JPH0363217U - - Google Patents
Info
- Publication number
- JPH0363217U JPH0363217U JP12423189U JP12423189U JPH0363217U JP H0363217 U JPH0363217 U JP H0363217U JP 12423189 U JP12423189 U JP 12423189U JP 12423189 U JP12423189 U JP 12423189U JP H0363217 U JPH0363217 U JP H0363217U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- semiconductor
- metal wire
- electrode pad
- thin metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 9
- 239000008188 pellet Substances 0.000 claims description 4
- 238000001514 detection method Methods 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Protection Of Static Devices (AREA)
- Continuous-Control Power Sources That Use Transistors (AREA)
- Electronic Switches (AREA)
Description
第1図は本考案に係る半導体集積回路装置の一
実施例を示す回路図、第2図は第1図の半導体集
積回路装置の要部斜視図である。第3図は半導体
集積回路装置の従来例を示す回路図である。
21……半導体ペレツト、22……基板、23
……リード、23a……先端部、26……電極パ
ツド、30……過電流検出回路、37……金属細
線。
FIG. 1 is a circuit diagram showing an embodiment of a semiconductor integrated circuit device according to the present invention, and FIG. 2 is a perspective view of a main part of the semiconductor integrated circuit device of FIG. 1. FIG. 3 is a circuit diagram showing a conventional example of a semiconductor integrated circuit device. 21... Semiconductor pellet, 22... Substrate, 23
...Lead, 23a...Tip, 26...Electrode pad, 30...Overcurrent detection circuit, 37...Thin metal wire.
Claims (1)
板上に固着し、上記半導体ペレツト表面の電極パ
ツドとリードの先端部とを金属細線で電気的に接
続したものにおいて、 上記半導体ペレツト内の過電流検出回路の電極
パツドとリード先端部間に接続された金属細線を
過電流検出用抵抗としたことを特徴とする半導体
集積回路装置。[Claims for Utility Model Registration] A semiconductor pellet incorporating a semiconductor integrated circuit is fixed on a substrate, and the electrode pad on the surface of the semiconductor pellet and the tip of the lead are electrically connected by a thin metal wire, A semiconductor integrated circuit device characterized in that a thin metal wire connected between an electrode pad of an overcurrent detection circuit in a semiconductor pellet and a lead tip is used as an overcurrent detection resistor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12423189U JPH0749540Y2 (en) | 1989-10-23 | 1989-10-23 | Semiconductor integrated circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12423189U JPH0749540Y2 (en) | 1989-10-23 | 1989-10-23 | Semiconductor integrated circuit device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0363217U true JPH0363217U (en) | 1991-06-20 |
| JPH0749540Y2 JPH0749540Y2 (en) | 1995-11-13 |
Family
ID=31672163
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12423189U Expired - Lifetime JPH0749540Y2 (en) | 1989-10-23 | 1989-10-23 | Semiconductor integrated circuit device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0749540Y2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006309312A (en) * | 2005-04-26 | 2006-11-09 | Sharp Corp | regulator |
| JP2007156521A (en) * | 2005-11-30 | 2007-06-21 | Toyota Motor Corp | Power supply voltage control device and control method thereof |
| JP2007331628A (en) * | 2006-06-16 | 2007-12-27 | Topre Corp | Moving partition fixed swing structure in the container |
| JP2008162406A (en) * | 2006-12-28 | 2008-07-17 | Torantekkusu:Kk | Partitioning device |
| JP2009027914A (en) * | 2007-07-19 | 2009-02-05 | Ford Global Technologies Llc | Micro hybrid vehicle and operation control method for engine starter system |
-
1989
- 1989-10-23 JP JP12423189U patent/JPH0749540Y2/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006309312A (en) * | 2005-04-26 | 2006-11-09 | Sharp Corp | regulator |
| JP2007156521A (en) * | 2005-11-30 | 2007-06-21 | Toyota Motor Corp | Power supply voltage control device and control method thereof |
| JP2007331628A (en) * | 2006-06-16 | 2007-12-27 | Topre Corp | Moving partition fixed swing structure in the container |
| JP2008162406A (en) * | 2006-12-28 | 2008-07-17 | Torantekkusu:Kk | Partitioning device |
| JP2009027914A (en) * | 2007-07-19 | 2009-02-05 | Ford Global Technologies Llc | Micro hybrid vehicle and operation control method for engine starter system |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0749540Y2 (en) | 1995-11-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0363217U (en) | ||
| JPH02114943U (en) | ||
| JPS61203564U (en) | ||
| JPS63187330U (en) | ||
| JPS62160546U (en) | ||
| JPH036842U (en) | ||
| JPS6190185U (en) | ||
| JPS622259U (en) | ||
| JPH02114941U (en) | ||
| JPS6214726U (en) | ||
| JPS6260091U (en) | ||
| JPS63195757U (en) | ||
| JPS63119248U (en) | ||
| JPH0341943U (en) | ||
| JPH0365245U (en) | ||
| JPS58155838U (en) | semiconductor equipment | |
| JPS5989551U (en) | Semiconductor integrated circuit device | |
| JPS63157973U (en) | ||
| JPH0345657U (en) | ||
| JPS6214725U (en) | ||
| JPS6122362U (en) | hybrid integrated circuit | |
| JPH032660U (en) | ||
| JPH0173935U (en) | ||
| JPH01146544U (en) | ||
| JPS58170835U (en) | semiconductor equipment |