
…ワイヤフイード量、Ｄ１……カツトクランプ停
止高さ、Ｄ２……スパークギヤツプ、Ｄ３……ス
パーク高さ、Ｄ４……クランプ／キヤピラリ間隔
。 Fig. 1 is a configuration diagram of a wire bonding apparatus according to an embodiment of the present invention, Fig. 2 is an explanatory diagram of the operation of the wire feed amount determining means of the wire bonding apparatus according to an embodiment of the present invention, and Fig. 3 is a diagram showing the wire feed amount of a conventional wire bonding apparatus. FIG. 3 is an explanatory diagram of the operation of the determining means. 1... Clamp arm, 3... Bonding arm, 4... Stopper, 4a... Stopper arm, 5a... Contact, 5b... Spring, 5c... Contact,
6... Support shaft, 7... Swinging arm, 11, 11a...
... wire, 14 ... lead, 15 ... capillary, 16 ... cut clamp, 17 ... spark rod, 18 ... pad, 19 ... ball, D0 ...
...Wire feed amount, D1...Cut clamp stop height, D2...Spark gap, D3...Spark height, D4...Clamp/capillary spacing.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ワイヤボンデイング装置において、キヤピラリ
と；キヤピラリを拘持するボンデイングアームと
；第１のボンデイング点に固着されたワイヤが第
２のボンデイング点に位置決めされた時このワイ
ヤを拘持し、該拘持の状態をワイヤのスパークが
終了するまで継続するカツトクランプと；カツト
クランプを拘持するクランプアームと；ボンデイ
ングアームとクランプアームとの相対位置を固定
する手段と；クランプアームがカツトクランプを
第２のボンデイング点に近づける運動を、該カツ
トクランプが第２のボンデイング点から所定の高
さに達した時点で停止させ、カツトクランプに該
第２のボンデイング点からの所定の高さを保持さ
せるストツパと；を具備することを特徴とするワ
イヤボンデイング装置。 In a wire bonding device, a capillary; a bonding arm that holds the capillary; and a bonding arm that holds the wire fixed to a first bonding point when the wire is positioned at a second bonding point; a cut clamp that continues until the spark in the wire ends; a clamp arm that holds the cut clamp; a means for fixing the relative positions of the bonding arm and the clamp arm; a clamp arm that holds the cut clamp at a second bonding point; a stopper that stops the movement of the cut clamp when it reaches a predetermined height from the second bonding point, and causes the cut clamp to maintain the predetermined height from the second bonding point; A wire bonding device characterized by:
JP1987163388U 1987-10-26 1987-10-26 Expired - Lifetime JPH0525240Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987163388U JPH0525240Y2 (en) 1987-10-26 1987-10-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987163388U JPH0525240Y2 (en) 1987-10-26 1987-10-26

Publications (2)

Publication Number Publication Date
JPH0167745U true JPH0167745U (en) 1989-05-01
JPH0525240Y2 JPH0525240Y2 (en) 1993-06-25

Family

ID=31448072

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987163388U Expired - Lifetime JPH0525240Y2 (en) 1987-10-26 1987-10-26

Country Status (1)

Country Link
JP (1) JPH0525240Y2 (en)

Also Published As

Publication number Publication date
JPH0525240Y2 (en) 1993-06-25

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