JPH0610697Y2 - Semiconductor stack - Google Patents

Description

[Detailed Description of the Invention] [Industrial field of application] The present invention relates to a semiconductor stack configured by combining a flat semiconductor element and a cooling body and connected to a connected circuit such as a snubber circuit. .

[Conventional technology]

FIG. 5 is a front view showing a conventional semiconductor stack disclosed in, for example, Japanese Patent Application Laid-Open No. 59-145558, and FIG. 6 is a side view of FIG. In the figure, reference numeral 1 is a plurality of cooling bodies having electrode portions 1a protruding in the horizontal direction, 2 is a plurality of flat semiconductor elements arranged between the plurality of cooling bodies 1, and electrodes on the anode side and the cathode side are electrodes. It is electrically connected to the portion 1a. 3 is a plurality of cooling bodies 1 and a plurality of flat semiconductor elements 2
Is a pressurizing device for pressurizing in the stacking direction. It is configured.

Next, the operation will be described. The cooling body 1 and the flat semiconductor element 2 are stacked in a state of being pressed by the pressure bolt 7 via the steel ball 8 and the insulating spacer 9. When connecting to a circuit to be connected such as a snubber circuit, the lead wire terminal extending from the snubber circuit is mounted in the mounting hole 1b for connection provided in the electrode portion 1a.

When the flat semiconductor element 2 is taken out of the above semiconductor stack, the flat bolt semiconductor element 2 is pulled out in the horizontal direction while loosening the pressure bolt 7 and pushing the upper and lower cooling bodies 1 apart. Was there.

[Problems to be solved by the invention]

Since the conventional semiconductor stack is configured as described above, it has the following problems. That is, it is desirable to keep the inductance of the circuit to be connected such as a snubber circuit as small as possible. The length of this inductance and the passage path of the snubber current, that is, the size of the cooling body 1 and the size of the current loop based on the structure. It is determined by However, it is impossible to reduce the size of the cooling body 1 so much because it is necessary to secure the cooling capacity of the cooling body 1 above a certain level. Therefore, there is a problem that the inductance of the snubber circuit cannot be sufficiently reduced.

In addition, when the flat semiconductor element 2 is taken out, it is necessary to insert a hand into the gap between the upper and lower cooling bodies 1, which poses a problem that a worker may be caught.

The present invention has been made to solve the above problems, and can reduce the inductance of a connected circuit such as a snubber circuit regardless of the size and structure of the cooling body 1. Even when the flat semiconductor element 2 is taken out, it is an object to obtain a semiconductor stack that does not have a risk of being caught in the hand.

[Means for solving problems]

The semiconductor stack according to the present invention comprises a pair of terminal plates fixed to the anode part and the cathode part of a flat semiconductor device and having a connection terminal of a circuit to be connected at an end thereof, and a space between the approaching bent parts of the pair of terminal plates. And an insulating plate that is held between the pair of terminal plates and insulates the pair of terminal plates from each other. The insulating plate is formed to have a size that projects laterally from the pair of terminal plates.

[Action]

The flat type semiconductor device in this invention can be easily taken out by grasping and pulling the insulator projecting to the side of the pair of terminal plates, and at the time of this taking out work, it is not necessary to put a hand between the cooling bodies. Therefore, there is little danger that the hand will be caught in the cooling body.

[Example of device]

An embodiment of the present invention will be described below with reference to the drawings. First
In FIG. 2 and FIG. 2, 13 is an electrode terminal fixed to the anode part and the cathode part of the flat semiconductor element 2 and connected to a connected circuit such as a snubber circuit, and 14 is attached to the electrode terminal 13. It is an insulating plate.

3 and 4 show the electrode terminal 13
3A and 3B are a plan view and a side view showing in detail the attached state of the electrode terminal 13 and the anode terminal 2 of the flat semiconductor element 2.
It is composed of a pair of terminal plates 15 and 16 which are respectively fixed to a and the cathode portion 2b. Insulation plate 14
Are fixed near the tips of the terminal plates 15 and 16 in an integrated state by adhesion or molding. In addition, the rising portion 1 at the tip of the terminal plates 15 and 16
5a and 16a are provided with mounting holes 15b and 16b for mounting the lead wire terminals of the snubber circuit with screw members.

Next, the operation will be described. When the lead wire terminals of the snubber circuit are connected to the rising portions 15a, 16a, the anode portion 2a, the terminal plate 15, the snubber circuit, the terminal plate 1
6. A snubber current loop is formed in the path of the cathode portion 2b. At this time, the anode portion 2a and the cathode portion 2b
The distance between the mounting holes 15a and 16b and the anode part 2
It is sufficiently shorter than the distance between a and the cathode portion 2b and the mounting hole 1b of the cooling body 1. Therefore,
Compared with the case where a snubber circuit is connected to the electrode portion 1a of the cooling body 1, the inductance of the snubber circuit is greatly reduced.

When the flat semiconductor element 2 is taken out, it can be easily removed by loosening the pressure bolt 7 and pulling the insulating plate 14 to the front side. At this time, since the position where the worker rejects the insulating plate 14 is sufficiently before the flat semiconductor element 2, there is no risk that the worker is caught in the cooling body 1.

[Effect of device]

As described above, according to the present invention, a pair of terminal plates fixed to the anode part and the cathode part of the flat semiconductor device and having the connection terminals of the circuit to be connected at their ends, and the pair of terminal plates approaching each other. Since the insulating plate is sandwiched between the bent portions and configured to insulate the pair of terminal plates from each other, and the insulating plate is formed to have a size projecting to the side of the pair of terminal plates, the flat semiconductor element can be taken out. When working,
It can be easily taken out by grasping and pulling the insulating plate 14 protruding laterally of the pair of terminal plates without putting a hand between the cooling bodies. As a result, it is possible to obtain an effect that there is little danger that the hand is caught in the cooling body.

[Brief description of drawings]

FIG. 1 is a front view showing a semiconductor stack according to an embodiment of the present invention, FIG. 2 is a side view of the same, FIG. 3 is an enlarged plan view showing the same part, and FIG. FIG. 5 is a front view showing a conventional semiconductor stack, and FIG. 6 is a side view of FIG. 1 is a cooling body, 1a is an electrode part, 2 is a flat semiconductor element, 2a
Is an anode part, 2b is a cathode part, 3 is a pressure device, 13
Is an electrode terminal. In the drawings, the same reference numerals indicate the same or corresponding parts.

Claims (1)

[Scope of utility model registration request] 1. A plurality of flat semiconductor elements, which are stacked via a plurality of cooling bodies each having an electrode portion protruding in the horizontal direction and are connected to a circuit to be connected, the plurality of cooling bodies and the plurality of flat molds. In a semiconductor stack including a pressing device that presses the semiconductor element in a stacking direction, a pair of terminal plates fixed to the anode portion and the cathode portion of the flat semiconductor element and having a connection terminal of a connected circuit at an end portion, An insulating plate sandwiched between the approaching bent portions of the pair of terminal plates to insulate the pair of terminal plates from each other;
A semiconductor stack, characterized in that it is formed in such a size that it projects laterally from the pair of terminal plates.