JPH0167744U - - Google Patents

Info

Publication number
JPH0167744U
JPH0167744U JP1987163387U JP16338787U JPH0167744U JP H0167744 U JPH0167744 U JP H0167744U JP 1987163387 U JP1987163387 U JP 1987163387U JP 16338787 U JP16338787 U JP 16338787U JP H0167744 U JPH0167744 U JP H0167744U
Authority
JP
Japan
Prior art keywords
height
capillary
spark
signal
feed amount
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1987163387U
Other languages
Japanese (ja)
Other versions
JPH0533008Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987163387U priority Critical patent/JPH0533008Y2/ja
Publication of JPH0167744U publication Critical patent/JPH0167744U/ja
Application granted granted Critical
Publication of JPH0533008Y2 publication Critical patent/JPH0533008Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01551—Changing the shapes of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07511—Treating the bonding area before connecting, e.g. by applying flux or cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案実施例のワイヤボンデイング装
置のスパーク高さ補正回路の構成を示すブロツク
図、第２図は従来のワイヤボンデイング装置のス
パークギヤツプの形成を説明する図である。 １……キヤピラリ高さ検出器、２……ワイヤフ
イード量誤差分演算回路、３……スパーク高さ修
正回路、４……キヤピラリ高さ制御回路、５……
揺動アーム駆動用モータ駆動回路、１１……キヤ
ピラリ高さ信号、１２……フイード量誤差分信号
、１３……修正スパーク高さ信号、１４……駆動
信号、２１……ワイヤ、２１ａ……ワイヤのボー
ル形成部分、２２……キヤピラリ、２３……リー
ド、２４……スパークロツド、２５……高さ基準
、２９……ボール、Ｆ……最適フイード量、Ｇ…
…最適ギヤツプ、Ｒ……スパークロツドのスパー
ク面高さ、Ｓ……最適スパーク高さ。 FIG. 1 is a block diagram showing the configuration of a spark height correction circuit of a wire bonding apparatus according to an embodiment of the present invention, and FIG. 2 is a diagram illustrating the formation of a spark gap in a conventional wire bonding apparatus. 1... Capillary height detector, 2... Wire feed amount error calculating circuit, 3... Spark height correction circuit, 4... Capillary height control circuit, 5...
Swing arm drive motor drive circuit, 11... Capillary height signal, 12... Feed amount error signal, 13... Corrected spark height signal, 14... Drive signal, 21... Wire, 21a... Wire Ball forming part, 22...Capillary, 23...Lead, 24...Spark rod, 25...Height reference, 29...Ball, F...Optimum feed amount, G...
...optimum gap, R...spark surface height of spark rod, S...optimum spark height.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ワイヤボンデイング装置において、ワイヤのボ
ール形成部分の長さが定められる時ボンデイング
点に対するキヤピラリ先端の高さを検出し、これ
をキヤピラリ高さ信号として出力するキヤピラリ
高さ検出器と；キヤピラリ高さ信号を受け、前記
の高さと予め定められているワイヤフイード量と
の差を算出し、これをフイード量誤差分信号とし
て出力するワイヤフイード量誤差分演算回路と；
フイード量誤差分信号を受け、予め定められてい
るスパーク高さを前記の差に対応させて修正し、
修正スパーク高さ信号を出力するスパーク高さ修
正回路と；修正スパーク高さ信号を受け、キヤピ
ラリを前記の修正スパーク高さに位置決めする動
作を、キヤピラリ位置決め手段に行わせる駆動信
号を出力するキヤピラリ高さ制御回路と；を具備
することを特徴とするワイヤボンデイング装置の
スパーク高さ補正回路。 In a wire bonding device, a capillary height detector detects the height of the tip of the capillary with respect to the bonding point when the length of the ball forming portion of the wire is determined, and outputs this as a capillary height signal; a wire feed amount error calculation circuit that calculates the difference between the height and a predetermined wire feed amount and outputs this as a feed amount error signal;
Receiving the feed amount error signal, the predetermined spark height is corrected to correspond to the difference,
a spark height correction circuit that outputs a corrected spark height signal; a capillary height that receives the corrected spark height signal and outputs a drive signal that causes the capillary positioning means to perform an operation of positioning the capillary at the corrected spark height; 1. A spark height correction circuit for a wire bonding device, comprising: a spark height control circuit;
JP1987163387U 1987-10-26 1987-10-26 Expired - Lifetime JPH0533008Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987163387U JPH0533008Y2 (en) 1987-10-26 1987-10-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987163387U JPH0533008Y2 (en) 1987-10-26 1987-10-26

Publications (2)

Publication Number Publication Date
JPH0167744U true JPH0167744U (en) 1989-05-01
JPH0533008Y2 JPH0533008Y2 (en) 1993-08-23

Family

ID=31448070

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987163387U Expired - Lifetime JPH0533008Y2 (en) 1987-10-26 1987-10-26

Country Status (1)

Country Link
JP (1) JPH0533008Y2 (en)

Also Published As

Publication number Publication date
JPH0533008Y2 (en) 1993-08-23

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