JPH0363217U - - Google Patents

Info

Publication number
JPH0363217U
JPH0363217U JP12423189U JP12423189U JPH0363217U JP H0363217 U JPH0363217 U JP H0363217U JP 12423189 U JP12423189 U JP 12423189U JP 12423189 U JP12423189 U JP 12423189U JP H0363217 U JPH0363217 U JP H0363217U
Authority
JP
Japan
Prior art keywords
integrated circuit
semiconductor
metal wire
electrode pad
thin metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12423189U
Other languages
Japanese (ja)
Other versions
JPH0749540Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12423189U priority Critical patent/JPH0749540Y2/en
Publication of JPH0363217U publication Critical patent/JPH0363217U/ja
Application granted granted Critical
Publication of JPH0749540Y2 publication Critical patent/JPH0749540Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Protection Of Static Devices (AREA)
  • Continuous-Control Power Sources That Use Transistors (AREA)
  • Electronic Switches (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案に係る半導体集積回路装置の一
実施例を示す回路図、第2図は第1図の半導体集
積回路装置の要部斜視図である。第3図は半導体
集積回路装置の従来例を示す回路図である。 21……半導体ペレツト、22……基板、23
……リード、23a……先端部、26……電極パ
ツド、30……過電流検出回路、37……金属細
線。
FIG. 1 is a circuit diagram showing an embodiment of a semiconductor integrated circuit device according to the present invention, and FIG. 2 is a perspective view of a main part of the semiconductor integrated circuit device of FIG. 1. FIG. 3 is a circuit diagram showing a conventional example of a semiconductor integrated circuit device. 21... Semiconductor pellet, 22... Substrate, 23
...Lead, 23a...Tip, 26...Electrode pad, 30...Overcurrent detection circuit, 37...Thin metal wire.

Claims (1)

【実用新案登録請求の範囲】 半導体集積回路を組込んだ半導体ペレツトを基
板上に固着し、上記半導体ペレツト表面の電極パ
ツドとリードの先端部とを金属細線で電気的に接
続したものにおいて、 上記半導体ペレツト内の過電流検出回路の電極
パツドとリード先端部間に接続された金属細線を
過電流検出用抵抗としたことを特徴とする半導体
集積回路装置。
[Claims for Utility Model Registration] A semiconductor pellet incorporating a semiconductor integrated circuit is fixed on a substrate, and the electrode pad on the surface of the semiconductor pellet and the tip of the lead are electrically connected by a thin metal wire, A semiconductor integrated circuit device characterized in that a thin metal wire connected between an electrode pad of an overcurrent detection circuit in a semiconductor pellet and a lead tip is used as an overcurrent detection resistor.
JP12423189U 1989-10-23 1989-10-23 Semiconductor integrated circuit device Expired - Lifetime JPH0749540Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12423189U JPH0749540Y2 (en) 1989-10-23 1989-10-23 Semiconductor integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12423189U JPH0749540Y2 (en) 1989-10-23 1989-10-23 Semiconductor integrated circuit device

Publications (2)

Publication Number Publication Date
JPH0363217U true JPH0363217U (en) 1991-06-20
JPH0749540Y2 JPH0749540Y2 (en) 1995-11-13

Family

ID=31672163

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12423189U Expired - Lifetime JPH0749540Y2 (en) 1989-10-23 1989-10-23 Semiconductor integrated circuit device

Country Status (1)

Country Link
JP (1) JPH0749540Y2 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006309312A (en) * 2005-04-26 2006-11-09 Sharp Corp regulator
JP2007156521A (en) * 2005-11-30 2007-06-21 Toyota Motor Corp Power supply voltage control device and control method thereof
JP2007331628A (en) * 2006-06-16 2007-12-27 Topre Corp Moving partition fixed swing structure in the container
JP2008162406A (en) * 2006-12-28 2008-07-17 Torantekkusu:Kk Partitioning device
JP2009027914A (en) * 2007-07-19 2009-02-05 Ford Global Technologies Llc Micro hybrid vehicle and operation control method for engine starter system

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006309312A (en) * 2005-04-26 2006-11-09 Sharp Corp regulator
JP2007156521A (en) * 2005-11-30 2007-06-21 Toyota Motor Corp Power supply voltage control device and control method thereof
JP2007331628A (en) * 2006-06-16 2007-12-27 Topre Corp Moving partition fixed swing structure in the container
JP2008162406A (en) * 2006-12-28 2008-07-17 Torantekkusu:Kk Partitioning device
JP2009027914A (en) * 2007-07-19 2009-02-05 Ford Global Technologies Llc Micro hybrid vehicle and operation control method for engine starter system

Also Published As

Publication number Publication date
JPH0749540Y2 (en) 1995-11-13

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