JPH0171473U - - Google Patents
Info
- Publication number
- JPH0171473U JPH0171473U JP1987167634U JP16763487U JPH0171473U JP H0171473 U JPH0171473 U JP H0171473U JP 1987167634 U JP1987167634 U JP 1987167634U JP 16763487 U JP16763487 U JP 16763487U JP H0171473 U JPH0171473 U JP H0171473U
- Authority
- JP
- Japan
- Prior art keywords
- patterns
- soldered
- component
- terminals
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 4
- 230000017525 heat dissipation Effects 0.000 claims description 2
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structure Of Printed Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案の実施例におけるプリント配線
基板の部分平面図、第２図は本考案の実施例にお
けるプリント配線基板に多足性部品が半田付され
る状態を示す斜面図である。
図中、１５，１９は放熱用パターン、２１は使
用端子半田付用パターン、２３，２５は非使用端
子半田付用パターン、３１はフラツトパツケージ
、３５は使用端子、３３，３７は非使用端子、４
１はレーザ光である。
FIG. 1 is a partial plan view of a printed wiring board according to an embodiment of the present invention, and FIG. 2 is a perspective view showing a state in which a multipod component is soldered to a printed wiring board according to an embodiment of the present invention. In the figure, 15 and 19 are heat dissipation patterns, 21 is a used terminal soldering pattern, 23 and 25 are unused terminal soldering patterns, 31 is a flat package, 35 is a used terminal, and 33 and 37 are unused terminals. , 4
1 is a laser beam.
Claims (1)
、熱等４１の照射により半田付される半田付用パ
ターン２１，２３，２５を備えたプリント基板に
おいて、 前記多足性部品３１の端子３５，３３，３７中
電気回路を構成しない非使用端子３３，３７が半
田付される半田付用パターン２３，２５に放熱用
パターン１５，１９を延設したことを特徴とする
プリント配線基板。[Claims for Utility Model Registration] A printed circuit board equipped with soldering patterns 21, 23, 25 in which each terminal 35, 33, 37 of a multipod component 31 is soldered by irradiation with light, heat, etc. 41, The heat dissipation patterns 15, 19 are extended to the soldering patterns 23, 25 to which unused terminals 33, 37 that do not constitute an electric circuit are soldered among the terminals 35, 33, 37 of the multi-legged component 31. Features printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987167634U JPH0171473U (en) | 1987-10-30 | 1987-10-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987167634U JPH0171473U (en) | 1987-10-30 | 1987-10-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0171473U true JPH0171473U (en) | 1989-05-12 |
Family
ID=31456106
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987167634U Pending JPH0171473U (en) | 1987-10-30 | 1987-10-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0171473U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0425270U (en) * | 1990-06-21 | 1992-02-28 | ||
| JP2013069390A (en) * | 2011-09-26 | 2013-04-18 | Dainippon Printing Co Ltd | Suspension substrate, suspension, suspension with head, and hard disk drive |
-
1987
- 1987-10-30 JP JP1987167634U patent/JPH0171473U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0425270U (en) * | 1990-06-21 | 1992-02-28 | ||
| JP2013069390A (en) * | 2011-09-26 | 2013-04-18 | Dainippon Printing Co Ltd | Suspension substrate, suspension, suspension with head, and hard disk drive |