JPS623266U - - Google Patents
Info
- Publication number
- JPS623266U JPS623266U JP9233085U JP9233085U JPS623266U JP S623266 U JPS623266 U JP S623266U JP 9233085 U JP9233085 U JP 9233085U JP 9233085 U JP9233085 U JP 9233085U JP S623266 U JPS623266 U JP S623266U
- Authority
- JP
- Japan
- Prior art keywords
- heating
- changing
- hot air
- solder welding
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 claims description 10
- 229910000679 solder Inorganic materials 0.000 claims description 7
- 238000003466 welding Methods 0.000 claims 4
- 239000011261 inert gas Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案の加熱部移動形の装置の１例の
断面図、第２図は本考案の熱風を利用する装置の
１例の断面図、第３図は第２図の熱風吹出し口と
基板との関係を示す横断面図、第４図は半田リフ
ローの温度プロフアイルの１例を示すグラフそし
て第５図は従来の大型半田リフロー装置の断面図
である。
１：半田付けする電子部品（被溶接物）と半田
とを搭載した基板、２：ベルトコンベア、３：加
熱炉、３―１：予備加熱炉、３―２：本加熱炉、
４：上下移動可能なヒータ、４―１：上部ヒータ
、４―２：下部ヒータ、５：基板支持用金網、６
：不活性ガス注入及び排気口、７：左右に移動可
能な熱風発生装置、８：熱風吹出し口。
Fig. 1 is a sectional view of an example of a device of the present invention with a moving heating part, Fig. 2 is a sectional view of an example of a device of the invention that utilizes hot air, and Fig. 3 is a hot air outlet of Fig. 2. 4 is a graph showing an example of the temperature profile of solder reflow, and FIG. 5 is a sectional view of a conventional large-scale solder reflow apparatus. 1: Board on which electronic components to be soldered (objects to be welded) and solder are mounted, 2: Belt conveyor, 3: Heating furnace, 3-1: Preheating furnace, 3-2: Main heating furnace,
4: Vertically movable heater, 4-1: Upper heater, 4-2: Lower heater, 5: Wire mesh for substrate support, 6
: Inert gas injection and exhaust port, 7: Hot air generator movable left and right, 8: Hot air outlet.
Claims (1)
熱する半田溶接装置において、該炉内に移動可能
な加熱手段を設け、加熱部と被加熱部との距離の
変化及び／又は加熱部の加熱温度の変化によつて
被加熱部の温度を制御する手段を設けたことを特
徴とする半田溶接装置。 ２ 該移動可能な加熱手段がヒーター又は赤外線
ランプであり、該制御する手段が、加熱部と被加
熱部との距離を変化させる手段である実用新案登
録請求の範囲第１項記載の半田溶接装置。 ３ 該移動可能な加熱手段が、熱風吹出し口を備
えた熱風発生装置であり、該制御する手段が、熱
風の温度を変化させる手段である実用新案登録請
求の範囲第１項記載の半田溶接装置。[Scope of Claim for Utility Model Registration] 1. In a solder welding device that heats the objects to be soldered welded in a single electric furnace, a movable heating means is provided in the furnace, and the heating section and the heated section are connected. 1. A solder welding device comprising means for controlling the temperature of a heated part by changing the distance and/or changing the heating temperature of the heating part. 2. The solder welding apparatus according to claim 1, wherein the movable heating means is a heater or an infrared lamp, and the controlling means is means for changing the distance between the heating part and the heated part. . 3. The solder welding apparatus according to claim 1, wherein the movable heating means is a hot air generator equipped with a hot air outlet, and the controlling means is means for changing the temperature of the hot air. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9233085U JPS623266U (en) | 1985-06-20 | 1985-06-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9233085U JPS623266U (en) | 1985-06-20 | 1985-06-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS623266U true JPS623266U (en) | 1987-01-10 |
Family
ID=30649032
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9233085U Pending JPS623266U (en) | 1985-06-20 | 1985-06-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS623266U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012009597A (en) * | 2010-06-24 | 2012-01-12 | Elpida Memory Inc | Manufacturing method for semiconductor device and manufacturing apparatus for semiconductor device |
-
1985
- 1985-06-20 JP JP9233085U patent/JPS623266U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012009597A (en) * | 2010-06-24 | 2012-01-12 | Elpida Memory Inc | Manufacturing method for semiconductor device and manufacturing apparatus for semiconductor device |
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