JPH0167763U - - Google Patents
Info
- Publication number
- JPH0167763U JPH0167763U JP1987162796U JP16279687U JPH0167763U JP H0167763 U JPH0167763 U JP H0167763U JP 1987162796 U JP1987162796 U JP 1987162796U JP 16279687 U JP16279687 U JP 16279687U JP H0167763 U JPH0167763 U JP H0167763U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- projections
- substrate
- electronic component
- edge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 5
- 230000015572 biosynthetic process Effects 0.000 claims 3
- 239000000565 sealant Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図はＡ，Ｂは本考案の第１実施例の構成を
示す正面図及び側面図、第１図Ａ，Ｂは本考案の
第２実施例の構成を示す正面図及び側面図、第３
図Ａ，Ｂは本考案の第３実施例の構成を示す正面
図及び側面図、第４図は前記第１実施例のクリツ
プリードの基板への接続配列状態を示す部分正面
図、第５図は前記第１実施例のクリツプリードを
取付けたワークの樹脂封止後の状態を示す部分正
面図、第６図は従来のクリツプリードを取付けた
ワークの正面図、第７図は樹脂封止の行程図、第
８図は従来のクリツプリードの側面図、第９図は
従来のクリツプリードを使用した電子部品の封止
状態を示す部分正面図である。
１……基板、５……封止剤、６……封止剤層、
２０Ａ，２０Ｂ，２０Ｃ……クリツプリード、２
４……凹部、２３……凸部、２５……透孔、２６
……切欠き。
1A and 1B are front and side views showing the structure of the first embodiment of the present invention; FIGS. 1A and B are front and side views showing the structure of the second embodiment of the present invention; 3
Figures A and B are front and side views showing the configuration of the third embodiment of the present invention, Figure 4 is a partial front view showing the connection arrangement of the clip leads to the board of the first embodiment, and Figure 5. is a partial front view showing the state of the workpiece to which the clip lead of the first embodiment is attached after being sealed with resin, FIG. 6 is a front view of the workpiece to which the conventional clip lead is attached, and FIG. FIG. 8 is a side view of a conventional clip lead, and FIG. 9 is a partial front view showing a sealed state of an electronic component using the conventional clip lead. 1...Substrate, 5...Sealant, 6...Sealant layer,
20A, 20B, 20C... Clip lead, 2
4...Concave portion, 23...Convex portion, 25...Through hole, 26
...Notch.
補正 昭６３．２．２２
図面の簡単な説明を次のように補正する。
明細書第１１頁第２０行目に「第１図」とある
のを、「第２図」に補正する。Amendment February 22, 1981 The brief description of the drawing is amended as follows. The text "Fig. 1" on page 11, line 20 of the specification is corrected to "Fig. 2."
Claims (1)
されて内部回路に接続され、該一端が基板と共に
樹脂封止される樹脂封止形電子部品用クリツプリ
ードにおいて、 前記基板に固定される端部近傍に凹凸の少なく
とも一方を形成し、 かつ、複数本のクリツプリードの各々の凹凸の
形成位置を、前記基板の辺縁中央部では基板より
遠く、基板辺縁端部に行く程基板に近くなるよう
に設定したことを特徴とする樹脂封止形電子部品
用クリツプリード。[Claims for Utility Model Registration] A clip lead for a resin-sealed electronic component, one end of which is fixed to the edge of a board of the resin-sealed electronic component and connected to an internal circuit, and the one end is resin-sealed together with the board. At least one of the projections and recesses is formed in the vicinity of the end fixed to the substrate, and the formation position of each of the projections and recesses of each of the plurality of clip leads is set such that the formation position of the projections and depressions of each of the plurality of clip leads is such that the formation position of the projections and depressions is at the center of the edge of the substrate and further away from the substrate. A clip lead for a resin-sealed electronic component, characterized in that it is set closer to a substrate toward the edge.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16279687U JPH0526765Y2 (en) | 1987-10-23 | 1987-10-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16279687U JPH0526765Y2 (en) | 1987-10-23 | 1987-10-23 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0167763U true JPH0167763U (en) | 1989-05-01 |
| JPH0526765Y2 JPH0526765Y2 (en) | 1993-07-07 |
Family
ID=31446949
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16279687U Expired - Lifetime JPH0526765Y2 (en) | 1987-10-23 | 1987-10-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0526765Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009277959A (en) * | 2008-05-16 | 2009-11-26 | Mitsubishi Electric Corp | Semiconductor device and method of manufacturing the same |
-
1987
- 1987-10-23 JP JP16279687U patent/JPH0526765Y2/ja not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009277959A (en) * | 2008-05-16 | 2009-11-26 | Mitsubishi Electric Corp | Semiconductor device and method of manufacturing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0526765Y2 (en) | 1993-07-07 |
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