JPH0171444U - - Google Patents
Info
- Publication number
- JPH0171444U JPH0171444U JP1987165373U JP16537387U JPH0171444U JP H0171444 U JPH0171444 U JP H0171444U JP 1987165373 U JP1987165373 U JP 1987165373U JP 16537387 U JP16537387 U JP 16537387U JP H0171444 U JPH0171444 U JP H0171444U
- Authority
- JP
- Japan
- Prior art keywords
- wire
- amount control
- control device
- bonding
- feeding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H10W72/07141—Means for applying energy, e.g. ovens or lasers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H10W72/07168—Means for storing or moving the material for the connector
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
Landscapes
- Wire Bonding (AREA)
Description
第１図は本考案の実施例の正面図、第２図は従
来例の正面図である。 １……スプール、２……モータ、３……ボンデ
イングヘツド、４……クランプ、５……ボンデイ
ングツール、６……ボンデイングアーム、７……
ガイド、８……繰り出し量制御装置、９……エア
吹き出し口、１０……センサ、１１……センサ、
１２……ハーフクランプ、１３……摩擦装置、１
３Ａ，１３Ｂ……ガイド片、１４……張力付与装
置。
来例の正面図である。 １……スプール、２……モータ、３……ボンデ
イングヘツド、４……クランプ、５……ボンデイ
ングツール、６……ボンデイングアーム、７……
ガイド、８……繰り出し量制御装置、９……エア
吹き出し口、１０……センサ、１１……センサ、
１２……ハーフクランプ、１３……摩擦装置、１
３Ａ，１３Ｂ……ガイド片、１４……張力付与装
置。
Claims (1)
- エアをワイヤに吹きつけた際の撓み量に応じて
ワイヤの繰り出し量を制御する繰り出し量制御装
置を備えたワイヤボンデイング装置におけるワイ
ヤ供給装置において、前記繰り出し量制御装置と
ボンデイングツールとの間のワイヤにエアを吹き
つけてワイヤに張力を与える張力付与装置を設け
、該張力付与装置と前記繰り出し量制御装置との
間のワイヤに摩擦抵抗を与える摩擦装置を設けた
ことを特徴とするワイヤボンデイング装置におけ
るワイヤ供給装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987165373U JPH0521879Y2 (ja) | 1987-10-30 | 1987-10-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987165373U JPH0521879Y2 (ja) | 1987-10-30 | 1987-10-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0171444U true JPH0171444U (ja) | 1989-05-12 |
| JPH0521879Y2 JPH0521879Y2 (ja) | 1993-06-04 |
Family
ID=31451802
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987165373U Expired - Lifetime JPH0521879Y2 (ja) | 1987-10-30 | 1987-10-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0521879Y2 (ja) |
-
1987
- 1987-10-30 JP JP1987165373U patent/JPH0521879Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0521879Y2 (ja) | 1993-06-04 |