JPH0474429U - - Google Patents
Info
- Publication number
- JPH0474429U JPH0474429U JP1990116819U JP11681990U JPH0474429U JP H0474429 U JPH0474429 U JP H0474429U JP 1990116819 U JP1990116819 U JP 1990116819U JP 11681990 U JP11681990 U JP 11681990U JP H0474429 U JPH0474429 U JP H0474429U
- Authority
- JP
- Japan
- Prior art keywords
- wire
- block
- cylindrical hole
- tension mechanism
- tension
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H10W72/07141—Means for applying energy, e.g. ovens or lasers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H10W72/07168—Means for storing or moving the material for the connector
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
Landscapes
- Wire Bonding (AREA)
Description
第１図は本考案の実施例１の概略図、第２図は
実施例２の概略図、第３図は従来のワイヤテンシ
ヨン機構の概略図である。 １……ワイヤ、２……スプール、３……ワイヤ
ガイド、４……ボンデイングツール、５……ノズ
ル、６……円筒穴、７……空気穴、８……ブロツ
ク。
実施例２の概略図、第３図は従来のワイヤテンシ
ヨン機構の概略図である。 １……ワイヤ、２……スプール、３……ワイヤ
ガイド、４……ボンデイングツール、５……ノズ
ル、６……円筒穴、７……空気穴、８……ブロツ
ク。
Claims (1)
- ワイヤボンデイング装置におけるワイヤテンシ
ヨン機構において、ワイヤスプールからボンデイ
ングツールまでのワイヤ経路の途中に、ワイヤ軸
に沿つて同芯となる円筒穴を有するブロツクを位
置させ、このブロツクに複数の空気穴を配置して
円筒穴内に開口させ、ワイヤの繰り出し方向と逆
方向に気流を生ぜしめてワイヤにバツクテンシヨ
ンを与えることを特徴とするワイヤテンシヨン機
構。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990116819U JPH0474429U (ja) | 1990-11-07 | 1990-11-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990116819U JPH0474429U (ja) | 1990-11-07 | 1990-11-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0474429U true JPH0474429U (ja) | 1992-06-30 |
Family
ID=31864659
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990116819U Pending JPH0474429U (ja) | 1990-11-07 | 1990-11-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0474429U (ja) |
-
1990
- 1990-11-07 JP JP1990116819U patent/JPH0474429U/ja active Pending