JPH0425270U - - Google Patents

Info

Publication number
JPH0425270U
JPH0425270U JP6570290U JP6570290U JPH0425270U JP H0425270 U JPH0425270 U JP H0425270U JP 6570290 U JP6570290 U JP 6570290U JP 6570290 U JP6570290 U JP 6570290U JP H0425270 U JPH0425270 U JP H0425270U
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
soldering
laser
protective film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6570290U
Other languages
Japanese (ja)
Other versions
JP2503584Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990065702U priority Critical patent/JP2503584Y2/en
Publication of JPH0425270U publication Critical patent/JPH0425270U/ja
Application granted granted Critical
Publication of JP2503584Y2 publication Critical patent/JP2503584Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の一実施例を示す正面図、第２
図は従来のプリント基板の焼損の一例を示す正面
図である。 １，３１……プリント基板、２，３，３２，３
３……はんだ付けパターン、４……焼損防止用パ
ターン、５……クリームはんだ、１１，２１……
部品、１２，１３，２２，２３……固定用リード
線。 Figure 1 is a front view showing one embodiment of the present invention;
The figure is a front view showing an example of burnout of a conventional printed circuit board. 1, 31...Printed circuit board, 2, 3, 32, 3
3... Soldering pattern, 4... Burnout prevention pattern, 5... Cream solder, 11, 21...
Parts, 12, 13, 22, 23...Fixing lead wire.

Claims (1)

【実用新案登録請求の範囲】 １ プリント基板面に設けられたはんだ付けパタ
ーン上に部品のリード線を載せレーザ光を照射し
てリフローはんだ付けを行うレーザはんだ付け用
プリント基板において、前記はんだ付けパターン
に隣接する前記プリント基板面に前記レーザ光照
射による熱を吸収放散する保護膜を設けてなるこ
とを特徴とするレーザはんだ付け用プリント基板
。 ２ 前記保護膜は、銅箔で形成してなることを特
徴とする請求項１記載のレーザはんだ付け用プリ
ント基板。[Claims for Utility Model Registration] 1. A printed circuit board for laser soldering in which lead wires of components are placed on a soldering pattern provided on the surface of the printed circuit board and reflow soldering is performed by irradiating the soldering pattern with a laser beam. A printed circuit board for laser soldering, characterized in that a protective film for absorbing and dissipating heat generated by the laser beam irradiation is provided on a surface of the printed circuit board adjacent to the printed circuit board. 2. The printed circuit board for laser soldering according to claim 1, wherein the protective film is formed of copper foil.
JP1990065702U 1990-06-21 1990-06-21 Printed circuit board for laser soldering Expired - Lifetime JP2503584Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990065702U JP2503584Y2 (en) 1990-06-21 1990-06-21 Printed circuit board for laser soldering

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990065702U JP2503584Y2 (en) 1990-06-21 1990-06-21 Printed circuit board for laser soldering

Publications (2)

Publication Number Publication Date
JPH0425270U true JPH0425270U (en) 1992-02-28
JP2503584Y2 JP2503584Y2 (en) 1996-07-03

Family

ID=31597765

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990065702U Expired - Lifetime JP2503584Y2 (en) 1990-06-21 1990-06-21 Printed circuit board for laser soldering

Country Status (1)

Country Link
JP (1) JP2503584Y2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007061860A (en) * 2005-08-31 2007-03-15 Fujifilm Corp Laser soldering method and laser soldering apparatus

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4624086A1 (en) 2022-11-24 2025-10-01 Furukawa Electric Co., Ltd. Joining method and laser processing device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5849472U (en) * 1981-09-29 1983-04-04 株式会社東芝 printed wiring board
JPH0171473U (en) * 1987-10-30 1989-05-12
JPH01280393A (en) * 1988-03-03 1989-11-10 Nec Corp Structure for preventing burning of resist film of printed wiring board
JPH0265475U (en) * 1988-11-02 1990-05-17

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5849472U (en) * 1981-09-29 1983-04-04 株式会社東芝 printed wiring board
JPH0171473U (en) * 1987-10-30 1989-05-12
JPH01280393A (en) * 1988-03-03 1989-11-10 Nec Corp Structure for preventing burning of resist film of printed wiring board
JPH0265475U (en) * 1988-11-02 1990-05-17

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007061860A (en) * 2005-08-31 2007-03-15 Fujifilm Corp Laser soldering method and laser soldering apparatus

Also Published As

Publication number Publication date
JP2503584Y2 (en) 1996-07-03

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