JPH0366U - - Google Patents

Info

Publication number
JPH0366U
JPH0366U JP5748389U JP5748389U JPH0366U JP H0366 U JPH0366 U JP H0366U JP 5748389 U JP5748389 U JP 5748389U JP 5748389 U JP5748389 U JP 5748389U JP H0366 U JPH0366 U JP H0366U
Authority
JP
Japan
Prior art keywords
hole
terminal
frequency component
wiring board
printed wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5748389U
Other languages
Japanese (ja)
Other versions
JPH0720943Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989057483U priority Critical patent/JPH0720943Y2/en
Publication of JPH0366U publication Critical patent/JPH0366U/ja
Application granted granted Critical
Publication of JPH0720943Y2 publication Critical patent/JPH0720943Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の一実施例を説明する断面図で
あり、第２図は従来例を説明する断面図である。 １Ａ……多層プリント配線板、４ａ……導体層
、５……高周波部品、８……端子、９……半田、
１２……貫通孔、１３……内壁面。 FIG. 1 is a sectional view illustrating an embodiment of the present invention, and FIG. 2 is a sectional view illustrating a conventional example. 1A...multilayer printed wiring board, 4a...conductor layer, 5...high frequency component, 8...terminal, 9...solder,
12...Through hole, 13...Inner wall surface.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 高周波部品の端子が挿入される貫通孔を有する
多層プリント配線板において、前記端子が半田付
けされる導体層は前記貫通孔の内壁面を除いた部
分であつて前記高周波部品が実装される面とは反
対側の面における前記貫通孔の近傍に設けられて
いることを特徴とする多層プリント配線板。 In a multilayer printed wiring board having a through-hole into which a terminal of a high-frequency component is inserted, the conductor layer to which the terminal is soldered is a portion of the through-hole excluding the inner wall surface, and the surface on which the high-frequency component is mounted. is provided near the through hole on the opposite surface.
JP1989057483U 1989-05-18 1989-05-18 Multilayer printed wiring board Expired - Lifetime JPH0720943Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989057483U JPH0720943Y2 (en) 1989-05-18 1989-05-18 Multilayer printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989057483U JPH0720943Y2 (en) 1989-05-18 1989-05-18 Multilayer printed wiring board

Publications (2)

Publication Number Publication Date
JPH0366U true JPH0366U (en) 1991-01-07
JPH0720943Y2 JPH0720943Y2 (en) 1995-05-15

Family

ID=31582230

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989057483U Expired - Lifetime JPH0720943Y2 (en) 1989-05-18 1989-05-18 Multilayer printed wiring board

Country Status (1)

Country Link
JP (1) JPH0720943Y2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003283093A (en) * 2002-03-22 2003-10-03 Mitsubishi Electric Corp Multilayer printed wiring board
JP2006337159A (en) * 2005-06-01 2006-12-14 Nippon Eng Kk Printed wiring board and semiconductor testing device
KR101270268B1 (en) * 2011-06-07 2013-06-04 대한민국 Foot support
JP2018085244A (en) * 2016-11-24 2018-05-31 日本航空電子工業株式会社 Coaxial connector and connector assembly

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59191765U (en) * 1983-06-06 1984-12-19 株式会社日立製作所 Wet multilayer ceramic substrate
JPS59191764U (en) * 1983-06-06 1984-12-19 株式会社日立製作所 Wet multilayer ceramic substrate
JPS6073270U (en) * 1983-10-25 1985-05-23 デイエツクスアンテナ株式会社 Mounting structure of high frequency IC on printed circuit board
JPS6265868U (en) * 1985-10-15 1987-04-23

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59191765U (en) * 1983-06-06 1984-12-19 株式会社日立製作所 Wet multilayer ceramic substrate
JPS59191764U (en) * 1983-06-06 1984-12-19 株式会社日立製作所 Wet multilayer ceramic substrate
JPS6073270U (en) * 1983-10-25 1985-05-23 デイエツクスアンテナ株式会社 Mounting structure of high frequency IC on printed circuit board
JPS6265868U (en) * 1985-10-15 1987-04-23

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003283093A (en) * 2002-03-22 2003-10-03 Mitsubishi Electric Corp Multilayer printed wiring board
JP2006337159A (en) * 2005-06-01 2006-12-14 Nippon Eng Kk Printed wiring board and semiconductor testing device
KR101270268B1 (en) * 2011-06-07 2013-06-04 대한민국 Foot support
JP2018085244A (en) * 2016-11-24 2018-05-31 日本航空電子工業株式会社 Coaxial connector and connector assembly

Also Published As

Publication number Publication date
JPH0720943Y2 (en) 1995-05-15

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