JPH0171452U - - Google Patents
Info
- Publication number
- JPH0171452U JPH0171452U JP1987166919U JP16691987U JPH0171452U JP H0171452 U JPH0171452 U JP H0171452U JP 1987166919 U JP1987166919 U JP 1987166919U JP 16691987 U JP16691987 U JP 16691987U JP H0171452 U JPH0171452 U JP H0171452U
- Authority
- JP
- Japan
- Prior art keywords
- stacked
- connected circuit
- flat semiconductor
- cooling bodies
- flat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 238000001816 cooling Methods 0.000 claims description 3
Landscapes
- Die Bonding (AREA)
Description
第１図はこの考案の一実施例による半導体スタ
ツクを示す正面図、第２図は同側面図、第３図は
同要部を拡大して示す平面図、第４図は第３図の
断面図、第５図は従来の半導体スタツクを示す正
面図、第６図は第５図の側面図である。
１は冷却体、１ａは電極部、２は平型半導体素
子、２ａはアノード部、２ｂはカソード部、３は
加圧装置、１３は電極ターミナルである。なお、
図中、同一符号は同一、又は相当部分を示す。
FIG. 1 is a front view showing a semiconductor stack according to an embodiment of the invention, FIG. 2 is a side view of the same, FIG. 3 is an enlarged plan view of the same essential parts, and FIG. 4 is a cross-section of FIG. 3. 5 is a front view showing a conventional semiconductor stack, and FIG. 6 is a side view of FIG. 5. 1 is a cooling body, 1a is an electrode part, 2 is a flat semiconductor element, 2a is an anode part, 2b is a cathode part, 3 is a pressurizing device, and 13 is an electrode terminal. In addition,
In the figures, the same reference numerals indicate the same or corresponding parts.
Claims (1)
体を介して積層され、被接続回路に接続される複
数の平型半導体素子と、前記複数の冷却体及び前
記複数の平型半導体素子を積層方向に加圧する加
圧装置とを備えた半導体スタツクにおいて、前記
平型半導体素子のアノード部及びカソード部に固
着されると共に前記被接続回路に接続され、該被
接続回路のインダクタンスを低減させる電極ター
ミナルを有することを特徴とする半導体スタツク
。 A plurality of flat semiconductor elements are stacked through a plurality of cooling bodies having horizontally protruding electrode portions and are connected to a connected circuit, and the plurality of cooling bodies and the plurality of flat semiconductor elements are stacked in a stacking direction. In the semiconductor stack, an electrode terminal is fixed to the anode portion and the cathode portion of the flat semiconductor element and connected to the connected circuit to reduce the inductance of the connected circuit. A semiconductor stack comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16691987U JPH0610697Y2 (en) | 1987-10-30 | 1987-10-30 | Semiconductor stack |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16691987U JPH0610697Y2 (en) | 1987-10-30 | 1987-10-30 | Semiconductor stack |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0171452U true JPH0171452U (en) | 1989-05-12 |
| JPH0610697Y2 JPH0610697Y2 (en) | 1994-03-16 |
Family
ID=31454739
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16691987U Expired - Lifetime JPH0610697Y2 (en) | 1987-10-30 | 1987-10-30 | Semiconductor stack |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0610697Y2 (en) |
-
1987
- 1987-10-30 JP JP16691987U patent/JPH0610697Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0610697Y2 (en) | 1994-03-16 |