JPH0168172U - - Google Patents
Info
- Publication number
- JPH0168172U JPH0168172U JP1987164936U JP16493687U JPH0168172U JP H0168172 U JPH0168172 U JP H0168172U JP 1987164936 U JP1987164936 U JP 1987164936U JP 16493687 U JP16493687 U JP 16493687U JP H0168172 U JPH0168172 U JP H0168172U
- Authority
- JP
- Japan
- Prior art keywords
- heater
- furnace
- reflow soldering
- printed circuit
- solder melting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 7
- 238000002844 melting Methods 0.000 claims description 5
- 230000008018 melting Effects 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 4
- 230000000903 blocking effect Effects 0.000 claims 1
- 238000010792 warming Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案の一実施例の赤外線リフローは
んだ付装置の内部構造を示す断面図、第２図は第
１図の赤外線リフローはんだ付装置の炉内の温度
上昇を示す曲線図、第３図は従来の赤外線リフロ
ーはんだ付装置の内部構造を示す断面図、第４図
は第３図の赤外線リフローはんだ付装置の炉内の
温度上昇を示す曲線図である。
１…予熱ヒータ、２…加熱エアーブロワー、３
…はんだ溶融加熱ヒータ、４…冷却ブロワー、５
…ベルトコンベア、６，７，１２…温度曲線、８
…予熱区分、９…はんだ溶融加熱区分、１０…炉
、１１…プリント基板。
FIG. 1 is a sectional view showing the internal structure of an infrared reflow soldering device according to an embodiment of the present invention, FIG. 2 is a curve diagram showing the temperature rise in the furnace of the infrared reflow soldering device of FIG. 1, and FIG. The figure is a sectional view showing the internal structure of a conventional infrared reflow soldering apparatus, and FIG. 4 is a curve diagram showing the temperature rise in the furnace of the infrared reflow soldering apparatus of FIG. 1... Preheating heater, 2... Heating air blower, 3
...Solder melting heater, 4...Cooling blower, 5
...belt conveyor, 6,7,12...temperature curve, 8
...Preheating section, 9...Solder melting heating section, 10...Furnace, 11...Printed circuit board.
Claims (1)
けてあり、前記炉内に運び込まれた前記プリント
基板を温める予熱ヒータとこの予熱ヒータで温め
られた前記プリント基板を加熱するはんだ溶融加
熱ヒータとが前記炉内に設けてある赤外線リフロ
ーはんだ付装置において、前記予熱ヒータ及びは
んだ溶融加熱ヒータ間の熱伝導を阻止する加熱エ
アーブロアーが前記予熱ヒータ及びはんだ溶融加
熱ヒータ間に設けてあることを特徴とする赤外線
リフローはんだ付装置。 A belt conveyor for carrying printed circuit boards is provided in the furnace, and a preheating heater for warming the printed circuit board carried into the furnace and a solder melting heater for heating the printed circuit board warmed by the preheating heater are installed in the furnace. In the infrared reflow soldering apparatus provided in the infrared reflow soldering apparatus, a heating air blower for blocking heat conduction between the preheating heater and the solder melting heater is provided between the preheating heater and the solder melting heater. Reflow soldering equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987164936U JPH0168172U (en) | 1987-10-27 | 1987-10-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987164936U JPH0168172U (en) | 1987-10-27 | 1987-10-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0168172U true JPH0168172U (en) | 1989-05-02 |
Family
ID=31450974
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987164936U Pending JPH0168172U (en) | 1987-10-27 | 1987-10-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0168172U (en) |
-
1987
- 1987-10-27 JP JP1987164936U patent/JPH0168172U/ja active Pending
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