JPH0167774U - - Google Patents

Info

Publication number
JPH0167774U
JPH0167774U JP1987163852U JP16385287U JPH0167774U JP H0167774 U JPH0167774 U JP H0167774U JP 1987163852 U JP1987163852 U JP 1987163852U JP 16385287 U JP16385287 U JP 16385287U JP H0167774 U JPH0167774 U JP H0167774U
Authority
JP
Japan
Prior art keywords
board
joint parts
plane
large number
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987163852U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987163852U priority Critical patent/JPH0167774U/ja
Publication of JPH0167774U publication Critical patent/JPH0167774U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Combinations Of Printed Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例の概略を示す斜視図
、第2図は第1図の基板を用いた回路装置の部分
断面図、第3図は本考案の第2実施例による回路
装置の部分断面図、第4図は従来の回路基板によ
る半導体回路装置の部分断面図である。 1……細片基板、2,3……関節部品、4……
接続導線、5……電子回路部品、6……カバー樹
脂、10……全一枚の基板。
FIG. 1 is a perspective view schematically showing an embodiment of the present invention, FIG. 2 is a partial cross-sectional view of a circuit device using the substrate of FIG. 1, and FIG. 3 is a circuit device according to a second embodiment of the present invention. FIG. 4 is a partial sectional view of a semiconductor circuit device using a conventional circuit board. 1... Strip board, 2, 3... Joint parts, 4...
Connection conductor, 5...Electronic circuit components, 6...Cover resin, 10...All one board.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 細分化された多数の細片基板を関節部品を使用
して平面上に連結し、さらに各基板間を導線にて
電気的に接続してなることを特徴とする多関節基
板。
A multi-jointed board characterized by connecting a large number of subdivided strip boards on a plane using joint parts, and further electrically connecting each board with a conductive wire.
JP1987163852U 1987-10-26 1987-10-26 Pending JPH0167774U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987163852U JPH0167774U (en) 1987-10-26 1987-10-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987163852U JPH0167774U (en) 1987-10-26 1987-10-26

Publications (1)

Publication Number Publication Date
JPH0167774U true JPH0167774U (en) 1989-05-01

Family

ID=31448951

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987163852U Pending JPH0167774U (en) 1987-10-26 1987-10-26

Country Status (1)

Country Link
JP (1) JPH0167774U (en)

Similar Documents

Publication Publication Date Title
JPH0167774U (en)
JPS5937737U (en) integrated circuit board
JPS636768U (en)
JPS6188262U (en)
JPS6268270U (en)
JPS59109194U (en) Hybrid integrated circuit device
JPS61121671U (en)
JPS62170646U (en)
JPS60169849U (en) Integrated circuit mounting structure
JPS6175156U (en)
JPS62122379U (en)
JPS62151780U (en)
JPS5918459U (en) Electrical element mounting structure
JPH0436270U (en)
JPS6265872U (en)
JPH0351872U (en)
JPS5991772U (en) Printed wiring board connection device
JPS63157949U (en)
JPS63273U (en)
JPH0231067U (en)
JPS62204373U (en)
JPS58184787U (en) flexible cable
JPS62120397U (en)
JPS6157564U (en)
JPS5820558U (en) Connection part between printed wiring board and circuit components