JPH0170174U - - Google Patents
Info
- Publication number
- JPH0170174U JPH0170174U JP1987165535U JP16553587U JPH0170174U JP H0170174 U JPH0170174 U JP H0170174U JP 1987165535 U JP1987165535 U JP 1987165535U JP 16553587 U JP16553587 U JP 16553587U JP H0170174 U JPH0170174 U JP H0170174U
- Authority
- JP
- Japan
- Prior art keywords
- socket
- pin socket
- measurement circuit
- wears out
- pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005259 measurement Methods 0.000 claims 2
- 239000011810 insulating material Substances 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 239000012212 insulator Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
Description
第1図は本考案のピンソケツトの一実施例の図
、第2図は従来のピンソケツトの一実施例を示す
図である。
1……プリント基板、2……従来のピンソケツ
ト、3……ICソケツトのリード、4……ICソ
ケツト、5……IC、6……本考案のピンソケツ
ト、7……絶縁物、8……半田付け。
FIG. 1 is a diagram showing an embodiment of a pin socket of the present invention, and FIG. 2 is a diagram showing an embodiment of a conventional pin socket. DESCRIPTION OF SYMBOLS 1... Printed circuit board, 2... Conventional pin socket, 3... IC socket lead, 4... IC socket, 5... IC, 6... Pin socket of the present invention, 7... Insulator, 8... Solder Attached.
Claims (1)
するソケツトは磨耗するために、測定回路に接続
されたピンソケツトにICソケツトを挿入し磨耗
したら、ピンソケツトからはずして交換するが、
この時使用するピンソケツトにおいて、測定回路
に半田付けで接続される凸状の部分を除いた外部
に絶縁物を塗布したことを特徴とするピンソケツ
ト。 When selecting the characteristics of semiconductor devices, the socket into which the IC is inserted wears out, so the IC socket is inserted into the pin socket connected to the measurement circuit, and when it wears out, it is removed from the pin socket and replaced.
A pin socket used at this time is characterized in that an insulating material is applied to the outside except for the convex part that is connected to the measurement circuit by soldering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987165535U JPH0170174U (en) | 1987-10-28 | 1987-10-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987165535U JPH0170174U (en) | 1987-10-28 | 1987-10-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0170174U true JPH0170174U (en) | 1989-05-10 |
Family
ID=31452108
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987165535U Pending JPH0170174U (en) | 1987-10-28 | 1987-10-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0170174U (en) |
-
1987
- 1987-10-28 JP JP1987165535U patent/JPH0170174U/ja active Pending
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