JPH0170377U - - Google Patents
Info
- Publication number
- JPH0170377U JPH0170377U JP1987165803U JP16580387U JPH0170377U JP H0170377 U JPH0170377 U JP H0170377U JP 1987165803 U JP1987165803 U JP 1987165803U JP 16580387 U JP16580387 U JP 16580387U JP H0170377 U JPH0170377 U JP H0170377U
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- electronic component
- insertion hole
- hole
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図はこの考案の実施例を説明するための印
刷配線板に電子部品を実装した状態を示す斜視図
、第２図はその部分断面図、第３図は従来の印刷
配線板に電子部品を実装した状態を示す斜視図、
第４図はその部分断面図。
１は印刷配線板、２は表面非貫通メツキ穴、３
は電子部品、４は内層導体層、５は内層配線層。
なお、各図中同一符号は同一又は相当部分を示す
ものとする。
Fig. 1 is a perspective view showing an electronic component mounted on a printed wiring board for explaining an embodiment of this invention, Fig. 2 is a partial sectional view thereof, and Fig. 3 is a conventional printed wiring board with electronic components mounted on it. A perspective view showing the state in which the
FIG. 4 is a partial cross-sectional view. 1 is a printed wiring board, 2 is a surface non-penetrating plated hole, 3
4 is an electronic component, 4 is an inner conductor layer, and 5 is an inner wiring layer.
Note that the same reference numerals in each figure indicate the same or corresponding parts.
Claims (1)
挿入穴を備え、この挿入穴に上記電子部品のピン
を挿入しハンダ付けして上記電子部品を実装する
印刷配線板において、 上記印刷配線板本体を多層板で構成して其の内
層に各種配線層を施す手段と、上記挿入穴を非貫
通穴とする手段とを有し、 上記各種配線層のうち少なくとも一層以上の配
線層と非接触状態に配置されるように上記非貫通
穴の深さを決定することを特徴とする印刷配線板
。[Scope of Claim for Utility Model Registration] Printed wiring that includes a printed wiring board main body and an insertion hole into which the pin of an electronic component is inserted, and in which the pin of the electronic component is inserted into the insertion hole and soldered to mount the electronic component. The board includes means for forming the printed wiring board main body as a multilayer board and applying various wiring layers to the inner layer thereof, and means for making the insertion hole a non-through hole, and at least one layer of the various wiring layers. A printed wiring board characterized in that the depth of the non-through hole is determined so as to be arranged in a non-contact state with the wiring layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987165803U JPH0170377U (en) | 1987-10-29 | 1987-10-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987165803U JPH0170377U (en) | 1987-10-29 | 1987-10-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0170377U true JPH0170377U (en) | 1989-05-10 |
Family
ID=31452622
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987165803U Pending JPH0170377U (en) | 1987-10-29 | 1987-10-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0170377U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05275841A (en) * | 1992-03-30 | 1993-10-22 | Nec Corp | Multilayer printed board |
-
1987
- 1987-10-29 JP JP1987165803U patent/JPH0170377U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05275841A (en) * | 1992-03-30 | 1993-10-22 | Nec Corp | Multilayer printed board |