JPH0176040U - - Google Patents
Info
- Publication number
- JPH0176040U JPH0176040U JP1987171832U JP17183287U JPH0176040U JP H0176040 U JPH0176040 U JP H0176040U JP 1987171832 U JP1987171832 U JP 1987171832U JP 17183287 U JP17183287 U JP 17183287U JP H0176040 U JPH0176040 U JP H0176040U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- pellet
- semiconductor device
- mounting part
- sealed semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Die Bonding (AREA)
Description
第１図は本考案により製造された半導体装置の
断面図であり、第２図は従来の半導体装置の断面
図である。第３図は本考案による実施例２の断面
図である。
１…ボンデイングワイヤー、２…封止樹脂、３
…リードフレーム、４…ペレツト、５…絶縁性物
質でできたペレツト搭載部、６…ペレツト搭載部
の凹部、７…ペレツト、８…ボンデイングワイヤ
ー、９…封止樹脂、１０…リードフレーム、１１
…ペレツト搭載部（導伝性物質）、１２…ペレツ
ト、１３…ボンデイングワイヤー、１４…封止樹
脂、１５…リードフレーム、１６…絶縁性物質で
できたペレツト搭載部、１７…ペレツト搭載部突
起部。
FIG. 1 is a sectional view of a semiconductor device manufactured according to the present invention, and FIG. 2 is a sectional view of a conventional semiconductor device. FIG. 3 is a sectional view of a second embodiment of the present invention. 1... Bonding wire, 2... Sealing resin, 3
... Lead frame, 4... Pellet, 5... Pellet mounting part made of insulating material, 6... Recessed part of pellet mounting part, 7... Pellet, 8... Bonding wire, 9... Sealing resin, 10... Lead frame, 11
...Pellet mounting part (conductive material), 12...Pellet, 13...Bonding wire, 14...Sealing resin, 15...Lead frame, 16...Pellet mounting part made of insulating material, 17...Protrusion of pellet mounting part .
Claims (1)
を有しないリードフレームを用いて、ペレツト搭
載部が樹脂とは異なる絶縁性物質で形成され、且
つペレツト搭載部の一部が凹状になつており、そ
の凹部にペレツトを搭載されていることを特徴と
する樹脂封止型半導体装置。 In a resin-sealed semiconductor device, a lead frame without a pellet mounting part is used, and the pellet mounting part is formed of an insulating material different from resin, and a part of the pellet mounting part is recessed, and the recessed part A resin-sealed semiconductor device characterized in that a pellet is mounted on the resin-sealed semiconductor device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987171832U JPH0176040U (en) | 1987-11-09 | 1987-11-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987171832U JPH0176040U (en) | 1987-11-09 | 1987-11-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0176040U true JPH0176040U (en) | 1989-05-23 |
Family
ID=31463837
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987171832U Pending JPH0176040U (en) | 1987-11-09 | 1987-11-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0176040U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE112017002421T5 (en) | 2016-05-12 | 2019-01-24 | Mitsubishi Electric Corporation | SEMICONDUCTOR UNIT AND METHOD FOR PRODUCING A SEMICONDUCTOR UNIT |
-
1987
- 1987-11-09 JP JP1987171832U patent/JPH0176040U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE112017002421T5 (en) | 2016-05-12 | 2019-01-24 | Mitsubishi Electric Corporation | SEMICONDUCTOR UNIT AND METHOD FOR PRODUCING A SEMICONDUCTOR UNIT |
| US10741413B2 (en) | 2016-05-12 | 2020-08-11 | Mitsubishi Electric Corporation | Semiconductor device and method for manufacturing semiconductor device |