JPH0224570U - - Google Patents

Info

Publication number
JPH0224570U
JPH0224570U JP10155988U JP10155988U JPH0224570U JP H0224570 U JPH0224570 U JP H0224570U JP 10155988 U JP10155988 U JP 10155988U JP 10155988 U JP10155988 U JP 10155988U JP H0224570 U JPH0224570 U JP H0224570U
Authority
JP
Japan
Prior art keywords
component mounting
mounting land
circuit board
thick film
film resistor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10155988U
Other languages
Japanese (ja)
Other versions
JPH0611531Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988101559U priority Critical patent/JPH0611531Y2/en
Publication of JPH0224570U publication Critical patent/JPH0224570U/ja
Application granted granted Critical
Publication of JPH0611531Y2 publication Critical patent/JPH0611531Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Parts Printed On Printed Circuit Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図Ａ，Ｂ，Ｃは本考案の実施例に係わる混
成集積回路の一部を製造工程順に示す平面図、第
２図は第１図Ｃの−線に相当する部分の断面
図、第３図は幅広の電子部品を装着した状態を第
２図に対応する部分で示す断面図である。 １……回路基板、３……一方の側の部品取付用
ランド、４……他方の側の部品取付用ランド、４
ａ……第１のランド部、４ｂ……第２のランド部
、５……厚膜抵抗体層、６……半田流動阻止用ダ
ム、７……オーバーコートガラス層、８ａ……第
１の電子部品、８ｂ……第２の電子部品、１０，
１１……リード端子、１２……半田。 1A, B, and C are plan views showing a part of a hybrid integrated circuit according to an embodiment of the present invention in the order of manufacturing steps; FIG. 2 is a cross-sectional view of a portion corresponding to the - line in FIG. FIG. 3 is a sectional view corresponding to FIG. 2 showing a state in which a wide electronic component is mounted. 1... Circuit board, 3... Land for mounting components on one side, 4... Land for mounting components on the other side, 4
a...First land portion, 4b...Second land portion, 5...Thick film resistor layer, 6...Dam for preventing solder flow, 7...Overcoat glass layer, 8a...First land portion electronic component, 8b...second electronic component, 10,
11...Lead terminal, 12...Solder.

Claims (1)

【実用新案登録請求の範囲】 リード端子間ピツチがほぼ同一又は整数倍であ
るが、幅が異なる複数種の電子部品を半田によつ
て取付けることができるように部品取付用ランド
が設けられている回路基板装置において、 前記部品取付用ランドが複数個に分割されるよ
うに厚膜抵抗体層又はこれを含む層から成る半田
流動阻止用ダムが前記部品取付用ランド上に設け
られていることを特徴とする回路基板装置。[Claim for Utility Model Registration] A component mounting land is provided so that multiple types of electronic components with different widths can be attached by soldering, but the pitch between the lead terminals is almost the same or an integral multiple. In the circuit board device, a dam for preventing solder flow consisting of a thick film resistor layer or a layer including the thick film resistor layer is provided on the component mounting land so that the component mounting land is divided into a plurality of parts. Characteristic circuit board device.
JP1988101559U 1988-07-30 1988-07-30 Circuit board device Expired - Lifetime JPH0611531Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988101559U JPH0611531Y2 (en) 1988-07-30 1988-07-30 Circuit board device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988101559U JPH0611531Y2 (en) 1988-07-30 1988-07-30 Circuit board device

Publications (2)

Publication Number Publication Date
JPH0224570U true JPH0224570U (en) 1990-02-19
JPH0611531Y2 JPH0611531Y2 (en) 1994-03-23

Family

ID=31330667

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988101559U Expired - Lifetime JPH0611531Y2 (en) 1988-07-30 1988-07-30 Circuit board device

Country Status (1)

Country Link
JP (1) JPH0611531Y2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2011040480A1 (en) * 2009-09-30 2013-02-28 株式会社村田製作所 Circuit board

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4978164A (en) * 1972-12-04 1974-07-27
JPS62196376U (en) * 1986-06-04 1987-12-14

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4978164A (en) * 1972-12-04 1974-07-27
JPS62196376U (en) * 1986-06-04 1987-12-14

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2011040480A1 (en) * 2009-09-30 2013-02-28 株式会社村田製作所 Circuit board

Also Published As

Publication number Publication date
JPH0611531Y2 (en) 1994-03-23

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