JPH0168665U - - Google Patents

Info

Publication number
JPH0168665U
JPH0168665U JP16253087U JP16253087U JPH0168665U JP H0168665 U JPH0168665 U JP H0168665U JP 16253087 U JP16253087 U JP 16253087U JP 16253087 U JP16253087 U JP 16253087U JP H0168665 U JPH0168665 U JP H0168665U
Authority
JP
Japan
Prior art keywords
pad
substrate
electronic component
component assembly
pair
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16253087U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP16253087U priority Critical patent/JPH0168665U/ja
Publication of JPH0168665U publication Critical patent/JPH0168665U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Multi-Conductor Connections (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

図面第１図は本考案の実施例を示す断面図、第
２図は上記実施例に用いられるコンタクトの要部
を示す斜視図、第３Ａ図および第３Ｂ図は別のコ
ンタクトの要部を示す斜視図と断面図、第４Ａ図
第４Ｂ図は更に別のコンタクトの要部を示す斜視
図と断面図である。 主要部分の符号の説明、１……基板、２……コ
ネクタ、１０……導電性のパツド、１０Ａ……ハ
ンダ層、２０……コンタクト、２０Ａ……スリツ
トまたは孔。 Figure 1 is a sectional view showing an embodiment of the present invention, Figure 2 is a perspective view showing the main parts of a contact used in the above embodiment, and Figures 3A and 3B show the main parts of another contact. A perspective view and a sectional view, FIGS. 4A and 4B are a perspective view and a sectional view showing the main parts of yet another contact. Explanation of symbols of main parts: 1... board, 2... connector, 10... conductive pad, 10A... solder layer, 20... contact, 20A... slit or hole.

Claims (1)

【実用新案登録請求の範囲】 １ 表面に予めハンダ層１０Ａを設けた導電性の
パツド１０を有する基板１と、 該基板の上記パツドの表面をスライドして所定
の位置で該パツドとハンダ付けさせる導電性の端
子２０を有するコネクタ等の部材２から成る、 電子部品アセンブリであつて、 前記端子は、その先端部を外方に膨出させると
共に、前記パツドとハンダ付けさせる部位に、前
記パツドのハンダ層から熔融したハンダが滲み出
ることのできるように、孔またはスリツト２０Ａ
を設けて成る、電子部品アセンブリ。 ２ 実用新案登録請求の範囲第１項に記載の電子
部品アセンブリにおいて、前記基板のパツドは該
基板の表面に少なくとも一対設け、かつ前記端子
は該一対のパツドに対応して少なくとも一対設け
て成る、電子部品アセンブリ。[Claims for Utility Model Registration] 1. A substrate 1 having a conductive pad 10 on which a solder layer 10A has been previously provided, and a surface of the pad on the substrate to be slid and soldered to the pad at a predetermined position. An electronic component assembly consisting of a member 2 such as a connector having a conductive terminal 20, the terminal having a distal end bulging outward and a portion of the pad to be soldered to the pad. A hole or slit 20A is provided to allow molten solder to seep out of the solder layer.
An electronic component assembly comprising: 2 Utility Model Registration Scope of Claim 1 In the electronic component assembly according to claim 1, at least one pair of pads of the substrate are provided on the surface of the substrate, and at least one pair of the terminals are provided corresponding to the pair of pads. Electronic component assembly.
JP16253087U 1987-10-26 1987-10-26 Pending JPH0168665U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16253087U JPH0168665U (en) 1987-10-26 1987-10-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16253087U JPH0168665U (en) 1987-10-26 1987-10-26

Publications (1)

Publication Number Publication Date
JPH0168665U true JPH0168665U (en) 1989-05-02

Family

ID=31446438

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16253087U Pending JPH0168665U (en) 1987-10-26 1987-10-26

Country Status (1)

Country Link
JP (1) JPH0168665U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0864273A (en) * 1994-08-22 1996-03-08 Nippondenso Co Ltd Connector pin connecting apparatus and assembling method therefor

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61237374A (en) * 1985-04-10 1986-10-22 アイテイーテイー　インダストリーズ，インコーポレイティド Surface mount type connector

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61237374A (en) * 1985-04-10 1986-10-22 アイテイーテイー　インダストリーズ，インコーポレイティド Surface mount type connector

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0864273A (en) * 1994-08-22 1996-03-08 Nippondenso Co Ltd Connector pin connecting apparatus and assembling method therefor

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